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公开(公告)号：US20140140012A1
公开(公告)日：2014-05-22
申请号：US13790743
申请日：2013-03-08
发明人： Wen-Hsien WANG , Min-Tsung KUAN , Tzong-Ming LEE , Wen-Hsien CHOU , Fu-Ming LIN , Wen-Kuei LEE , Chin Zeng YEH , Ming-Hung CHEN
IPC分类号： H05K5/02
CPC分类号： H01L31/049 , Y02E10/50
摘要： Disclosed is a module structure including a front sheet, a back sheet, and an optotronic device disposed between the front sheet and the back sheet. A first encapsulate layer is disposed between the optotronic device and the front sheet. A second encapsulate layer is disposed between the optotronic device and the back sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the second encapsulate layer and the polyolefin layer.
摘要翻译： 公开了一种模块结构，其包括前片，背片和设置在前片与背片之间的光电装置。 第一封装层设置在光电装置和前片之间。 第二封装层设置在光电子装置和背板之间。 背板是氢化苯乙烯弹性体树脂层和聚烯烃层的层叠结构，其中氢化苯乙烯弹性体树脂层设置在第二包封层和聚烯烃层之间。
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公开(公告)号：US20140138734A1
公开(公告)日：2014-05-22
申请号：US14017678
申请日：2013-09-04
发明人： Wen-Hsien WANG , Min-Tsung KUAN , Tzong-Ming LEE , Wen-Hsien CHOU , Fu-Ming LIN , Wen-Kuei LEE , Chin Zeng YEH , Ming-Hung CHEN , Chung-Teng HUANG , Hsueh Jen FU
IPC分类号： H01L33/56 , H01L31/0203
CPC分类号： H01L33/56 , B32B27/08 , B32B27/302 , B32B27/306 , B32B27/32 , B32B2250/24 , B32B2307/558 , B32B2457/00 , B32B2457/202 , C08L2203/204 , C09D123/02 , C09D123/0853 , H01L31/0481 , H01L31/049 , H01L51/524 , H01L51/5253 , Y02E10/50
摘要： Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.
摘要翻译： 公开了一种模块结构，其包括前片，背片和设置在前片与后片之间的光电器件。 第一包装层设置在光电器件和前片之间。 背板是氢化苯乙烯弹性体树脂层和聚烯烃层的层叠结构，其中氢化苯乙烯弹性体树脂层设置在光电子器件和聚烯烃层之间。
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公开(公告)号：US09412921B2
公开(公告)日：2016-08-09
申请号：US14017678
申请日：2013-09-04
发明人： Wen-Hsien Wang , Min-Tsung Kuan , Tzong-Ming Lee , Wen-Hsien Chou , Fu-Ming Lin , Wen-Kuei Lee , Chin Zeng Yeh , Ming-Hung Chen , Chung-Teng Huang , Hsueh Jen Fu
IPC分类号： H01L33/56 , H01L31/0203 , H01L51/52 , B32B27/32 , H01L31/048 , H01L31/049 , C09D123/02 , C09D123/08 , B32B27/08 , B32B27/30
CPC分类号： H01L33/56 , B32B27/08 , B32B27/302 , B32B27/306 , B32B27/32 , B32B2250/24 , B32B2307/558 , B32B2457/00 , B32B2457/202 , C08L2203/204 , C09D123/02 , C09D123/0853 , H01L31/0481 , H01L31/049 , H01L51/524 , H01L51/5253 , Y02E10/50
摘要： Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.
摘要翻译： 公开了一种模块结构，其包括前片，背片和设置在前片与后片之间的光电器件。 第一包装层设置在光电器件和前片之间。 背板是氢化苯乙烯弹性体树脂层和聚烯烃层的层叠结构，其中氢化苯乙烯弹性体树脂层设置在光电子器件和聚烯烃层之间。
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