摘要:
A purpose of the present invention is to provide a preferable separation structure of wells when a photoelectric conversion unit and a part of a peripheral circuit unit or a pixel circuit are separately formed on separate substrates and electrically connected to each other. To this end, a solid-state imaging device includes a plurality of pixels including a photoelectric conversion unit and a amplification transistor configured to amplify a signal generated by the photoelectric conversion unit; a first substrate on which a plurality of the photoelectric conversion units are disposed; and a second substrate on which a plurality of the amplification transistors are disposed. A well of a first conductivity type provided with a source region and a drain region of the amplification transistor is separated from a well, which is disposed adjacent to the well in at least one direction, of the first conductivity type provided with the source region and the drain region of the amplification transistor.
摘要:
A solid-state imaging device includes a first and second pixel regions. In the first pixel region, a photoelectric conversion unit, a floating diffusion region (FD), and a transferring transistor are provided. In the second pixel region, an amplifying transistor, and a resetting transistor are provided. A first element isolation portion is provided in the first pixel region, while a second element isolation portion is provided in the second pixel region. An amount of protrusion of an insulating film into a semiconductor substrate in the first element isolation portion is smaller, than that in the second element isolation portion.
摘要:
A method of manufacturing a solid state image pickup device having a plurality of pixels each including a photoelectric conversion region for converting light into a signal charge, and a plurality of wiring layers including first and second wiring layers. The method includes steps of forming the first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing the plurality of patterns, and forming the second wiring layer as a pattern by batch exposure processing. A connecting position along which the divided patterns are connected is arranged in a pixel area in which the plurality of pixels are arranged. The wiring included in the first wiring layer is formed by a vertical direction wiring arranged in parallel with and not crossing the connecting position in the pixel area, and the wiring included in the second wiring layer is formed by a horizontal direction wiring arranged in parallel with and crossing the connecting position in the pixel area.
摘要:
The present invention provides a solid state image sensor and a camera using such a solid state image sensor, in which all of stage registers of the shift register can be reset efficiently without increasing the number of pads and/or sensor pins. The solid state image sensor comprises a plurality of photoelectric conversion elements 31 arranged in a two-dimensional array, a vertical shift register 503 disposed in a column direction and a horizontal shift register 504 disposed in a row direction and is characterized in that a timing for controlling resetting means for a first stage register of the shift register differs from a timing for controlling a second stage register and subsequent stage registers. Further, as a concrete example, the second stage register and subsequent stage registers are rest by a pulse for driving the shift register and the first stage register is reset by a pulse in which a high level is reached only upon power ON.
摘要:
To suppress an influence exerted on an output video signal due to a high frequency noise from a scanning circuit. In a solid state image pick-up device including horizontal scanning circuits, and a vertical scanning circuit having a lower driving frequency than those of the horizontal scanning circuits which are arranged so as to be adjacent to different side portions of a square chip, pads are arranged at side portions of the chip, except for the side portions on the sides where the horizontal scanning circuits are arranged. The pads include pads through which a voltage or a ground potential is applied to active elements of pixels of a pixel region, pads through which voltages are inputted to amplifiers, and pads through which output signals of the amplifiers are outputted to the outside of the chip.
摘要:
In order to reduce the noise in the readout signal, the invention provides an image pickup apparatus comprising a pixel including a photoelectric conversion unit for converting the incident light and accumulating a resulting electrical signal, and a transfer switch reading the electrical signal accumulated in the photoelectric conversion unit or a signal based on such electrical signal, and potential control means for maintaining the potential of the signal line higher than that of the photoelectric conversion unit while the photoelectric conversion unit accumulates the electrical signal.
摘要:
There is provided an image pickup apparatus comprising two-dimensionally arrayed pixels, a plurality of read-out channels each including a read-out circuit and an amplifier circuit, a parallel-serial conversion circuit which sequentially selects pixel signals output via the plurality of read-out channels and outputs a series of pixel signals, and a clamp unit which clamps the reset level includeda in an output signal from the read-out circuit in order to remove an offset generated in each read-out channel.
摘要:
A magnetic memory includes a plurality of variable resistors arrayed as memory elements in a matrix, a plurality of bit lines each of which is arranged on each row of the matrix and connected to one terminal of each variable resistor belonging to the same row, a read circuit which detects the resistance values of the variable resistors based on currents flowing through the bit lines, and load elements connected to the bit lines independently of and in parallel with the memory elements.
摘要:
A solid-state image sensor includes a pixel region and peripheral circuit region arranged on a semiconductor substrate. The pixel region includes pixels. Each pixel includes a photoelectric conversion element and an amplification MOS transistor that outputs a signal corresponding to charges of the photoelectric conversion element to a column signal line. The peripheral circuit region includes a circuit that drives the pixel or processes the signal output to the column signal line. A resistance of a source region of the amplification MOS transistor is lower than a resistance of a drain region of the amplification MOS transistor.
摘要:
A method of manufacturing a solid state image pickup device having a plurality of pixels each including a photoelectric conversion region for converting light into a signal charge, and a plurality of wiring layers including first and second wiring layers. The method includes steps of forming the first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing the plurality of patterns, and forming the second wiring layer as a pattern by batch exposure processing. A connecting position along which the divided patterns are connected is arranged in a pixel area in which the plurality of pixels are arranged. The wiring included in the first wiring layer is formed by a vertical direction wiring arranged in parallel with and not crossing the connecting position in the pixel area, and the wiring included in the second wiring layer is formed by a horizontal direction wiring arranged in parallel with and crossing the connecting position in the pixel area.