公开(公告)号：US08327534B2

公开(公告)日：2012-12-11

申请号：US12926923

申请日：2010-12-17

Applicant: Min Young Park ,  Young Jun Moon ,  Hyun Joo Han ,  Gyun Heo ,  Kyung Woon Jang ,  Sang il Hong ,  Dong Seok Baek

Inventor： Min Young Park ,  Young Jun Moon ,  Hyun Joo Han ,  Gyun Heo ,  Kyung Woon Jang ,  Sang il Hong ,  Dong Seok Baek

IPC: H01K3/10

CPC classification number: H05K3/321 ,  H05K3/125 ,  H05K3/4664 ,  H05K2201/09436 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

Abstract translation: 本文公开了一种通过将元件粘附到印刷电路板而不使用任何焊料来制造印刷电路板组件的方法。 印刷电路板可以通过喷墨打印依次将含有导体的第一油墨和含绝缘体的第二油墨施加到基底基板上来制造，以形成印刷电路板，将元件安装在印刷电路板上，使得 元件的电极接触导电层并在高温下固化导电层。

公开(公告)号：US20110154661A1

公开(公告)日：2011-06-30

申请号：US12926923

申请日：2010-12-17

Applicant: Min Young Park ,  Young Jun Moon ,  Hyun Joo Han ,  Gyun Heo ,  Kyung Woon Jang ,  Sang il Hong ,  Dong Seok Baek

Inventor： Min Young Park ,  Young Jun Moon ,  Hyun Joo Han ,  Gyun Heo ,  Kyung Woon Jang ,  Sang il Hong ,  Dong Seok Baek

IPC: H05K3/10

CPC classification number: H05K3/321 ,  H05K3/125 ,  H05K3/4664 ,  H05K2201/09436 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

Abstract translation: 本文公开了一种通过将元件粘附到印刷电路板而不使用任何焊料来制造印刷电路板组件的方法。 印刷电路板可以通过喷墨打印依次施加含有导体的第一油墨和含绝缘体的第二油墨到基底基板上以形成印刷电路板，将元件安装在印刷电路板上，从而使印刷电路板 元件的电极接触导电层并在高温下固化导电层。

公开(公告)号：US20080157326A1

公开(公告)日：2008-07-03

申请号：US11872810

申请日：2007-10-16

Applicant: Hyun Joo HAN ,  Tao Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

Inventor： Hyun Joo HAN ,  Tao Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

IPC: H01L23/538 ,  H01L21/60

CPC classification number: H05K3/3436 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.

Abstract translation: 一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球 封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到 第一个BGA IC封装。

公开(公告)号：US07755181B2

公开(公告)日：2010-07-13

申请号：US11872810

申请日：2007-10-16

Applicant: Hyun Joo Han ,  Tae Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

Inventor： Hyun Joo Han ,  Tae Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

IPC: H01L23/538

CPC classification number: H05K3/3436 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.

Abstract translation: 一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球 封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到 第一个BGA IC封装。

公开(公告)号：US20090139758A1

公开(公告)日：2009-06-04

申请号：US12155401

申请日：2008-06-03

Applicant: Hyo Young Shin ,  Seung Boo Jung ,  Young Jun Moon ,  Soon Min Hong ,  Chang Yong Lee ,  Ja Myeong Koo ,  Hyun Tae Kim ,  Jong Bum Lee ,  Hyun Joo Han

Inventor： Hyo Young Shin ,  Seung Boo Jung ,  Young Jun Moon ,  Soon Min Hong ,  Chang Yong Lee ,  Ja Myeong Koo ,  Hyun Tae Kim ,  Jong Bum Lee ,  Hyun Joo Han

IPC: H05K3/36 ,  H01R12/04

CPC classification number: H05K3/361 ,  H05K3/328 ,  H05K3/3452 ,  H05K3/363 ,  H05K2201/09881 ,  H05K2201/0989 ,  H05K2203/0285 ,  H05K2203/167 ,  Y10T29/49126

Abstract: A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals from one another; and separation preventing member which prevents the first and the second electrode terminals from deviating from their correct positions when the first and the second electrode terminals are ultrasonically-welded to each other. Accordingly, lateral movement of the first and the second PCBs relative to each other is restricted owing to the separation preventing member, the plurality of first electrode terminals and second electrode terminals can be bonded to each other without deviating from their correct positions.

Abstract translation: 公开了一种印刷电路板（PCB）组件，其包括第一PCB，多个第一电极端子彼此间隔布置在该第一PCB上; 分别与第一电极端子分别连接的多个第二电极端子彼此间隔布置的第二PCB; 以及防止第一和第二电极端子在第一和第二电极端子彼此超声波焊接时偏离其正确位置的防分离部件。 因此，由于分离防止部件，第一和第二PCB的相对于彼此的横向运动受到限制，所以多个第一电极端子和第二电极端子可以彼此接合而不偏离其正确的位置。