公开(公告)号：US20090162467A1

公开(公告)日：2009-06-25

申请号：US12084791

申请日：2007-01-26

Applicant: Hiroshi Uragami ,  Mamoru Nakamura ,  Masanobu Takahashi ,  Kinya Fujino ,  Katsunori Tsutafuji

Inventor： Hiroshi Uragami ,  Mamoru Nakamura ,  Masanobu Takahashi ,  Kinya Fujino ,  Katsunori Tsutafuji

IPC: B29C43/04

CPC classification number: H01L21/565 ,  B29C43/18 ,  B29C43/36 ,  B29C43/50 ,  B29C43/58 ,  B29C2043/3602 ,  B29C2043/3623 ,  B29C2043/5833 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Resin molding apparatus includes in unit, press unit and out unit. The in unit transfers not only pre-molding substrate but also resin material. The press unit includes multiple mold assemblies. The out unit transfers molded substrate having been resin-sealed within the mold assemblies. Further, the resin sealing/molding apparatus includes not only carrier rail but also demounting means and supply means traveling along the carrier rail. Furthermore, multiple press units in the state of being linked with each other are disposed between the in unit and the out unit.

Abstract translation: 树脂成型装置包括单元，冲压单元和出料单元。 单元不仅可以预先预成型基板，还可以传输树脂材料。 压制单元包括多个模具组件。 输出单元将已经树脂密封的模制基板转移到模具组件内。 此外，树脂密封/成型装置不仅包括载体轨道，而且包括沿着载体轨道行进的拆卸装置和供给装置。 此外，在彼此连接的状态下的多个冲压单元设置在单元和外部单元之间。

公开(公告)号：US07056770B2

公开(公告)日：2006-06-06

申请号：US10719379

申请日：2003-11-20

Applicant: Hiroshi Uragami ,  Osamu Nakagawa ,  Kinya Fujino ,  Shinji Takase ,  Hideki Tokuyama ,  Koichi Meguro ,  Toru Nishino ,  Noboru Hayasaka

Inventor： Hiroshi Uragami ,  Osamu Nakagawa ,  Kinya Fujino ,  Shinji Takase ,  Hideki Tokuyama ,  Koichi Meguro ,  Toru Nishino ,  Noboru Hayasaka

IPC: H01L21/44

CPC classification number: H01L21/565 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.

Abstract translation: 首先，将板放置在具有下模具的板安装部分上，并且打开上模具。 然后，具有与形成在下模具中的空腔的尺寸和形状相对应的尺寸和形状的树脂材料装配在空腔中。 此后，加热树脂材料，使其熔化。 此后，下模和上模封闭，上模和下模形成的空间减压。 结果，芯片和电线被浸入熔融的树脂中。 之后，设定熔融树脂，从而形成包括该板和固化树脂的树脂模制品。

公开(公告)号：US20110193261A1

公开(公告)日：2011-08-11

申请号：US13123678

申请日：2009-10-16

Applicant: Hiroshi Uragami ,  Masanobu Takahashi ,  Shigeru Hirata

Inventor： Hiroshi Uragami ,  Masanobu Takahashi ,  Shigeru Hirata

IPC: B29C43/18 ,  B29C43/50

CPC classification number: H01L21/565 ,  B29C33/0088 ,  B29C33/20 ,  B29C33/30 ,  B29C43/18 ,  B29C43/34 ,  B29C43/36 ,  B29C2043/3411 ,  B29C2043/3602 ,  B29C2043/5825 ,  B29C2043/5833 ,  B29C2043/5841 ,  B29C2043/5858 ,  B29K2105/251 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention aims at effectively decreasing the installation space of an entire semiconductor chip compression molding apparatus and effectively decreasing the clamping force in dies which are provided in the apparatus. It further aims at performing a clamping, in the case where substrates having a different thickness are used, with an efficient adjustment in accordance with the thicknesses of the substrates. To this end, the semiconductor chip compression molding includes two semiconductor chip compression molding dies (top and bottom dies), and a die opening/closing means for closing the die surfaces of top dies and those of bottom dies in each of the upper and lower dies. The die opening/closing means includes a die opening/closing mechanism having two racks and one pinion, and a thickness adjustment mechanism for adjusting the gaps in accordance with the thicknesses of the substrates supplied to each of the upper and lower dies.

Abstract translation: 本发明的目的在于有效地减少整个半导体芯片压缩成型设备的安装空间并且有效地降低设备中设置的管芯中的夹紧力。 进一步的目的是在使用具有不同厚度的基板的情况下，根据基板的厚度进行有效的调整来执行夹紧。 为此，半导体芯片压缩成型包括两个半导体芯片压缩成型模具（顶部和底部模具），以及用于封闭顶部模具的模具表面的模具打开/关闭装置和上部和下部的每个模具的模具表面 死了 模具打开/关闭装置包括具有两个齿条和一个小齿轮的模具打开/关闭机构，以及用于根据提供给每个上模具和下模具的基板的厚度来调节间隙的厚度调节机构。