Abstract:
A method for detecting cut data lines in an imaging array having a detector including an array of pixels for measuring radiation, and a plurality of data line contacts is provided. The method includes the steps of initializing pixels of the imaging array which includes a plurality of data lines including at least one uncut data line and at least one cut data line, wherein each cut data line is electrically connected to at least one of the plurality of data line contacts and at least one uncommitted contact. The method further includes determining a signal level for the uncut data lines, measuring a signal level of each data line in the plurality of data lines, and determining a number of cut data lines and a number of uncut data lines by using the signal levels received from each data line in the plurality of data.
Abstract:
Redundancy is provided in the data and gate lines of the liquid crystal display device for improved reliability and greater fabrication yield. The data lines in particular are preferably fabricated in a multilayer structure with two conductive layers sandwiching a narrow insulating strip. The presence of the insulating strip permits the upper conductive line to be formed without step jumps which can exhibit a tendency for poor electrical connection. The upper and lower conductive layers of the data line are in contact for the length of the lower data line, contact being made on either side of the narrower insulating strip. Similar redundancy, without the necessity of providing an intermediary insulating layer is also provided for the gate lines. The redundancy provided in the present invention is particularly suitable for fabrication methods employed in thin film FET driven LCD devices.
Abstract:
A device for illuminating, as well as enhancing contrast of, reflective dichroic liquid crystal displays utilizes a polarizing member extending across the thickness of a wedge illuminator. The light emitted from the wedge illuminator is polarized in a single direction, perpendicular to the elongated direction of the dichroic dye molecules in the light-transmitting areas of the display cell.
Abstract:
A method of fabricating a high density thin film circuit includes the step of bonding a high density connector having a plurality of electrical connection lines with a wafer having a plurality of electrical contact pads arranged in a pattern with a pitch less than about 100 .mu.m so that an electrical coupling is formed between the wafer contact pads and connector electrical connection lines. The step of forming the electrical coupling comprises pyrolysis of an adhesive disposed between the high density connector and said wafer. The electrical coupling between the contact pads and electrical connection lines is formed by directing a laser beam on the area in which the electrical coupling is to be formed so as to cause thermal decomposition of the adhesive to form a conductive carbon material; portions of the wafer contact pads and the connector electrical connection lines are also welded to the conductive carbon material.
Abstract:
In a liquid crystal display, and more particularly, in a thin film transistor matrix addressed liquid crystal display, a method and means are provided for assuring the presence of a constant RMS voltage waveform on the data lines. This eliminates uncertainty in the voltage levels on a pixel element caused by parasitic capacitance effects between the data lines and the pixel electrodes. The present invention is also particularly applicable to both binary level and gray scale level devices. Means for carrying out the present method are illustrated in both analog and digital form.
Abstract:
An enhanced manufacturing yield of a high resolution, high accuracy information conversion device, such as a liquid crystal display, is attained through incorporation into the device of auxiliary address lines. Such auxiliary address lines are used to provide electrical communication with portions of main address lines that, due to the presence of electrical open circuits, would otherwise be electrically isolated. Each auxiliary address line crosses over multiple main address lines and can be electrically shorted to any such main address line to provide electrical communication therewith. The ratio of auxiliary address lines to main address lines is accordingly low, such as 1:10 or less, for example.
Abstract:
A laminated capacitive touch-pad having a thin film touch-plate electrode deposited upon a first (exterior) surface of a first, relatively thin dielectric layer and having spaced transmitter and receiver electrodes deposited upon a second surface of the first layer within the outline of and opposite to the touch electrode, with a relatively thick backing layer of dielectric material laminated upon the second surface to provide a total thickness, as measured between the furthest opposed surfaces of the first and second layers, as required for high voltage insulation purposes and to provide additional impact strength. The touch, transmitter and receiver electrodes may be of thin film construction.
Abstract:
A method of forming a planar photosensitive device, such as an array of APDs, includes the steps of doping a substantially planar block of n type semiconductor material with a p type dopant in accordance with a selected pattern to form a plurality of p type wells in the block surrounded by a foundation of n type semiconductor material. Each p type well corresponds to an APD pixel and is disposed so as to respectively adjoin a first surface of the block and such that a respective p-n junction is formed between the p type material in the well and the n type material foundation. Each APD pixel further comprises depletion layer profile modification means such that the peak surface electric field of the p-n junction in each well is substantially less than the bulk electric field of the same p-n junction. One type of depletion layer profile modification means is an peripheral doped region of p material disposed around each respective well; an alternative depletion layer profile modification means is a respective isolation moat around each well so as to separate p type material in the well from n type material in the foundation except along a parallel plane segment of the p-n junction.
Abstract:
A method of forming a planar semiconductor device, such as an array of APDs, includes the steps of doping a substantially planar block of n type semiconductor material with a p type dopant in accordance with a selected pattern to form a plurality of n type wells in the block surrounded by a foundation of p type semiconductor material. Each n type well is disposed so as to respectively adjoin a first surface of the block and such that a respective p-n junction is formed between the n type material in the well and the p type material foundation. The n type semiconductor material in each well has a substantially constant concentration of n type dopant throughout the n type material; the concentration of p type dopant in the foundation has a positive gradient extending from the p-n junction towards the second surface such that the peak surface electric field of the p-n junction in each well is less than the bulk electric field of the same p-n junction.
Abstract:
A planar photosensitive device, such as an array of APDs, includes a planar block of n type semiconductor material having a plurality of p type wells in the block surrounded by a foundation of n type semiconductor material. Each p type well corresponds to an APD pixel and is disposed so as to respectively adjoin a first surface of the block and such that a respective p-n junction is formed between the p type material in the well and the n type material foundation. Each APD pixel further comprises depletion layer profile modification means such that the peak surface electric field of the p-n junction in each well is substantially less than the bulk electric field of the same p-n junction. One type of depletion layer profile modification means is a peripheral doped region of p material disposed around each respective well; an alternative depletion layer profile modification means is a respective isolation moat around each well so as to separate p type material in the well from n type material in the foundation except along a parallel plane segment of the p-n junction.