摘要:
First, a substrate with a polysilicon film is provided. Then, a gate insulating layer and a gate are formed on the polysilicon film in sequence. An ion implantation process is performed to form a source and a drain around the gate. After that, a first plasma enhanced chemical vapor deposition (PECVD) process is performed to form a silicon nitride layer over the substrate and the gate. A second plasma enhanced chemical vapor deposition process is then performed to form a TEOS based silicon oxide layer on the silicon nitride layer. A photo-etching process follows to form a contact hole extending through to the source and drain respectively. Then, a conductive layer is filled into the contact holes and electrically connected to the source and drain.
摘要:
A method for forming a silicon oxide layer in the production of the polysilicon film transistor is disclosed. A plasma surface treatment is performed over a substrate after an amorphous silicon layer has been formed on the substrate by PECVD to transform a portion of the amorphous silicon layer into a superficial oxide layer.
摘要:
The present invention provides a method of forming a low temperature polysilicon thin film transistor (LTPS TFT). A polysilicon layer including a channel region is formed first. A first and a second plasma enhanced chemical vapor deposition processes are sequentially performed to form a composite gate insulating layer composed of a TEOS-based silicon oxide layer and a silicon nitride layer on the channel region. Finally a gate electrode and a source/drain of the low temperature polysilicon thin film transistor are formed.
摘要:
First, a substrate with a polysilicon film is provided. Then, a gate insulating layer and a gate are formed on the polysilicon film in sequence. An ion implantation process is performed to form a source and a drain around the gate. After that, a first plasma enhanced chemical vapor deposition (PECVD) process is performed to form a silicon nitride layer over the substrate and the gate. A second plasma enhanced chemical vapor deposition process is then performed to form a TEOS based silicon oxide layer on the silicon nitride layer. A photo-etching process follows to form a contact hole extending through to the source and drain respectively. Then, a conductive layer is filled into the contact holes and electrically connected to the source and drain.
摘要:
This invention discloses a defect isolation method for thin-film solar cell having at least a defect therein. The thin-film solar cell comprises a substrate, a front electrode layer, an absorber layer and a back electrode layer stacked in such a sequence. The defect isolation method includes the steps of: detecting at least a defect formed in thin-film solar cell and acquiring the positions of the defects, and applying a laser light to scribe the outer circumference of the defects according to the positions of the defects so as to form at least an isolation groove having a closed-curve configuration.
摘要:
This invention discloses a defect isolation method for thin-film solar cell having at least a defect therein. The thin-film solar cell comprises a substrate, a front electrode layer, an absorber layer and a back electrode layer stacked in such a sequence. The defect isolation method includes the steps of: detecting at least a defect formed in thin-film solar cell and acquiring the positions of the defects, and applying a laser light to scribe the outer circumference of the defects according to the positions of the defects so as to form at least an isolation groove having a closed-curve configuration.
摘要:
A method for improving uniformity of a film in a plasma enhanced chemical vapor deposition system in a deposition chamber includes the following steps before a deposition procedure. Firstly, a cleaning procedure is performed to remove particles adhered onto an internal wall of the deposition chamber. Then, a pre-deposition procedure is performed to isolate contaminants generated during the clearing procedure. Afterward, a specified gas is introduced into the deposition chamber so as to stabilize a condition inside the deposition chamber.
摘要:
The present invention discloses a thin film solar cell module and a manufacturing method thereof. The thin film solar cell comprises, from bottom to top, a first substrate, a first electrode, an absorber layer, and a second electrode layer. A first current output region formed at the positive electrode of the thin film solar cell module. A first current output element is disposed in the first current output region, and the absorber layer further comprises at least a first gap which is disposed in the first current output region to increase the contact between the first electrode layer and the second electrode layer. The useless current, the resistance and the heat generated there are reduced. The heat generated there is also reduced.
摘要:
This invention discloses a thin-film solar cell, provided with a plurality of unit cells, comprising a substrate, a front electrode layer, an absorber layer and a back electrode layer stacked in such a sequence. The thin-film solar cell further includes at least a defect formed at least in the back electrode layer, and the defect has at least an isolation groove of a closed curve formed around the defect.