Positive photosensitive resin composition
    4.
    发明授权
    Positive photosensitive resin composition 有权
    正型感光性树脂组合物

    公开(公告)号:US08568954B2

    公开(公告)日:2013-10-29

    申请号:US12884316

    申请日:2010-09-17

    IPC分类号: G03F7/023

    摘要: A positive photosensitive resin composition according to one embodiment of the present invention includes a polyamic acid or a polyamic acid ester compound including a repeating unit represented by Formula 1 defined in this specification, a photosensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The positive photosensitive resin composition can be cured at a low temperature of 260° C. or less, and can have high sensitivity, resolution, residue removal, substrate adherence, and pattern-forming capabilities, and low film shrinkage.

    摘要翻译: 根据本发明的一个实施方案的正型感光性树脂组合物包括聚酰胺酸或聚酰胺酸酯化合物,其包含本说明书中定义的式1表示的重复单元,光敏重氮醌化合物,硅烷化合物,酚化合物和 溶剂。 正型感光性树脂组合物可以在260℃以下的低温下固化,并且可以具有高灵敏度,分辨率,残余物去除,基材粘附和图案形成能力以及低的膜收缩率。