Semiconductor device identification apparatus
    1.
    发明授权
    Semiconductor device identification apparatus 失效
    半导体器件识别装置

    公开(公告)号:US06866200B2

    公开(公告)日:2005-03-15

    申请号:US10816142

    申请日:2004-04-02

    摘要: A three-dimensional image of a semiconductor device identification pattern is obtained by measuring the distance of at least one sensor to the surface of the semiconductor device. The apparatus includes a source of radiation for deriving the distance from properties of the reflected light. A unit for determining the distance and an image processing unit are used to establish the three-dimensional picture. Positional information can be achieved in a scanning movement from motors being controlled by a control unit. By applying a threshold value, a two-dimensional image is derived and by a pattern recognition algorithm, the identification pattern can be analyzed.

    摘要翻译: 通过测量至少一个传感器到半导体器件的表面的距离来获得半导体器件识别图案的三维图像。 该装置包括用于导出与反射光的特性的距离的辐射源。 用于确定距离的单元和图像处理单元用于建立三维图像。 在通过控制单元控制的电动机的扫描运动中可以实现位置信息。 通过应用阈值,导出二维图像,并且通过模式识别算法,可以分析识别模式。

    Wafer marking
    2.
    发明授权
    Wafer marking 有权
    晶圆标记

    公开(公告)号:US06261382B1

    公开(公告)日:2001-07-17

    申请号:US09495795

    申请日:2000-02-01

    IPC分类号: H01L2930

    摘要: A wafer marking is disclosed, which is represented by a large number of soft marks incorporated into a surface of a wafer. The soft marks each have a depth of at least 4 &mgr;m, an internal diameter of at least 50 &mgr;m and, in a particularly advantageous manner, a minimum gradient their surface of 0.2. These depressions can be proded, using appropriate technology, with depths of up to &mgr;m.

    摘要翻译: 公开了一种晶片标记,其由并入晶片表面的大量软标记表示。 软标记各自具有至少4μm的深度,至少50μm的内径,并且以特别有利的方式,其表面为0.2的最小梯度。 这些凹陷可以使用适当的技术,深度达到妈妈。

    Self-supporting adaptable metrology device
    3.
    发明授权
    Self-supporting adaptable metrology device 有权
    自适应测量装置

    公开(公告)号:US06745637B2

    公开(公告)日:2004-06-08

    申请号:US10090259

    申请日:2002-03-04

    IPC分类号: G01N1900

    摘要: A metrology device is described which is couplable to a load port of a semiconductor product handling and/or processing tool. The tool encloses a mini-environmental atmosphere and has a load port table for supporting devices to be coupled to the load port. The metrology device contains a housing preserving an inner atmosphere, a coupling region for connecting the inner atmosphere to the mini-environmental atmosphere and a measuring device for measuring a property of a semiconductor product. The metrology device further has a support which is movable by a transport device and which is dimensioned such that the metrology device is self-supporting in a position appropriate for coupling the coupling region to the load port. The metrology device is thereby couplable to the load port without being supported by the load port table.

    摘要翻译: 描述了可耦合到半导体产品处理和/或处理工具的负载端口的计量装置。 该工具包含迷你环境氛围,并具有一个负载端口台,用于支持要耦合到负载端口的设备。 测量装置包括保持内部空气的壳体,用于将内部空气连接到迷你环境气氛的耦合区域和用于测量半导体产品的性质的测量装置。 测量装置还具有可由运输装置移动的支撑件,其尺寸使得计量装置在适于将联接区域耦合到负载端口的位置自支撑。 因此,测量设备可以连接到负载端口,而不受负载端口表的支持。

    Measurement configuration including a vehicle and method for performing measurements with the measurement configuration at various locations
    4.
    发明授权
    Measurement configuration including a vehicle and method for performing measurements with the measurement configuration at various locations 有权
    包括车辆的测量配置和用于在各个位置用测量配置进行测量的方法

    公开(公告)号:US06935201B2

    公开(公告)日:2005-08-30

    申请号:US10638599

    申请日:2003-08-11

    CPC分类号: H01L21/67253 H01L21/67772

    摘要: A measurement device, i.e. a metrology tool, and a vehicle are combined to provide a mobile metrology in a fabrication facility. Peripheral equipment such as a device transfer unit, for, e.g., FOUPs in semiconductor manufacturing, an electronic control system with, e.g., a PC, monitor, and keyboard and optionally a vacuum pump is also provided in module frames of the vehicle. The measurement configuration particularly reduces bottleneck situations in equipment qualifying of processing tools during fast ramp-up phases of, e.g., semiconductor manufacturing facilities, thereby saving costs. The construction is based on PGVs or AGVs and allows a fast operation directly at the location of a processing tool. With the possible exception of power supply or operator control, the measurement configuration can operate fully autonomously.

