公开(公告)号：US07635746B2

公开(公告)日：2009-12-22

申请号：US10525671

申请日：2004-01-20

申请人： Jae Min Oh ,  Bum Jin Lee ,  Moo Young Lee ,  O Bum Kwon ,  Joon Suk Oh ,  Dong Won Park ,  Chul Hee Kim

发明人： Jae Min Oh ,  Bum Jin Lee ,  Moo Young Lee ,  O Bum Kwon ,  Joon Suk Oh ,  Dong Won Park ,  Chul Hee Kim

IPC分类号： C08G69/08

CPC分类号： C07D251/20 ,  C07D251/30 ,  C08G73/1042 ,  C08G73/106 ,  C08G73/1085 ,  G02F1/133723 ,  Y10T428/10 ,  Y10T428/1005 ,  Y10T428/31721

摘要： Diamine compound containing specific triazine group, polyamic acid obtained by reacting the diamine compound and tetracarboxylic dianhydride, and liquid crystal alignment film obtained by coating and imidizing the polyamic acid. The liquid crystal alignment film has good heat-resistance, high transparency in visible light region and improved voltage holding ratio. Also, pretilt angle is easily controlled over broad range.

摘要翻译： 含有特定三嗪基的二胺化合物，二胺化合物和四羧酸二酐反应得到的聚酰胺酸，以及通过对聚酰胺酸进行酰亚胺化得到的液晶取向膜。 液晶取向膜具有良好的耐热性，可见光区域的高透明度和电压保持率的提高。 此外，预倾角容易控制在宽范围内。

公开(公告)号：US06764698B1

公开(公告)日：2004-07-20

申请号：US09806287

申请日：2001-03-28

申请人： Young-Ro Byun ,  Sang-Yoon Kim ,  Sun-Hee Kim ,  Yong-Doo Choi ,  In-Suk Han ,  Kwang-Sun Lee ,  Chul-Hee Kim

发明人： Young-Ro Byun ,  Sang-Yoon Kim ,  Sun-Hee Kim ,  Yong-Doo Choi ,  In-Suk Han ,  Kwang-Sun Lee ,  Chul-Hee Kim

IPC分类号： A61K914

CPC分类号： A61K9/1647

摘要： The present invention relates to a controlled drug release system in which a certain ratio or retinoic acid is incorporated into a microsphere comprising biodegradable polymer and amphoteric block copolymer having both hydrophilic and hydrophobic groups.

摘要翻译： 本发明涉及一种受控药物释放系统，其中将一定比例或视黄酸引入包含具有亲水和疏水基团的可生物降解聚合物和两性嵌段共聚物的微球体中。

公开(公告)号：US5472554A

公开(公告)日：1995-12-05

申请号：US212896

申请日：1994-03-15

申请人： Kyoun-hee Ko ,  Il-ho Kim ,  Chul-hee Kim ,  Woung-Kwan An

发明人： Kyoun-hee Ko ,  Il-ho Kim ,  Chul-hee Kim ,  Woung-Kwan An

IPC分类号： H01L21/677 ,  B65H35/00 ,  B65H37/04 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/308 ,  B32B35/00 ,  B32B31/10 ,  B32B31/18

CPC分类号： H01L21/67132 ,  B65H35/0013 ,  B65H37/04 ,  H01L21/6836 ,  H01L2221/68327 ,  Y10T156/1052 ,  Y10T156/108 ,  Y10T156/12 ,  Y10T156/1343 ,  Y10T156/1712 ,  Y10T156/1734 ,  Y10T156/1741

摘要： A masking film adhering method and apparatus for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table. The wafer can be accurately placed onto the cutting location of the masking film tape, to prevent the wafer from being damaged by the cutter.

摘要翻译： 一种用于平滑地和准确地传送掩模胶带的掩模膜粘附方法和装置，其中晶片粘附到掩模膜被切割的切割位置。 通过使掩蔽胶片带和晶片通过上下粘合辊将晶片粘贴到掩膜胶带上。 然后，从切割台上分离掩模胶片带，使得具有粘贴在其上的晶片的掩模胶片带可能通过在晶片完全通过粘合辊时向上移动上粘合辊而不会附着到切割台上 。 在将掩模膜输送到切割位置之后，保持掩模膜和切割台之间的预定距离，沿着晶片的形状切割掩模胶片带。 防止由于晶片的重量而导致的掩模膜的凹陷，避免了掩模膜带与切割台的粘合。 可以将晶片准确地放置在掩模胶片带的切割位置上，以防止晶片被切割器损坏。

公开(公告)号：US20080257647A1

公开(公告)日：2008-10-23

申请号：US12091797

申请日：2006-11-07

申请人： Chul-Hee Kim ,  Seung-Lak Son

发明人： Chul-Hee Kim ,  Seung-Lak Son

IPC分类号： B21B27/10

CPC分类号： B21B27/10 ,  B21B38/04 ,  B21B45/0251

摘要： A lubricant supply apparatus for endless hot rolling equipment includes a width-detecting sensor for detecting widths of steel sheets continuously supplied toward a roller, a controller connected to the width-detecting sensor, a lubricant pump connected to and controlled by the controller to supply a lubricant to a lubricant line, solenoid valves disposed on sub lines formed by dividing the lubricant line and controlled by the controller to supply or cut off the lubricant, a water pump connected to and controlled by the controller to supply water to a water line, mixers for mixing the lubricant and the water supplied to the water line for each of the sub lines, and nozzles connected respectively to the mixers and disposed according to a width of the roller so as to spray a mixture onto the roller according to the widths of the steel sheets.

