Abstract:
A dual wafer stage exchanging system for a lithographic device is disclosed, said system comprises two wafer stages running between an exposure workstation and a pre-processing workstation, and said two stages are set on a base and suspended above the upper surface of the base by air bearings. Each wafer stages is passed through by a Y-direction guide rail respectively, wherein one end of said guide rail is connected with a main driving unit and another end of said guide rail is detachably coupled with one of the two X-direction auxiliary driving units with single degree of freedom, and said two wafer stages are capable of moving in Y-direction along the guide rails and moving in X-direction under the drive of the auxiliary driving units with single degree of freedom. The position exchange of said two wafer stages can be enabled by the detachment and connection of the Y-direction guide rails and the auxiliary units with single degree of freedom.
Abstract:
Inhibitors that block the DC-SIGN mediated transmission of the HIV-virus from mucosal infection sites to T-lymphocytes. In one embodiment, the inhibitors include at least one oligosaccharide chain attached to a scaffolding framework in which the number of the oligosaccharide chains attached to the scaffold can be 2, 3, 4 or more. In another embodiment, HIV-I viral infection is treated by administration of a composition including a therapeutically effective amount of an oligosaccharide cluster and/or oligosaccharide/protein cluster binding DC-SIGN, to inhibit DC-SIGN from binding to HIV envelope glycoprotein.
Abstract:
A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (13) operating in an exposure workstation (3) and a silicon chip (14) stage operating in a pre-processing workstation (4). The two silicon chip stages (13, 14) are provided on the same base stage (1), and suspended on an upper surface (2) of the base stage by air bearings. The two silicon chip stages (13, 14) can move along guide rails (15, 16) in the Y direction. One end of each guide rail (15, 16) is connected to a main driving unit (11, 12), and the other end of each guide rail (15, 16) is butt-jointed with an X-direction single-freedom auxiliary driving unit (7, 8). The silicon chip stages (13, 14) are driven by the single-freedom auxiliary driving units (7, 8) cooperated with the main driving units (11, 12) to move along the X direction. The single-freedom auxiliary driving units (7, 8) can be separated from or precisely butt-jointed with the Y-direction guide rails (15, 16), thereby achieving the position exchange of the two silicon chip stages (13, 14).
Abstract:
A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (10) operating in an exposure workstation (6) and a silicon chip stage (12) operating in a pre-processing workstation (7). Each silicon chip stage (10, 12) is supported by a six-freedom micro-motion stage, respectively. The silicon chip stage (10, 12) and the six-freedom micro-motion stage form a silicon chip stage group. The two silicon chip stage groups are provided on the same rectangular base stage (1) and suspended on an upper surface (2) of the base sage by air bearings. A double-freedom driving unit (21a, 21b, 22a, 22b) is provided on each edge of the base stage (1), respectively. The six-freedom micro-motion stage of the silicon chip stage group has an upper layer driver and a lower layer driver, capable of achieving six-freedom control. The double-freedom driving units (21a, 21b) on the long edges of the base stage are connected with the bases (62) of the six-freedom micro-motion stages, and the double-freedom driving units (22a, 22b) on the short edges of the base stage are connected with the stator coils (63) of the upper layer drivers of the six-freedom micro-motion stages.
Abstract:
A dual wafer stage exchanging system for a lithographic device is disclosed, said system comprises two wafer stages running between an exposure workstation and a pre-processing workstation, and said two stages are set on a base and suspended above the upper surface of the base by air bearings. Each wafer stages is passed through by a Y-direction guide rail respectively, wherein one end of said guide rail is connected with a main driving unit and another end of said guide rail is detachably coupled with one of the two X-direction auxiliary driving units with single degree of freedom, and said two wafer stages are capable of moving in Y-direction along the guide rails and moving in X-direction under the drive of the auxiliary driving units with single degree of freedom. The position exchange of said two wafer stages can be enabled by the detachment and connection of the Y-direction guide rails and the auxiliary units with single degree of freedom.
Abstract:
A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (13) operating in an exposure workstation (3) and a silicon chip (14) stage operating in a pre-processing workstation (4). The two silicon chip stages (13, 14) are provided on the same base stage (1), and suspended on an upper surface (2) of the base stage by air bearings. The two silicon chip stages (13, 14) can move along guide rails (15, 16) in the Y direction. One end of each guide rail (15, 16) is connected to a main driving unit (11, 12), and the other end of each guide rail (15, 16) is butt-jointed with an X-direction single-freedom auxiliary driving unit (7, 8). The silicon chip stages (13, 14) are driven by the single-freedom auxiliary driving units (7, 8) cooperated with the main driving units (11, 12) to move along the X direction. The single-freedom auxiliary driving units (7, 8) can be separated from or precisely butt-jointed with the Y-direction guide rails (15, 16), thereby achieving the position exchange of the two silicon chip stages (13, 14).
Abstract:
A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (10) operating in an exposure workstation (6) and a silicon chip stage (12) operating in a pre-processing workstation (7). Each silicon chip stage (10, 12) is supported by a six-freedom micro-motion stage, respectively. The silicon chip stage (10, 12) and the six-freedom micro-motion stage form a silicon chip stage group. The two silicon chip stage groups are provided on the same rectangular base stage (1) and suspended on an upper surface (2) of the base sage by air bearings. A double-freedom driving unit (21a, 21b, 22a, 22b) is provided on each edge of the base stage (1), respectively. The six-freedom micro-motion stage of the silicon chip stage group has an upper layer driver and a lower layer driver, capable of achieving six-freedom control. The double-freedom driving units (21a, 21b) on the long edges of the base stage are connected with the bases (62) of the six-freedom micro-motion stages, and the double-freedom driving units (22a, 22b) on the short edges of the base stage are connected with the stator coils (63) of the upper layer drivers of the six-freedom micro-motion stages.