COOLING SYSTEMS AND METHODS FOR INTEGRATED ELECTRIC MOTOR-INVERTERS
    2.
    发明申请
    COOLING SYSTEMS AND METHODS FOR INTEGRATED ELECTRIC MOTOR-INVERTERS 有权
    集成电动机转子冷却系统及方法

    公开(公告)号:US20090206687A1

    公开(公告)日:2009-08-20

    申请号:US12032359

    申请日:2008-02-15

    IPC分类号: H02K9/00 F25D17/02

    CPC分类号: H02K9/20

    摘要: Cooling systems and methods are provided for an integrated electric motor-inverter, where the integrated electric motor-inverter includes a housing, a motor, and an inverter, the motor and the inverter are disposed within the housing, and the motor includes a stator. The system includes a cooling jacket, a first coolant, a condenser, a spray head, and a second coolant. The cooling jacket is disposed concentric to the stator and includes an inner wall and an outer wall. The inner wall is in direct contact with the stator. The first coolant is disposed between the cooling jacket inner and outer walls. The condenser is disposed concentric to the cooling jacket. The spray head is disposed adjacent the inverter. The second coolant is in flow communication with the spray head.

    摘要翻译: 为集成电动机 - 逆变器提供冷却系统和方法,其中集成电动机 - 逆变器包括壳体,电动机和逆变器,电动机和逆变器设置在壳体内,并且电动机包括定子。 该系统包括冷却套,第一冷却剂,冷凝器,喷头和第二冷却剂。 冷却套与所述定子同心地设置,并且包括内壁和外壁。 内壁与定子直接接触。 第一冷却剂设置在冷却套内壁和外壁之间。 冷凝器与冷却套筒同心设置。 喷头靠近逆变器设置。 第二冷却剂与喷头流体连通。

    COOLING SYSTEMS FOR POWER SEMICONDUCTOR DEVICES
    3.
    发明申请
    COOLING SYSTEMS FOR POWER SEMICONDUCTOR DEVICES 有权
    功率半导体器件冷却系统

    公开(公告)号:US20090032937A1

    公开(公告)日:2009-02-05

    申请号:US12178489

    申请日:2008-07-23

    IPC分类号: H01L23/34 F28F7/00

    摘要: A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction.

    摘要翻译: 提供一种用于液体冷却功率半导体器件的冷却装置。 该装置包括用于将液体冷却剂引导到功率半导体器件的冷却剂分流器。 冷却剂分流器具有用于将冷却剂分流器分成第一腔和第二腔的第一板。 位于功率半导体器件附近的第二腔。 第一板还包括用于将第一空腔与第二空腔流体耦合的开口,使得液体冷却剂通过第一板中的开口流入第一空腔,并进入第二腔以冷却功率半导体器件。 第一腔体具有在下游方向上大致减小的横截面积,并且第二腔体具有在下游方向上大致增加的横截面面积。

    Power module having self-contained cooling system
    5.
    发明授权
    Power module having self-contained cooling system 有权
    电源模块具有独立的冷却系统

    公开(公告)号:US07450378B2

    公开(公告)日:2008-11-11

    申请号:US11552564

    申请日:2006-10-25

    IPC分类号: H05K7/20 H01L23/36

    摘要: A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.

    摘要翻译: 半导体模块包括其中具有空腔的壳体和位于空腔内的至少一个半导体器件。 冷却系统被容纳在壳体内并且包括设置在壳体内的介电流体和设置穿过壳体的流动通道。 流动通道流体地联接到空腔,并且冷却系统被配置为使介电流体通过流动通道循环到至少一个半导体器件上。

    POWER MODULE HAVING SELF-CONTAINED COOLING SYSTEM
    6.
    发明申请
    POWER MODULE HAVING SELF-CONTAINED COOLING SYSTEM 有权
    具有自含冷却系统的电源模块

    公开(公告)号:US20080101013A1

    公开(公告)日:2008-05-01

    申请号:US11552564

    申请日:2006-10-25

    IPC分类号: H05K7/20

    摘要: A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.

    摘要翻译: 半导体模块包括其中具有空腔的壳体和位于空腔内的至少一个半导体器件。 冷却系统被容纳在壳体内并且包括设置在壳体内的介电流体和设置穿过壳体的流动通道。 流动通道流体地联接到空腔,并且冷却系统被配置为使介电流体通过流动通道循环到至少一个半导体器件上。

    Cooling systems for power semiconductor devices
    7.
    发明授权
    Cooling systems for power semiconductor devices 有权
    功率半导体器件的冷却系统

    公开(公告)号:US07884468B2

    公开(公告)日:2011-02-08

    申请号:US12178489

    申请日:2008-07-23

    IPC分类号: H01L23/34

    摘要: A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction.

    摘要翻译: 提供一种用于液体冷却功率半导体器件的冷却装置。 该装置包括用于将液体冷却剂引导到功率半导体器件的冷却剂分流器。 冷却剂分流器具有用于将冷却剂分流器分成第一腔和第二腔的第一板。 位于功率半导体器件附近的第二腔。 第一板还包括用于将第一空腔与第二空腔流体耦合的开口,使得液体冷却剂通过第一板中的开口流入第一空腔,并进入第二腔以冷却功率半导体器件。 第一腔体具有在下游方向上大致减小的横截面积,并且第二腔体具有在下游方向上大致增加的横截面面积。

    Consistent retraction device for disc brake calipers
    9.
    发明授权
    Consistent retraction device for disc brake calipers 失效
    盘式制动卡钳一贯缩回装置

    公开(公告)号:US06378664B1

    公开(公告)日:2002-04-30

    申请号:US09514731

    申请日:2000-02-28

    IPC分类号: F16D5522

    摘要: A retraction device for a disc brake caliper is provided having brake pads actuated by hydraulic fluid. The device includes a housing having a bore that defines an axis. A piston is disposed within the bore and is movable along the axis between applied and retracted positions. The piston includes an apply end adapted to coact with the brake pads in the applied position and a hydraulic end opposite the apply end. A hydraulic chamber is defined by the bore and the hydraulic end and contains hydraulic fluid for generating a brake pressure to achieve the applied position. An annular groove is formed in the bore adjacent to the piston, and the annular groove includes a forward angled surface. A resilient seal is disposed within the annular groove for retracting the piston from the applied position to the retracted position. The resilient seal has a first side adjacent the forward angled surface and a second side opposite the first side. A pressure mechanism is arranged adjacent to the second side and is in communication with the hydraulic chamber for generating a retaining pressure to retain the resilient seal against the forward angled surface in response to the brake pressure. The pressure mechanism releases the retaining pressure to permit the resilient seal to retract the piston when below the brake pressure.

    摘要翻译: 提供了一种用于盘式制动钳的回退装置,其具有由液压流体驱动的制动衬片。 该装置包括具有限定轴线的孔的壳体。 活塞设置在孔内并且可以在施加位置和缩回位置之间沿轴线移动。 活塞包括适于在施加位置处与制动衬片共同作用的施加端和与施加端相对的液压端。 液压室由孔和液压端限定,并且包含用于产生制动压力以获得施加位置的液压流体。 在与活塞相邻的孔中形成环形槽,并且环形槽包括前倾角表面。 弹性密封件设置在环形槽内,用于将活塞从施加位置缩回到缩回位置。 弹性密封件具有邻近前倾角表面的第一侧和与第一侧相对的第二侧。 压力机构被布置成与第二侧相邻并且与液压室连通以产生保持压力,以响应于制动压力将弹性密封件保持抵靠前倾斜的表面。 压力机构释放保持压力,以允许弹性密封件在低于制动压力时缩回活塞。