公开(公告)号：US06399182B1

公开(公告)日：2002-06-04

申请号：US09548093

申请日：2000-04-12

申请人： Erich K. Rubel ,  Jonathan H. Harris ,  Gabriel M. Carrasco

发明人： Erich K. Rubel ,  Jonathan H. Harris ,  Gabriel M. Carrasco

IPC分类号： H01L23495

CPC分类号： H01L24/83 ,  H01L23/13 ,  H01L24/32 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32057 ,  H01L2224/8314 ,  H01L2224/8319 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/384 ,  Y10T29/496 ,  Y10T29/49996 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/12889 ,  Y10T428/12931 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24942 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate for a microelectronic package comprising a substrate that has grooves on a surface for bonding. A method for preparing a substrate for bonding comprising forming a grooved surface in the substrate for accepting a die for bonding, wherein the grooves are of sufficient size to provide a substantially uniform die bond, but no so large as to nullify the thermal path to the underlying substrate. A method for forming a bond between a substrate and a die comprising: providing a substrate and a die, wherein the substrate has grooves formed in a surface area for accepting the die for bonding and having a metallization thereon sufficient to form a eutectic bond with the die having a gold metallization thereon; and forming a eutectic bond between the substrate and the die comprising heating the substrate, contacting the metallized grooved surface of the substrate to the gold metallized surface of the die, scrubbing the die onto the substrate by moving the die back and forth while maintaining contact, and cooling the substrate and die. A microelectronic structure comprising a substrate and a die, wherein the substrate has grooves on a surface adapted for bonding with the die, and wherein a bond is formed between the substrate and the die.

摘要翻译： 一种用于微电子封装的衬底，包括在表面上具有用于接合的沟槽的衬底。 一种用于制备用于接合的基底的方法，包括在所述基底中形成用于接受用于接合的模具的开槽表面，其中所述凹槽具有足够的尺寸以提供基本上均匀的模头键合，但没有大到使得到 底层基材。 一种用于在基板和模具之间形成结合的方法，包括：提供基板和模具，其中所述基板具有形成在表面区域中的槽，用于接受用于结合的模具并且具有足够的金属化以与所述基板和模具形成共晶键 在其上具有金金属化的模具; 以及在所述基底和所述模具之间形成共晶粘结，包括加热所述基底，将所述基底的所述金属化带槽的表面接触所述金属模的金金属化表面，通过在保持接触的同时前后移动所述冲模将所述冲模擦洗到所述基底上， 并冷却基板和模具。 一种微电子结构，包括基板和模具，其中所述基板在适于与所述模具结合的表面上具有凹槽，并且其中在所述基板和所述模具之间形成结合。