公开(公告)号：US07433192B2

公开(公告)日：2008-10-07

申请号：US11055712

申请日：2005-02-10

Applicant: Timothy B. Bambridge ,  Juan A. Herbsommer ,  Osvaldo Lopez ,  Joel M. Lott ,  Hugo F. Safar ,  Thomas H. Shilling

Inventor： Timothy B. Bambridge ,  Juan A. Herbsommer ,  Osvaldo Lopez ,  Joel M. Lott ,  Hugo F. Safar ,  Thomas H. Shilling

IPC: H05K7/20

CPC classification number: H05K1/021 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/3436 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An electronic module has a non-conducting substrate having at least one opening and a die/carrier assembly mounted within the opening in the substrate. The assembly has a conducting carrier and one or more integrated circuit (IC) dies mounted to the carrier. The invention may be implemented as an electronic system comprising a circuit board (CB) and at least one such electronic module mounted to the CB.

Abstract translation: 电子模块具有至少一个开口的非导电衬底和安装在衬底的开口内的模具/载体组件。 组件具有导电载体和安装到载体上的一个或多个集成电路（IC）管芯。 本发明可以被实现为包括电路板（CB）和安装到CB的至少一个这样的电子模块的电子系统。

公开(公告)号：US5315156A

公开(公告)日：1994-05-24

申请号：US984221

申请日：1992-11-30

Applicant: Joel M. Lott

Inventor： Joel M. Lott

IPC: H01L29/73 ,  H01L21/331 ,  H01L23/66 ,  H01L23/02 ,  H01L23/12 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L24/49 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2224/05644 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111

Abstract: A modified transistor layout allows operation at high frequencies without adversely effecting transistor power gain. The base and collector circuits are modified in order to minimize ground bar resistance and feedback problems between the input and output circuits. This reduces the applied negative feedback and maximizes gain. The collector contact bar and the output capacitor are mounted directly on the collector island such that the output capacitor is wired directly to the grounded package metal and the collector is wired to the collector contact bar. This eliminates the need to wirebond to areas on the collector island that are covered with the eutectic run-out which results from mounting the transistor chip on the collector island.

Abstract translation: 修改的晶体管布局允许在高频率下操作，而不会不利地影响晶体管功率增益。 基极和集电极电路被修改，以便最小化接地电阻和输入和输出电路之间的反馈问题。 这减少了所施加的负反馈并使增益最大化。 集电极接触棒和输出电容器直接安装在集电极岛上，使得输出电容器直接连接到接地的封装金属，并且集电极连接到集电极接触杆。 这样就不需要引线到集电极岛上的覆盖有由晶体管芯片安装在集电极岛上所产生的共晶漏电的区域。

公开(公告)号：US07215204B2

公开(公告)日：2007-05-08

申请号：US11055711

申请日：2005-02-10

Applicant: Timothy B. Bambridge ,  Juan A. Herbsommer ,  Osvaldo Lopez ,  Joel M. Lott ,  Khanh C. Nguyen

Inventor： Timothy B. Bambridge ,  Juan A. Herbsommer ,  Osvaldo Lopez ,  Joel M. Lott ,  Khanh C. Nguyen

IPC: H03F3/14 ,  H05K1/18

CPC classification number: H01L24/49 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/30111 ,  H03F1/56 ,  H03F3/68 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/3436 ,  H05K2201/10416 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An amplifier module has a substrate, as assembly having one or more integrated circuit (IC) dies mounted to the substrate, and one or more other electronic components mounted to the substrate. The assembly receives an input signal and generates an amplified output signal. The one or more other electronic components perform one or more amplifier-related functions. The amplifier module is adapted to be mounted to a circuit board (CB) as a distinct electronic package. The invention may be implemented as an electronic system having the CB and at least one such amplifier module mounted to the CB.

Abstract translation: 放大器模块具有基板，作为具有安装到基板的一个或多个集成电路（IC）管芯的组件和安装到基板的一个或多个其它电子部件。 组件接收输入信号并产生放大的输出信号。 一个或多个其他电子部件执行一个或多个放大器相关功能。 放大器模块适于作为不同的电子封装安装到电路板（CB）。 本发明可以实现为具有CB和至少一个这样的放大器模块安装到CB的电子系统。

公开(公告)号：US5422595A

公开(公告)日：1995-06-06

申请号：US157614

申请日：1993-11-24

Applicant: Joel M. Lott

Inventor： Joel M. Lott

IPC: G01R21/01 ,  G01R31/28 ,  G01R21/00

CPC classification number: G01R31/2822 ,  G01R21/01

Abstract: According to the present invention, a power amplifier with a plurality of power transistors has detection circuitry corresponding to each power transistor which detects the output power of the power transistors and allows this output power to be monitored and modified if desired. The detection circuitry generates a voltage output signal indicative of the rise and fall times achieved by the power transistor. The voltage output signal of the detection circuitry may be monitored by connecting the voltage output signal to a measuring device, such as an oscilloscope of built-in-test-equipment (BITE). Additionally, the voltage output signal of the detection circuitry may be modified by tuning input matching circuitry and/or output matching circuitry accordingly.

Abstract translation: 根据本发明，具有多个功率晶体管的功率放大器具有与检测功率晶体管的输出功率的每个功率晶体管相对应的检测电路，并且如果需要，允许监视和修改该输出功率。 检测电路产生指示功率晶体管实现的上升和下降时间的电压输出信号。 可以通过将电压输出信号连接到诸如内置测试设备（BITE）的示波器的测量装置来监测检测电路的电压输出信号。 此外，可以通过相应地调整输入匹配电路和/或输出匹配电路来修改检测电路的电压输出信号。