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公开(公告)号：US12106941B2
公开(公告)日：2024-10-01
申请号：US18493618
申请日：2023-10-24
发明人： Chul-Joo Hwang
IPC分类号： C23C16/40 , C23C16/455 , C23C16/52 , H01J37/32 , H01L21/02
CPC分类号： H01J37/32449 , C23C16/45536 , C23C16/45551 , C23C16/45574 , C23C16/52 , H01L21/02274 , H01L21/0228 , H01J2237/20214 , H01J2237/332 , H01J2237/3321
摘要： The present disclosure relates to a substrate processing device and a substrate processing method, the substrate processing device comprising: a chamber; a substrate support part installed in a processing space inside the chamber so as to enable one or more substrate to rotate; a first gas spraying part for spraying a source gas on a first area of the processing space; a second gas spraying part for spraying, on a second area of the processing space, a reactant gas reacting with the source gas on the second area; and a third gas spraying part for spraying, on a third area, a purge gas for dividing the first area and the second area.
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公开(公告)号：US12080526B2
公开(公告)日：2024-09-03
申请号：US17625730
申请日：2020-07-09
发明人： Woong Kyo Oh , Young Woon Kim , Kwang Su Yoo , Do Hyung Kim , Yun Gyu Ha
IPC分类号： H01J37/32
CPC分类号： H01J37/32559 , H01J37/3244 , H01J37/32541 , H01J37/32568 , H01J2237/332
摘要： The present disclosure relates to a substrate processing apparatus capable of improving efficiency in a substrate processing process by adjusting a flow rate and residence time of gas and a plasma density according to process conditions. The substrate processing apparatus according to the embodiment of the present disclosure is advantageous in that it can enhance efficiency in the substrate processing process by decreasing the flow rate and increasing residence time of gas and the plasma density in the process of supplying the gas through the shape forming of the gas injection module including the first and second injection plates.
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3.发明公开公开(公告)号：US20240282745A1
公开(公告)日：2024-08-22
申请号：US18648334
申请日：2024-04-27
发明人： Jung Bae KIM , Min Jong KEUM , Young Tae YOON , Kyung Guk LEE
IPC分类号： H01L23/00 , H10K59/131
CPC分类号： H01L24/73 , H01L24/16 , H01L24/72 , H01L24/81 , H01L24/90 , H01L24/92 , H10K59/131 , H01L2224/16225 , H01L2224/73201 , H01L2224/9212
摘要： The present disclosure relates to an electrode connection element, a light emitting apparatus including the same, and a method for manufacturing the light emitting apparatus, and more particularly, to an electrode connection element, a light emitting apparatus including the same, and a method for manufacturing the light emitting apparatus, which are for electrically connecting an electrode terminal and an external drive circuit. An electrode connection element according to an exemplary embodiment includes: an upper connection member coming into contact with an upper surface of an electrode terminal formed on a substrate; a lower connection member configured to support a lower surface of the substrate; a connection member configured to connect the upper connection member and the lower connection member to each other.
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公开(公告)号：US12032013B2
公开(公告)日：2024-07-09
申请号：US18216470
申请日：2023-06-29
发明人： Gu Hyun Jung , Young Rok Kim , Se Yong Oh , Chul Joo Hwang , Jin An Jung
IPC分类号： G01R31/26 , G01R1/04 , G01R31/265
CPC分类号： G01R31/2601 , G01R1/04 , G01R31/265
摘要： Provided are a device and a method for monitoring substrates to determine a processed state of the substrates and inspecting presence of abnormality in the processed substrates. A device for inspecting substrates includes a substrate mounting part moving relative to the substrate and for mounting a substrate, a measurement part for monitoring the substrate, a control part configured to control a movement path of the measurement part so that at least some regions are monitored from positions different from each other with respect to a plurality of substrates, and an analysis part configured to determine presence of abnormality from monitoring information about the plurality of substrates.
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公开(公告)号：US20240055233A1
公开(公告)日：2024-02-15
申请号：US18493618
申请日：2023-10-24
发明人： Chul-Joo HWANG
IPC分类号： H01J37/32 , C23C16/455 , C23C16/52 , H01L21/02
CPC分类号： H01J37/32449 , C23C16/45536 , C23C16/45551 , C23C16/45574 , C23C16/52 , H01L21/02274 , H01L21/0228 , H01J2237/3321 , H01J2237/20214 , H01J2237/332
摘要： The present disclosure relates to a substrate processing device and a substrate processing method, the substrate processing device comprising: a chamber; a substrate support part installed in a processing space inside the chamber so as to enable one or more substrate to rotate; a first gas spraying part for spraying a source gas on a first area of the processing space; a second gas spraying part for spraying, on a second area of the processing space, a reactant gas reacting with the source gas on the second area; and a third gas spraying part for spraying, on a third area, a purge gas for dividing the first area and the second area.
