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    Method of and apparatus for laser drilling holes with improved taper
    1.
    发明授权
    Method of and apparatus for laser drilling holes with improved taper 失效
    具有改进锥度的激光钻孔的方法和设备

    公开(公告)号：US08710402B2

    公开(公告)日：2014-04-29

    申请号：US11757253

    申请日：2007-06-01

    申请人： Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

    发明人： Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

    IPC分类号： B23K26/00 ,  B23K26/08

    CPC分类号： B23K26/384 ,  B23K26/389 ,  B23K2101/36 ,  H05K3/0035 ,  H05K2201/09827

    摘要： A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

    摘要翻译： 用于在多层电子电路中钻出具有可选锥度的盲孔的方法和装置允许在层之间形成电连接，同时保持质量和生产量。 该方法依赖于识别定义锥度的通孔的顶部直径和通孔的底部直径是两个单独的方程组的函数。 这些方程的同时解决方案产生一个解空间，可以优化吞吐量，同时使用具有相同脉冲参数的临时未修改的Q开关CO2激光脉冲保持选定的锥度和质量。 不需要实时脉冲裁剪; 因此，系统复杂性和成本可能会降低。

    LASER DIRECT ABLATION WITH PICOSECOND LASER PULSES AT HIGH PULSE REPETITION FREQUENCIES
    2.
    发明申请
    LASER DIRECT ABLATION WITH PICOSECOND LASER PULSES AT HIGH PULSE REPETITION FREQUENCIES 有权
    激光直接与高脉冲重复频率下的PICOSECOND激光脉冲相关

    公开(公告)号：US20120248075A1

    公开(公告)日：2012-10-04

    申请号：US13076754

    申请日：2011-03-31

    申请人： Mehmet E. Alpay ,  Hisashi Matsumoto ,  Mark A. Unrath ,  Guangyu Li

    发明人： Mehmet E. Alpay ,  Hisashi Matsumoto ,  Mark A. Unrath ,  Guangyu Li

    IPC分类号： B23K26/36 ,  B23K26/04

    CPC分类号： B23K26/0648 ,  B23K26/0622 ,  B23K26/0652 ,  B23K26/082 ,  B23K26/0861 ,  B23K26/364 ,  B23K2101/42 ,  B23K2103/42 ,  B23K2103/50

    摘要： Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.

    摘要翻译： 激光直接消融（LDA）产生切割成电介质层的图案，以形成具有受控信号传播特性的导电迹线。 LDA处理包括选择剂量注量以沿着工件表面上的划线去除期望的材料深度，在一系列激光脉冲中选择每个激光脉冲的时间脉冲宽度，以及选择一系列激光脉冲的脉冲重复频率 激光脉冲。 脉冲重复频率至少部分地基于所选择的时间脉冲宽度，以维持沿着划线的所选择的剂量注量。 所选择的脉冲重复频率提供沿着划线的激光点的预定的最小重叠。 LDA工艺还包括根据所选择的剂量注量，时间脉冲宽度和脉冲重复频率产生包括一系列激光脉冲的激光束。

    METHODS AND SYSTEMS FOR GENERATING PULSE TRAINS FOR MATERIAL PROCESSING
    3.
    发明申请
    METHODS AND SYSTEMS FOR GENERATING PULSE TRAINS FOR MATERIAL PROCESSING 有权
    用于生成材料加工的脉冲火车的方法和系统

    公开(公告)号：US20110085574A1

    公开(公告)日：2011-04-14

    申请号：US12907768

    申请日：2010-10-19

    申请人： Yasu Osako ,  Hisashi Matsumoto

    发明人： Yasu Osako ,  Hisashi Matsumoto

    IPC分类号： H01S3/10

    CPC分类号： B23K26/382 ,  B23K26/0622 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50 ,  H01S3/2383

    摘要： Systems and methods generate laser pulse trains for material processing. In one embodiment, stable laser pulse trains at high repetition rates are generated from a continuous wave (CW) or quasi-CW laser beams. One or more laser pulses in the laser pulse train may be shaped to control energy delivered to a target material. In another embodiment, multiple laser beams are distributed to multiple processing heads from a single laser pulse, CW laser beam, or quasi-CW laser beam. In one such embodiment, a single optical deflector distributes multiple laser beams among respective processing heads.