摘要翻译： 用于环形热轧设备的润滑剂供应装置包括：宽度检测传感器，用于检测连续向辊供给的钢板的宽度，连接到宽度检测传感器的控制器，连接到控制器并由控制器控制的润滑剂泵， 润滑剂线路的润滑剂，设置在通过分配润滑剂管线并由控制器控制以供应或切断润滑剂的副管线上的电磁阀，连接到控制器并由控制器控制以向水管线供水的水泵，混合器 用于将润滑剂和供应到每个子管线的水管线的水以及分别连接到混合器并且根据辊的宽度设置的喷嘴混合，以便根据辊的宽度将混合物喷射到辊上 钢板。

公开(公告)号：US08096159B2

公开(公告)日：2012-01-17

申请号：US12091797

申请日：2006-11-07

申请人： Chul-Hee Kim ,  Seung-Lak Son

发明人： Chul-Hee Kim ,  Seung-Lak Son

IPC分类号： B21B27/06

CPC分类号： B21B27/10 ,  B21B38/04 ,  B21B45/0251

摘要： A lubricant supply apparatus for endless hot rolling equipment includes a width-detecting sensor for detecting widths of steel sheets continuously supplied toward a roller, a controller connected to the width-detecting sensor, a lubricant pump connected to and controlled by the controller to supply a lubricant to a lubricant line, solenoid valves disposed on sub lines formed by dividing the lubricant line and controlled by the controller to supply or cut off the lubricant, a water pump connected to and controlled by the controller to supply water to a water line, mixers for mixing the lubricant and the water supplied to the water line for each of the sub lines, and nozzles connected respectively to the mixers and disposed according to a width of the roller so as to spray a mixture onto the roller according to the widths of the steel sheets.

摘要翻译： 用于环形热轧设备的润滑剂供应装置包括：宽度检测传感器，用于检测连续向辊供给的钢板的宽度，连接到宽度检测传感器的控制器，连接到控制器并由控制器控制的润滑剂泵 润滑剂线路的润滑剂，设置在通过分配润滑剂管线并由控制器控制以供应或切断润滑剂的副管线上的电磁阀，连接到控制器并由控制器控制以向水管供水的水泵，混合器 用于将润滑剂和供应到每个子管线的水管线的水以及分别连接到混合器并且根据辊的宽度设置的喷嘴混合，以便根据辊的宽度将混合物喷射到辊上 钢板。

公开(公告)号：US07635859B2

公开(公告)日：2009-12-22

申请号：US11318533

申请日：2005-12-28

申请人： Sang Kyun Lee ,  Won Jae Joo ,  Chul Hee Kim ,  Yoon Sok Kang

发明人： Sang Kyun Lee ,  Won Jae Joo ,  Chul Hee Kim ,  Yoon Sok Kang

IPC分类号： H01L51/05

CPC分类号： G11C13/0014 ,  B82Y10/00 ,  G11C13/0009 ,  G11C13/0016 ,  G11C13/0069 ,  G11C2013/009 ,  G11C2213/15 ,  G11C2213/77 ,  G11C2213/80

摘要： A memory device including an organic material layer between an upper electrode and a lower electrode. The organic material layer includes a dendrimer containing at least one electron-donating group and at least one electron-accepting group. The disclosed memory device is advantageous in that it shows a nonvolatile property, has high integration density and low power consumption characteristics, and may be inexpensively fabricated through a simple process.

摘要翻译： 一种存储器件，包括在上电极和下电极之间的有机材料层。 有机材料层包括含有至少一个给电子基团和至少一个电子接受基团的树枝状聚合物。 所公开的存储器件的优点在于其显示非易失性特性，具有高的集成密度和低功耗特性，并且可以通过简单的工艺廉价地制造。

公开(公告)号：US5688354A

公开(公告)日：1997-11-18

申请号：US445857

申请日：1995-05-22

申请人： Kyoun-hee Ko ,  Il-ho Kim ,  Chul-hee Kim ,  Woung-kwan An

发明人： Kyoun-hee Ko ,  Il-ho Kim ,  Chul-hee Kim ,  Woung-kwan An

IPC分类号： H01L21/677 ,  B65H35/00 ,  B65H37/04 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/308 ,  B32B31/18

CPC分类号： H01L21/67132 ,  B65H35/0013 ,  B65H37/04 ,  H01L21/6836 ,  H01L2221/68327 ,  Y10T156/1052 ,  Y10T156/108 ,  Y10T156/12 ,  Y10T156/1343 ,  Y10T156/1712 ,  Y10T156/1734 ,  Y10T156/1741

摘要： A masking film adhering method for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table. The wafer can be accurately placed onto the cutting location of the masking film tape, to prevent the wafer from being damaged by the cutter.

摘要翻译： 一种用于平滑且精确地输送将晶片粘附到掩模膜被切割的切割位置的掩模膜带的掩模膜粘附方法。 通过使掩蔽胶片带和晶片通过上下粘合辊将晶片粘贴到掩膜胶带上。 然后，从切割台上分离掩模胶片带，使得具有粘贴在其上的晶片的掩模胶片带可能通过在晶片完全通过粘合辊时向上移动上粘合辊而不会附着到切割台上 。 在将掩模膜输送到切割位置之后，保持掩模膜和切割台之间的预定距离，沿着晶片的形状切割掩模胶片带。 防止由于晶片的重量而导致的掩模膜的凹陷，避免了掩模膜带与切割台的粘合。 可以将晶片准确地放置在掩模胶片带的切割位置上，以防止晶片被切割器损坏。