摘要:
This invention concerns a method for forming a coating film on a metallic substrate by a multistage energization method at no less than two stages using an electrodeposition bath which comprises a water-based film-forming agent comprising zirconium compound and, as the base resin, an amino group-containing modified epoxy resin which is obtained through reaction of an epoxy resin with an amino group-containing compound, said epoxy resin having been obtained through reaction of a diepoxide compound, a bisphenol epoxy resin and bisphenols; whereby coated articles excelling in corrosion resistance are offered.
摘要:
A load driving device includes a drive control signal generation circuit generating a load drive control signal and a semiconductor buffer circuit generating an output signal in response to the load drive control signal. The buffer circuit has a pair of gate driven switching elements which are connected to each other in push-pull configuration and driven at their gate terminals by the load drive control signal. The buffer circuit has an output terminal which is connected to a connection point between ends of controlled electrodes of the gate driven switching elements, and a power source terminal and a ground connection terminal respectively connected to the remaining ends of the other controlled electrodes of the gate driven switching elements. A ground connection side element of a pair of gate driven switching elements has a set of MOS transistors which are connected across the connection point and the ground connection terminal.
摘要:
An electro-static discharge protection circuit and a semiconductor device having the same is disclosed. The electro-static discharge protection circuit has a current control circuit. The current control circuit has a first capacitive element. When the external source voltage is applied to the external source voltage supply line, the booster circuit in the internal circuitry boosts the internal source voltage of the internal source voltage supply line. The external source voltage becomes transiently greater than the internal source voltage at the early stage of the boosting step when the booster circuit boosts the internal source voltage based on the external source voltage. The first capacitive element restricts a current from flowing from the second terminal of the thyristor rectifier circuit to the internal source voltage, even when the external source voltage becomes transiently greater than the internal source voltage at the early stage of the boosting step when the booster circuit boosts the internal source voltage based on the external source voltage. This prevents the thyristor rectifier circuit from malfunctioning and turning on.
摘要:
A semiconductor integrated circuit having an ESD protection circuit enhancing a durability against thermal destruction is provided. The semiconductor integrated circuit configured by a plurality of MOSFETs each having an SOI structure formed on a silicon substrate includes a functional circuit having an external connection signal terminal, a pair of power terminals and at least one of the MOSFETs. The semiconductor integrated circuit also includes at least one ESD protection circuit having a first terminal and a second terminal connected to the signal terminal and the power terminals, respectively. The ESD protection circuit includes at least one first MOSFET of the MOSFETs formed on the silicon substrate. The first MOSFET has a drain connected to the first terminal, a gate connected to the second terminal, and a source connected to the second terminal. The at least one ESD protection circuit also includes at least one second MOSFET of the MOSFETs formed adjacent to the first MOSFET on the silicon substrate. The second MOSFET has a gate connected to the first terminal and the same conductivity type as the first MOSFET.
摘要:
An ESD protection device modeling method of modeling an electrical characteristic of an electrostatic discharge (ESD) protection device for simulating a circuit that include the ESD protection device, comprising the steps of (114) setting a parameter of at least one specific element that affects the electrical characteristic of the ESD protection device; and (116) modeling the electrical characteristic of the ESD protection device with the parameter of the specific element.
摘要:
A load driving device includes a drive control signal generation circuit generating a load drive control signal and a semiconductor buffer circuit generating an output signal in response to the load drive control signal. The buffer circuit has a pair of gate driven switching elements which are connected to each other in push-pull configuration and driven at their gate terminals by the load drive control signal. The buffer circuit has an output terminal which is connected to a connection point between ends of controlled electrodes of the gate driven switching elements, and a power source terminal and a ground connection terminal respectively connected to the remaining ends of the other controlled electrodes of the gate driven switching elements. A ground connection side element of a pair of gate driven switching elements has a set of MOS transistors which are connected across the connection point and the ground connection terminal.
摘要:
A chromaticity meter measures chromaticity of light output for each of picture elements selected. Calculated from the measurement is corrective data on each of RGB colors, which in turn used to calculate corrective data on each of RGB at unselected picture elements. In this method, original video signals for each of RGB colors will be correctively modulated based on the thus obtained corrective data. A projected image displaying apparatus is constructed such that adjustment of chromaticity as to white as well as to black from the measurement by the chromaticity meter of chromaticity throughout the entire image, is carried out uniformly and reliably by automatic control using a microcomputer so as to determine optimal condition for correctively modulating the original video signal. This apparatus further includes means for storing the thus obtained optimal condition in a non-volatile memory.
摘要:
A cationic electrodeposition coating composition comprising[A] a neutralization product or a quaternary ammonium salt of a comb-shaped copolymer obtained by copolymerizing (a) 3 to 90 parts by weight of an ethylenically unsaturated monomer having a hydrocarbon chain with at least 8 carbon atoms at the molecular ends, (b) 1 to 50 parts by weight of at least one cationic (meth)acrylic monomer selected from the group consisting of aminoalkyl (meth)acrylates, aminoalkyl (meth)acrylamides (meth)acrylates containing a quaternary ammonium salt group and (meth)acrylamides containing a quaternary ammonium salt group, (c) 1 to 60 parts by weight of an alpha,beta-ethylenically unsaturated monomer other than the monomer (b), and (d) 0 to 95 parts by weight of an alpha,beta-ethylenically unsaturated monomer other than the monomers (a), (b) and (c),[B] a cationic epoxy resin capable of being dissolved or dispersed in water, and[C] a pigment.
摘要:
According to a feature of the present invention, a semiconductor device includes a SOI substrate, including a semiconductor substrate; an insulating layer formed on the semiconductor substrate and a silicon layer formed on the insulating layer. A drain region and a source region are formed in the silicon layer so that the source region is in contact with the insulating layer but the drain region is not in contact with the insulating layer.
摘要:
A semiconductor device includes a laminated substrate; a removal portion; a cavity; a first semiconductor element; and a second semiconductor element. In the laminated substrate, a bulk layer, an insulating layer, and a semiconductor layer are laminated in this order from a bottom. The laminated substrate includes a first area, a second area adjacent to the first area, and a third area adjacent to the second area in each of the layers. The semiconductor layer, the insulating layer, and an upper portion of the bulk layer in the first area are removed to form the removal portion. A part of the bulk layer in the second area is removed to form the cavity adjacent to the removal portion. The first semiconductor element is formed in the bulk layer in the removal portion as an ESD protection element. The second semiconductor element is formed partially in the semiconductor layer in the second area.