    摘要翻译: 测量装置,即计量工具和车辆被组合以在制造设施中提供移动计量。 诸如设备传送单元的外围设备,例如用于半导体制造中的FOUP,具有例如PC,监视器和键盘的电子控制系统以及可选的真空泵也被提供在车辆的模块框架中。 测量配置特别降低了例如半导体制造设备的快速上升阶段期间加工工具的设备合格性中的瓶颈情况,从而节省成本。 该结构基于PGV或AGV,并允许在加工工具的位置直接快速操作。 除了电源或操作员控制之外,测量配置可以完全自主运行。

    Noninvasive method for characterizing and identifying embedded micropatterns
    6.
    发明授权
    Noninvasive method for characterizing and identifying embedded micropatterns 有权
    用于表征和识别嵌入式微图案的无创方法

    公开(公告)号:US07262837B2

    公开(公告)日:2007-08-28

    申请号:US10877262

    申请日:2004-06-25

    IPC分类号: G01N1/00

    CPC分类号: B81C99/0035 G01N21/211

    摘要: The invention relates to a method for noninvasively characterizing embedded micropatterns which are hidden under the surface of a wafer down to 100 μm. The micropatterns are identified with reference micropatterns from a previously produced reference library with the aid of their specific ellipsometric parameters.

    摘要翻译: 本发明涉及一种用于非侵入性地表征嵌入式微图案的方法,该方法隐藏在下面至100um的晶片表面下。 借助于它们的特定椭偏参数,从先前产生的参考文献库中的参考微图案识别微图案。

    Wafer scribing method and wafer scribing device
    7.
    发明授权
    Wafer scribing method and wafer scribing device 有权
    晶圆划片方法和晶圆划线装置

    公开(公告)号:US06914006B2

    公开(公告)日:2005-07-05

    申请号:US10016633

    申请日:2001-10-30

    摘要: The present invention relates to a scribing method for wafers (11), wherein a defined beam (12) is directed onto the wafer (11) by means of a beam generator means (10) so as to remove some wafer material from a wafer region. The invention also relates to a wafer-scribing device including a wafer mount (31) and a beam generator means (10) by means of which at least one defined beam can be directed onto the wafer (11).The inventive method is distinguished by the by the further step of generating a first radiation pulse having a predeterminable energy density and used to create a comparatively deep pit (18) in the wafer (11).The inventive wafer scribing means is distinguished by the provision that a radiation pulse can be generated by means of which a comparatively deep pit (18) can be created in the wafer (11).

    摘要翻译: 本发明涉及一种用于晶片(11)的划线方法,其中通过光束发生器装置(10)将限定的光束(12)引导到晶片(11)上,以便从晶片区域中去除一些晶片材料 。 本发明还涉及包括晶片安装件(31)和光束发生器装置(10)的晶片划线装置,通过该装置可以将至少一个限定的光束引导到晶片(11)上。 本发明的方法通过进一步的步骤来产生具有可预定能量密度的第一辐射脉冲,并用于在晶片(11)中产生比较深的凹坑(18)。 本发明的晶片划线装置的区别在于可以产生辐射脉冲,借此可以在晶片(11)中产生相对较深的凹坑(18)。

    Configuration for the automatic inscription or reinscription of wafers
    8.
    发明授权
    Configuration for the automatic inscription or reinscription of wafers 有权
    自动刻录或重新刻录晶片的配置

    公开(公告)号:US6147321A

    公开(公告)日:2000-11-14

    申请号:US128387

    申请日:1998-08-03

    IPC分类号: H01L23/544 B23K26/00

    CPC分类号: H01L23/544 H01L2924/0002

    摘要: A configuration for the automatic inscription or reinscription of wafers provides the wafers with a marking for identification and for process management during the production of semiconductor components. The wafer must be moved between different stations for the automatic inscription of a wafer in an appropriate device. Considerable transport movements are saved by the integration of a read station in an inscription chamber having a positioning unit for the wafer.

    摘要翻译: 用于晶片的自动铭刻或重新标注的配置为晶片提供了用于识别标记和在半导体部件生产期间的过程管理的标记。 晶片必须在不同的工位之间移动,以便在合适的装置中自动刻录晶片。 通过将阅读站集成在具有用于晶片的定位单元的刻录室中来节省相当多的运输运动。