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公开(公告)号：US20230361230A1
公开(公告)日：2023-11-09
申请号：US18225076
申请日：2023-07-21
发明人： Hyun Kyo SHIN , Duck Ho KIM , Yong Hyun KIM , Chang Su MHA , Kyung In MIN , Chang Kyun PARK , Jung Kyun LEE
IPC分类号： H01L31/0468 , H01L31/0465
CPC分类号： H01L31/0468 , H01L31/0465
摘要： The present inventive concept relates to a thin film type solar cell including a plurality of unit cells serially connected to one another on a substrate; and a light transmission part provided in the plurality of unit cells, wherein the light transmission part is provided in a discontinuous rectilinear structure including at least one disconnection part.
According to the present inventive concept, since the light transmission part is discontinuously formed, the repetition characteristic of the light transmission part including a plurality of dot patterns may be reduced, thereby effectively solving a problem where a wave pattern such as a moire phenomenon occurs when light is passing through the light transmission part.-
公开(公告)号：US20230341454A1
公开(公告)日：2023-10-26
申请号：US18216470
申请日：2023-06-29
发明人： Gu Hyun JUNG , Young Rok KIM , Se Yong OH , Chul Joo HWANG , Jin An JUNG
CPC分类号： G01R31/2601 , G01R1/04 , G01R31/265
摘要： Provided are a device and a method for monitoring substrates to determine a processed state of the substrates and inspecting presence of abnormality in the processed substrates.
A device for inspecting substrates includes a substrate mounting part moving relative to the substrate and for mounting a substrate, a measurement part for monitoring the substrate, a control part configured to control a movement path of the measurement part so that at least some regions are monitored from positions different from each other with respect to a plurality of substrates, and an analysis part configured to determine presence of abnormality from monitoring information about the plurality of substrates.-
公开(公告)号：US20230260794A1
公开(公告)日：2023-08-17
申请号：US18013546
申请日：2021-07-28
发明人： Il Hyong CHO , Young Woon KIM
IPC分类号： H01L21/285 , H01J37/32 , C23C16/14 , C23C16/455
CPC分类号： H01L21/28568 , H01J37/32449 , C23C16/14 , C23C16/45536 , H01J2237/332
摘要： The present disclosure relates to a thin film forming method, and more particularly, to a thin film forming method for forming a tungsten thin film.
In accordance with an exemplary embodiment, a method for forming a thin film includes supplying a reducing gas onto a substrate provided in a reaction space, applying a power to generate plasma in the reaction space, and supplying a tungsten containing gas onto the substrate, and the supplying of the tungsten containing gas is intermittently performed while the reducing gas is supplied.-
公开(公告)号：US11651941B2
公开(公告)日：2023-05-16
申请号：US16628021
申请日：2018-07-18
发明人： Min Ho Cheon , Jong Sik Kim , Chul-Joo Hwang
CPC分类号： H01J37/3244 , H01J37/32715 , H01L21/02274 , H01J2237/20214 , H01J2237/332
摘要： The present inventive concept relates to a gas distribution apparatus of a substrate processing apparatus including: a first gas distribution module distributing a processing gas to a first gas distribution space; and a second gas distribution module distributing a processing gas to a second gas distribution space which differs from the first gas distribution space, a substrate processing apparatus, and a substrate processing method.
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公开(公告)号：US20220392790A1
公开(公告)日：2022-12-08
申请号：US17793380
申请日：2021-01-22
发明人： InWoo BACK , JongChul KIM , YeongSeop BYEON , InCheol YEO
IPC分类号： H01L21/67 , H01L21/687 , C23C16/458 , C23C16/44 , C23C16/52
摘要： The present inventive concept relates to a substrate processing apparatus and a spray module of the substrate processing apparatus, the substrate processing apparatus comprising: a chamber for providing a processing space; a lid for covering the upper portion of the chamber; a substrate support portion which supports at least one substrate and rotates about a rotary shaft; a gas spray portion which is above the substrate support portion in a diameter direction from the rotary shaft of the substrate support portion and which sprays a processing gas; and a measuring portion which is arranged to be in parallel with or to be inclined in a direction at a certain angle with respect to the diameter direction on a measurement position that is spaced apart from the diameter direction and which measures the temperature of the substrate supported by the substrate support portion or the temperature of the substrate support portion.
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