Abstract:
An EEPROM cell includes a sense transistor and a select transistor, each having a first active region (110, 114) formed in a substrate, and sharing a second active region (112). The EEPROM cell may also include a floating gate (125) having a first portion (FG2) forming a gate region for said sense transistor, and a second portion (FG1) overlying the second active region and forming a program junction with said second active region. The first portion of said floating gate has a concentration of an impurity greater than a concentration of said impurity in the second portion of the floating gate.
Abstract:
A silicon substrate has patterned thereon a pad oxide layer and a nitride layer. The exposed surface of the silicon substrate is cleaned of residual oxide, and a layer of oxidizable material such as polysilicon is deposit over the resulting structure. The polysilicon layer is anisotropically etched to form spacers on the side of the nitride layer portions, which are also in contact with the silicon substrate, the etching continuing into the silicon substrate. Field oxidation is then undertaken, with the polysilicon spacers being oxidized, as is a portion of the silicon substrate, the spacers causing initial oxidation during field oxide growth to be removed from the sides of the nitride layer portions, so that encroachment of the oxide under the nitride layer portions is avoided.
Abstract:
A method of erasing electrically a programmable memory cell which cell includes a transistor formed in a region of semiconductor material. The transistor has a source region, a drain region, a floating gate, and a control gate. The method comprises lowering the control gate to a potential of about −9 volts, disconnecting the source and drain regions from any potential source, and placing the region of semiconductor material at a potential of about 9 volts.
Abstract:
An electrically programmable, non-volatile resistive memory includes an array of memory cells, a plurality of bit lines, and a plurality of word lines. Each memory cell comprises a resistive element and a Schottky diode coupled in series and having first and second terminals. Each bit line couples to the first terminal of all memory cells in a respective column of the array. Each word line couples to the second terminal of all memory cells in a respective row of the array. The resistive element for each memory cell may be formed with a film of a perovskite material (e.g., Pr0.7Ca0.3MnO3). The Schottky diode for each memory cell may be formed by a thin film of amorphous silicon. The films for the resistive element and Schottky diode for each memory cell may be stacked in a compact island at the cross point between a bit line and a word line.
Abstract translation:电可编程的非易失性电阻存储器包括存储器单元阵列,多个位线和多个字线。 每个存储单元包括串联耦合并具有第一和第二端子的电阻元件和肖特基二极管。 每个位线耦合到阵列的相应列中的所有存储器单元的第一端。 每个字线耦合到阵列的相应行中的所有存储器单元的第二端子。 用于每个存储单元的电阻元件可以由钙钛矿材料(例如,Pr 0.7 N 0.3 Mn 0.3 O 3)的膜形成。 每个存储单元的肖特基二极管可以由非晶硅薄膜形成。 用于每个存储单元的电阻元件和肖特基二极管的膜可以堆叠在位线和字线之间的交叉点处的紧凑岛中。
Abstract:
A method of programming an electrically programmable memory cell which cell includes a transistor formed in a semiconductor substrate of first conductivity type having a surface a first well region of second conductivity type is disposed in the substrate adjacent the surface thereof. A second well region of first conductivity type is disposed in the first well region adjacent the surface. The transistor has a source region, a drain region, a floating gate, and a control gate. The method includes raising the control gate to a first selected potential no greater than 9.0 volts, raising the drain to a potential to no more than 5.0 volts, coupling the source region to ground potential, coupling the first well region of second conductivity type to ground potential, and placing the second well region at a potential below ground potential.
Abstract:
A process is described for fabricating an integrated circuit memory in a semiconductor substrate. In the substrate, a first well is formed by introduction of dopant opposite to conductivity of the substrate. Within the first well a second well is formed of conductivity type matching the substrate. The memory cells are fabricated in the second well and have source and drain regions opposite the conductivity type substrate. Each of the first and second wells also includes a region of corresponding conductivity type to enable separate electrical connections to be made to each of the wells.
Abstract:
A high selectivity and etch rate with innovative approach of inductively coupled plasma source. Preferably, the invention includes a method using plasma chemistry that is divided into main etch step of (e.g., Cl2+HBr+C4F8) gas combination and over etch step of (e.g., HBr+Ar). The main etch step provides a faster etch rate and selectivity while the over etch step will decrease the etch rate and ensure the stringer and residue removal without attacking the under layer.
Abstract:
A non-volatile memory cell at least partially formed in a semiconductor substrate. The cell comprises a first transistor comprising a high voltage NMOS transistor having a first active region and a second active region; a second transistor sharing said second active region and having a third active region in said substrate; an active control gate region formed in said substrate; a polysilicon layer having a first portion forming a gate for said first transistor, and a second portion forming gate for said second transistor and a floating gate overlying said active control gate region. In one embodiment, an oxynitride separates said second portion and said active control gate region.
Abstract:
Apparatus is provided to facilitate the process of bulk preprogramming each of the cells in a flash memory or a subblock of a flash memory. In the process, the source and drain of each cell to be preprogrammed is biased such that current need not be flowing between the source and drain through the cell's channel region for charge to be transferred between the cell's channel region and the cell's floating gate. In a specific embodiment, the sources and drains are left floating without any particular bias voltage and the control gates of the cells are set to between 9 and 12 volts above the substrate and held there for about 10 milliseconds (ms). In an alternate embodiment, the sources and drains of all of the cells to be preprogrammed are biased to the same potential, which is a negative voltage, ground, or a positive voltage.
Abstract:
A method of erasing electrically a programmable memory cell which cell includes a transistor formed in a region of semiconductor material. The transistor has a source region, a drain region, a floating gate, and a control gate. The method includes lowering the control gate to a potential no more negative than 6.5 volts, disconnecting the source and drain regions from any potential source, and placing the region of semiconductor material at a potential no more positive than 8.0 volts.