    摘要翻译： 系统和方法产生用于材料加工的激光脉冲串。 在一个实施例中，从连续波（CW）或准CW激光束产生高重复率的稳定激光脉冲串。 激光脉冲串中的一个或多个激光脉冲可以被成形为控制输送到目标材料的能量。 在另一个实施例中，多个激光束从单个激光脉冲，CW激光束或准CW激光束分配到多个处理头。 在一个这样的实施例中，单个光学偏转器在相应的处理头之间分配多个激光束。

    Process and system for quality management and analysis of via drilling
    5.
    发明授权
    Process and system for quality management and analysis of via drilling 有权
    通孔钻孔质量管理与分析流程与系统

    公开(公告)号：US07544304B2

    公开(公告)日：2009-06-09

    申请号：US11484531

    申请日：2006-07-11

    申请人： Hisashi Matsumoto ,  Mark Singer ,  Leo Baldwin ,  Jeffrey E. Howerton ,  David V. Childers

    发明人： Hisashi Matsumoto ,  Mark Singer ,  Leo Baldwin ,  Jeffrey E. Howerton ,  David V. Childers

    IPC分类号： H01B13/00

    CPC分类号： H05K3/0035 ,  B23K26/03 ,  B23K26/06 ,  B23K26/389 ,  B23K2101/42 ,  H05K1/0269 ,  H05K2201/09454 ,  H05K2203/163

    摘要： A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.

    摘要翻译： 用于在具有多个不同几何形状的多个捕获垫的电路基板的至少一层中激光形成盲通孔的方法可以包括：至少一个盲孔以形成在电路基板的至少一层中， 相对于在钻孔位置处形成的盲孔通孔几何值（例如面积和/或体积），距离钻孔位置预定距离内的捕获垫几何值（例如面积和/或体积）。 该过程可以包括基于评估设置至少一个激光操作参数，以便在盲通孔形成之后获得期望的捕获垫外观。 该过程可以包括将被定义为距电路基板的至少一层中的盲孔通孔位置的预定距离范围内的捕获区域成像，量化成像捕获区域的至少一个出现值，以及确定可接受性 基于量化外观值的成像捕获垫区域。

    Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
    6.
    发明申请
    Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories 有权
    通过以圆形和螺旋形轨迹移动精确定时的激光脉冲来处理孔的方法

    公开(公告)号：US20060027544A1

    公开(公告)日：2006-02-09

    申请号：US10912525

    申请日：2004-08-04

    申请人： Robert Pailthorp ,  Weisheng Lei ,  Hisashi Matsumoto ,  Glenn Simenson ,  David Watt ,  Mark Unrath ,  William Jordens

    发明人： Robert Pailthorp ,  Weisheng Lei ,  Hisashi Matsumoto ,  Glenn Simenson ,  David Watt ,  Mark Unrath ,  William Jordens

    IPC分类号： B23K26/38

    CPC分类号： H05K3/0026 ,  B23K26/389 ,  H05K2201/09063

    摘要： High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.

    摘要翻译： 从样品高速去除材料采用光束定位器，用于沿着各种圆形和螺旋形激光工具图案引导激光束轴线。 优选的材料去除方法需要引起梁的轴线和样品之间的相对运动，将束轴线以入口段加速度并沿着入口轨迹引导到在激光束脉冲发射开始的样本内的入口位置， 沿着试样中的圆周边加速度移动光束轴，以沿着试样的圆形段移除材料，并将进入段加速度设置为小于圆周边加速度的两倍。

    Beam shaping and projection imaging with solid state UV Gaussian beam to form vias
    8.
    发明授权
    Beam shaping and projection imaging with solid state UV Gaussian beam to form vias 有权
    光束成像和投影成像与固态紫外高斯光束形成通孔

    公开(公告)号：US06433301B1

    公开(公告)日：2002-08-13

    申请号：US09580396

    申请日：2000-05-26

    申请人： Corey M. Dunsky ,  Xinbing Liu ,  Nicholas J. Croglio ,  Ho W. Lo ,  Bryan C. Gundrum ,  Hisashi Matsumoto

