摘要:
Shorting between a transistor gate electrode and associated source/drain regions due to metal silicide formation on the sidewall spacers is prevented by passivating the sidewall spacer surfaces with a mixture of ozone and water. Embodiments of the invention include spraying the wafer with or immersing the wafer in, a saturated solution of ozone in water.
摘要:
A high K layer, such as aluminum oxide or hafnium oxide, may be formed with a deposition process that uses an ion implantation to damage portions of the high K material that are to be later etched. More particularly, in one implementation, a semiconductor device is manufactured by forming a first dielectric over a substrate, forming a charge storage element over the first dielectric, forming a second dielectric above the charge storage element, implantation ions into select portions of the second dielectric, and etching the ion implanted select portions of the second dielectric.
摘要:
A method of forming a fully silicidized gate of a semiconductor device includes forming silicide in active regions and a portion of a gate. A shield layer is blanket deposited over the device. The top surface of the gate electrode is then exposed. A refractory metal layer is deposited and annealing is performed to cause the metal to react with the gate and fully silicidize the gate, with the shield layer protecting the active regions of the device from further silicidization to thereby prevent spiking and current leakage in the active regions.
摘要:
A method for implementing a self-aligned low temperature metal silicide gate is achieved by confining amorphous silicon within a recess overlying a channel and annealing to cause the amorphous silicon with its overlying low temperature silicidation metal to interact to form the self-aligned low temperature metal silicide gate. A precursor having a temporary gate is used to form the self-aligned low temperature silicide gate. The remaining portions of the low temperature silicidation metal is removed by manipulating the etch selectivity between the low temperature silicidation metal and the self-aligned low temperature metal silicide gate.
摘要:
Bridging between nickel silicide layers on a gate electrode and associated source/drain regions along silicon nitride sidewall spacers is prevented by hydrogen passivation of the exposed surfaces of the silicon nitride sidewall spacers. Embodiments include treating the silicon nitride sidewall spacers with a solution of HF and H2O, at a HF:H2O volume ratio of about 100:1 to about 200:1 for up to about 60 seconds at room temperature. Hydrogen passivation reduces the number of silicon dangling bonds, thereby avoiding reaction with subsequently deposited nickel and, hence, avoiding the formation of a bridging film of nickel silicide on the sidewall spacers.
摘要:
Methods for selling items over a computer network can include: after a first set of customers has purchased, during a first time period, at least a threshold value or number of items of a first set of items: (a) during a second time period after the first period, offering for sale to the first set of customers an index set of items; (b) throughout the second period, preventing substantially all persons other than the first set of customers from purchasing the index set of items; and (c) during a third time period, offering for sale to a second set of customers, different from the first set of customers, any of the index set of items not sold to the first set of customers during the second period.
摘要:
A method for implementing a self-aligned metal silicide gate is achieved by confining amorphous silicon within a recess overlying a channel and annealing to cause the amorphous silicon with its overlying metal to interact to form the self-aligned metal silicide gate. A gate dielectric layer formed of oxynitride or a nitride/oxide stack is formed on the bottom and sidewalls of the recess prior to depositing the silicon. The silicon is removed except for the portion of the silicon in the recess. The remaining portions of the metal are removed by manipulating the etch selectivity between the metal and the self-aligned metal silicide gate.
摘要:
A method for implementing a self-aligned low temperature metal silicide gate is achieved by confining a low temperature silicidation metal within a recess overlying a channel and annealing to cause the low temperature silicidation metal and its overlying silicon to interact to form the self-aligned low temperature metal silicide gate. A planarization step is performed to remove the remaining unreacted silicon by chemical mechanical polishing until no silicon is detected.
摘要:
An adjustable shoulder/lap seat belt adapter in the form of an elongated strap, has fixably mounted on one face thereof a central strip of one of a hook-and-loop type fastener material tape intermediate the ends of the elongated strap. Short length strips of the other of hook-and-loop type fastener tape are affixed to opposite ends of the elongated strap on the same face. Closed loops are formed at the end of the elongated strap about a shoulder strap and a lap strap of a shoulder/lap seat belt securing an occupant to an automotive motor vehicle seat, preventing ride up of the shoulder strap on the torso of the seat occupant, misuse of the shoulder strap, and eliminating the need for constant repetitive readjusting of the shoulder strap position. A swivel-mounted snap clamp affixed to the one face of the adapter elongated strap, clamps to the edge of the shoulder strap with a swivel axis oriented approximately 65.degree. to the center line of the elongated strap.