公开(公告)号：US20110133300A1

公开(公告)日：2011-06-09

申请号：US12927670

申请日：2010-11-19

Applicant: Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

Inventor： Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

IPC: H01L29/82

CPC classification number: H01L43/12 ,  G11C11/161 ,  H01L43/08

Abstract: A multi-layered bottom electrode for an MTJ device on a silicon nitride substrate is described. It comprises a bilayer of alpha tantalum on ruthenium which in turn lies on a nickel chrome layer over a second tantalum layer.

Abstract translation: 描述了用于氮化硅衬底上的MTJ器件的多层底电极。 它包括在钌上的α钽的双层，其又位于第二钽层上的镍铬层上。

公开(公告)号：US20110076785A1

公开(公告)日：2011-03-31

申请号：US12927615

申请日：2010-11-19

Applicant: Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

Inventor： Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

IPC: H01L21/00

CPC classification number: H01L43/12 ,  G11C11/161 ,  H01L43/08

Abstract: Formation of a bottom electrode for an MTJ device on a silicon nitride substrate is facilitated by including a protective coating that is partly consumed during etching of the alpha tantalum portion of said bottom electrode. Adhesion to SiN is enhanced by using a TaN/NiCr bilayer as “glue”.

Abstract translation: 在氮化硅衬底上形成用于MTJ器件的底部电极通过包括在所述底部电极的α钽部分的蚀刻期间部分消耗的保护涂层来促进。 通过使用TaN / NiCr双层作为“胶”来增强对SiN的附着力。

公开(公告)号：US07838436B2

公开(公告)日：2010-11-23

申请号：US11528877

申请日：2006-09-28

Applicant: Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

Inventor： Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

IPC: H01L21/302 ,  H01L21/461

CPC classification number: H01L43/12 ,  G11C11/161 ,  H01L43/08

Abstract: Formation of a bottom electrode for an MTJ device on a silicon nitride substrate is facilitated by including a layer of ruthenium near the silicon nitride surface. The ruthenium is a good electrical conductor and it responds differently from Ta and TaN to certain etchants. Adhesion to SiN is enhanced by using a TaN/NiCr bilayer as “glue”. Thus, said included layer of ruthenium may be used as an etch stop layer during the etching of Ta and/or TaN while the latter materials may be used to form a hard mask for etching the ruthenium without significant corrosion of the silicon nitride surface.

Abstract translation: 通过在氮化硅表面附近包括一层钌来促进在氮化硅衬底上形成用于MTJ器件的底部电极。 钌是良好的电导体，并且它对Ta和TaN的反应与某些蚀刻剂不同。 通过使用TaN / NiCr双层作为“胶”来增强对SiN的附着力。 因此，所述包含的钌层可以在蚀刻Ta和/或TaN期间用作蚀刻停止层，而后者可用于形成用于蚀刻钌的硬掩模，而不会对氮化硅表面产生显着的腐蚀。

公开(公告)号：US08969982B2

公开(公告)日：2015-03-03

申请号：US12927670

申请日：2010-11-19

Applicant: Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

Inventor： Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

IPC: H01L29/82 ,  H01L43/12 ,  H01L43/08

CPC classification number: H01L43/12 ,  G11C11/161 ,  H01L43/08

Abstract: A multi-layered bottom electrode for an MTJ device on a silicon nitride substrate is described. It comprises a bilayer of alpha tantalum on ruthenium which in turn lies on a nickel chrome layer over a second tantalum layer.

Abstract translation: 描述了用于氮化硅衬底上的MTJ器件的多层底电极。 它包括在钌上的α钽的双层，其又位于第二钽层上的镍铬层上。

公开(公告)号：US08273666B2

公开(公告)日：2012-09-25

申请号：US12927615

申请日：2010-11-19

Applicant: Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

Inventor： Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

IPC: H01L21/302 ,  H01L21/461

CPC classification number: H01L43/12 ,  G11C11/161 ,  H01L43/08

Abstract: Formation of a bottom electrode for an MTJ device on a silicon nitride substrate is facilitated by including a protective coating that is partly consumed during etching of the alpha tantalum portion of said bottom electrode. Adhesion to SiN is enhanced by using a TaN/NiCr bilayer as “glue”.

Abstract translation: 在氮化硅衬底上形成用于MTJ器件的底部电极通过包括在所述底部电极的α钽部分的蚀刻期间部分消耗的保护涂层来促进。 通过使用TaN / NiCr双层作为“胶”来增强对SiN的附着力。

公开(公告)号：US20080090307A1

公开(公告)日：2008-04-17

申请号：US11528877

申请日：2006-09-28

Applicant: Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

Inventor： Rongfu Xiao ,  Cheng T. Horng ,  Ru-Ying Tong ,  Chyu-Jinh Torng ,  Tom Zhong ,  Witold Kula ,  Terry Kin Ting Ko ,  Wei Cao ,  Wai-Ming J. Kan ,  Liubo Hong

IPC: H01L21/00

CPC classification number: H01L43/12 ,  G11C11/161 ,  H01L43/08

Abstract: Formation of a bottom electrode for an MTJ device on a silicon nitride substrate is facilitated by including a layer of ruthenium near the silicon nitride surface. The ruthenium is a good electrical conductor and it responds differently from Ta and TaN to certain etchants. Adhesion to SiN is enhanced by using a TaN/NiCr bilayer as “glue”. Thus, said included layer of ruthenium may be used as an etch stop layer during the etching of Ta and/or TaN while the latter materials may be used to form a hard mask for etching the ruthenium without significant corrosion of the silicon nitride surface.

Abstract translation: 通过在氮化硅表面附近包括一层钌来促进在氮化硅衬底上形成用于MTJ器件的底部电极。 钌是良好的电导体，并且它对Ta和TaN的反应与某些蚀刻剂不同。 通过使用TaN / NiCr双层作为“胶”来增强对SiN的附着力。 因此，所述包含的钌层可以在蚀刻Ta和/或TaN期间用作蚀刻停止层，而后者可用于形成用于蚀刻钌的硬掩模，而不会对氮化硅表面产生显着的腐蚀。