    发明人： Corey M. Dunsky ,  Xinbing Liu ,  Nicholas J. Croglio ,  Ho W. Lo ,  Bryan C. Gundrum ,  Hisashi Matsumoto

    IPC分类号： B23K2638

    CPC分类号： B23K26/382 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0732 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  H01L21/486 ,  H01L21/76802 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427

    摘要： A diode-pumped, solid-state laser (52) of a laser system (50) provides ultraviolet Gaussian output (54) that is converted by a diffractive optical element (90) into shaped output (94) having a uniform irradiance profile. A high percentage of the shaped output (94) is focused through an aperture of a mask (98) to provide imaged to provide imaged shaped output (118). The laser system (50) facilitates a method for increasing the throughput of a via drilling process over that available with an analogous clipped Gaussian laser system. This method is particularly advantageous for drilling blind vias (20b) that have better edge, bottom, and taper qualities than those produced by a clipped Gaussian laser system. An alternative laser system (150) employs a pair of beam diverting galvanometer mirrors (152, 154) that directs the Gaussian output around a shaped imaging system (70) that includes a diffractive optical element (90) and a mask (98). Laser system (150) provides a user with the option of using either a Gaussian output or an imaged shaped output (118).

    摘要翻译： 激光系统（50）的二极管泵浦的固态激光器（52）提供由衍射光学元件（90）转换成具有均匀辐照度分布的成形输出（94）的紫外高斯输出（54）。 高百分比的成形输出（94）通过掩模（98）的孔聚焦以提供成像以提供成像的成形输出（118）。 激光系统（50）有助于提高通孔钻孔过程的吞吐量超过类似的限幅高斯激光系统可用的方法。 该方法对于具有比由高斯激光系统产生的那些具有更好的边缘，底部和锥度特性的盲孔（20b）特别有利。 替代的激光系统（150）使用一对光束转向电流计反射镜（152,154），其引导围绕包括衍射光学元件（90）和掩模（98）的成形成像系统（70）的高斯输出。 激光系统（150）向用户提供使用高斯输出或成像形状输出（118）的选项。

    Semiconductor integrated circuit device and method of arranging and wiring cells
    9.
    发明授权
    Semiconductor integrated circuit device and method of arranging and wiring cells 失效
    半导体集成电路器件及其配线方法

    公开(公告)号：US6121644A

    公开(公告)日：2000-09-19

    申请号：US94925

    申请日：1993-07-22

    申请人： Yoshiki Tsujihashi ,  Hisashi Matsumoto ,  Kazuhiro Yamazaki

    发明人： Yoshiki Tsujihashi ,  Hisashi Matsumoto ,  Kazuhiro Yamazaki

    IPC分类号： H01L21/82 ,  H01L21/822 ,  H01L23/528 ,  H01L27/04 ,  H01L27/10

    CPC分类号： H01L23/528 ,  H01L2924/0002

    摘要： Input/output terminals 10 made of a first aluminium wiring layer are provided within cells 3a to 3c in the same cell row 30. A plurality of mains 7a to 7c made of a second aluminium wiring layer, which are electrically independent of the input/output terminals 10 of the standard cells 3a to 3c, a power source wire 1 and a grounding wire 2, are arranged between the input/output terminals 10 of the standard cells 3 to be connected so that they extend in parallel with a cell row extending direction. Via holes 8 are provided in regions in which the input/output terminals 10 overlap the mains 7 two-dimensionally to make electrical connection between the input/output terminals 10 and the mains 7. Since the wirings in the same cell row are executed within the cells in the cell row, an integration degree can be improved.

    摘要翻译： 由第一铝布线层制成的输入/输出端子10设置在同一电池列30的电池3a至3c内。由第二铝布线层制成的多个电源7a至7c，其独立于输入/输出 标准单元3a至3c的端子10，电源线1和接地线2被布置在要连接的标准单元3的输入/输出端子10之间，使得它们与单元行延伸方向平行地延伸 。 通孔8设置在输入/输出端子10二维地与电源7重叠的区域中，以在输入/输出端子10和电源线7之间进行电连接。由于相同单元行中的布线在 细胞行中的细胞，可以提高整合度。