APPARATUS FOR PROCESSING SUBSTRATE

    公开(公告)号:US20250069856A1

    公开(公告)日:2025-02-27

    申请号:US18726395

    申请日:2022-12-27

    Abstract: The present inventive concept relates to an apparatus for processing a substrate, the apparatus comprising: a chamber which includes a lid on top; a first plate which is installed under the lid and in which a plurality of gas holes is formed; a second plate coupled to the first plate and including a plurality of gas holes that communicate with some of the plurality of gas holes of the first plate; and a distance adjustment part which is connected to the second plate, adjusts the distance between the lid and the first plate, and is connected to an RF power feeding line.

    SUBSTRATE PROCESSING APPARATUS
    2.
    发明申请

    公开(公告)号:US20250034710A1

    公开(公告)日:2025-01-30

    申请号:US18687294

    申请日:2022-09-02

    Abstract: The present inventive concept relates to a substrate processing apparatus comprising: a chamber; a substrate support part which supports at least one substrate in the chamber; a lower plate which is disposed above the substrate support part; and an upper plate which is disposed above the lower plate, wherein: the upper plate includes a first spray hole which provides a first gas and a second spray hole which provides a second gas; and the lower plate includes a first opening which is disposed under the first spray hole so as to allow the first gas provided from the first spray hole to pass therethrough and a second opening which is disposed under the second spray hole so as to allow the second gas provided from the second spray hole to pass therethrough.

    Substrate processing apparatus
    5.
    发明授权

    公开(公告)号:US12080526B2

    公开(公告)日:2024-09-03

    申请号:US17625730

    申请日:2020-07-09

    Abstract: The present disclosure relates to a substrate processing apparatus capable of improving efficiency in a substrate processing process by adjusting a flow rate and residence time of gas and a plasma density according to process conditions. The substrate processing apparatus according to the embodiment of the present disclosure is advantageous in that it can enhance efficiency in the substrate processing process by decreasing the flow rate and increasing residence time of gas and the plasma density in the process of supplying the gas through the shape forming of the gas injection module including the first and second injection plates.

    THIN FILM-TYPE SOLAR CELL
    9.
    发明公开

    公开(公告)号:US20230361230A1

    公开(公告)日:2023-11-09

    申请号:US18225076

    申请日:2023-07-21

    CPC classification number: H01L31/0468 H01L31/0465

    Abstract: The present inventive concept relates to a thin film type solar cell including a plurality of unit cells serially connected to one another on a substrate; and a light transmission part provided in the plurality of unit cells, wherein the light transmission part is provided in a discontinuous rectilinear structure including at least one disconnection part.
    According to the present inventive concept, since the light transmission part is discontinuously formed, the repetition characteristic of the light transmission part including a plurality of dot patterns may be reduced, thereby effectively solving a problem where a wave pattern such as a moire phenomenon occurs when light is passing through the light transmission part.

    SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD

    公开(公告)号:US20230341454A1

    公开(公告)日:2023-10-26

    申请号:US18216470

    申请日:2023-06-29

    CPC classification number: G01R31/2601 G01R1/04 G01R31/265

    Abstract: Provided are a device and a method for monitoring substrates to determine a processed state of the substrates and inspecting presence of abnormality in the processed substrates.
    A device for inspecting substrates includes a substrate mounting part moving relative to the substrate and for mounting a substrate, a measurement part for monitoring the substrate, a control part configured to control a movement path of the measurement part so that at least some regions are monitored from positions different from each other with respect to a plurality of substrates, and an analysis part configured to determine presence of abnormality from monitoring information about the plurality of substrates.

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