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公开(公告)号：US10450487B2
公开(公告)日：2019-10-22
申请号：US15562719
申请日：2016-02-26
申请人： CEMEDINE CO., LTD.
发明人： Tomonori Saito
IPC分类号： C09J175/04 , C09J11/06 , C08G18/08 , C08K5/5419 , C09D5/02 , C09J175/06 , C09J175/08
摘要： Provided is a one-part water-based adhesive composition which suffers no yellowing and is excellent in adhesiveness and durability. The one-part water-based adhesive composition includes (A) an aqueous dispersion of a polyurethane resin and (B) a silane compound obtained by reacting a specific epoxysilane compound with an aminosilane compound represented by the following Formula (2), the amount of the epoxysilane compound being in the range of 1.5 to 10 mol per 1 mol of the aminosilane compound, at a reaction temperature of 40 to 100° C. (In Formula (2), R7 to R12 are each a hydrogen atom or an alkyl group, R13 is a monovalent hydrocarbon group, R14 is an alkyl group, and b is 0 or 1.)
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公开(公告)号：US11827818B2
公开(公告)日：2023-11-28
申请号：US17675595
申请日：2022-02-18
申请人： CEMEDINE CO., LTD.
CPC分类号： C09J4/00
摘要： A photocurable composition which has excellent storage stability and is cured rapidly in bonding an opaque material, and a product. The photocurable composition contains (A) a compound having an unsaturated double bond, (B) at least one compound selected from the group consisting of compounds represented by the general formulae (1), (2), and (3), and (C) a sensitizer. In the general formulae (1), (2), and (3), R1 to R3 are each independently a substituent containing at least one group selected from the group consisting of a nitro group, a cyano group, a hydroxy group, an acetyl group, a carbonyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, an unsubstituted or substituted aryl group, an unsubstituted or substituted aryloxy group, a heterocyclic ring structure-containing group, and a group having a plurality of rings.
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3.发明授权公开(公告)号：US11618839B2
公开(公告)日：2023-04-04
申请号：US16315788
申请日：2017-07-07
发明人： Daisuke Makino , Atsuhiko Suzuki , Yuusuke Murachi , Katsutoshi Ando , Koji Oda
IPC分类号： C09J163/00 , C09J5/06 , C09J11/08
摘要： Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa·s) when a shearing speed is 5 (sec−1) and is from 1 to 30 (Pa·s) when the shearing speed is 200 (sec−1).
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公开(公告)号：US20180298239A1
公开(公告)日：2018-10-18
申请号：US15568568
申请日：2016-04-22
申请人： CEMEDINE CO., LTD.
摘要： Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a Si—F bond-containing silicon compound, and (D) a photobase generator.
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5.发明申请公开(公告)号：US20210277294A1
公开(公告)日：2021-09-09
申请号：US16315788
申请日：2017-07-07
发明人： Daisuke MAKINO , Atsuhiko SUZUKI , Yuusuke MURACHI , Katsutoshi ANDO , Koji ODA
IPC分类号： C09J163/00 , C09J5/06 , C09J11/08
摘要： Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa·s) when a shearing speed is 5 (sec−1) and is from 1 to 30 (Pa·s) when the shearing speed is 200 (sec−1).
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公开(公告)号：US20210102101A1
公开(公告)日：2021-04-08
申请号：US16497552
申请日：2018-03-23
发明人： Daisuke MAKINO , Atsuhiko SUZUKI , Yusuke MURACHI , Motoyasu ASAKAWA , Katsuya HIMURO , Kenichi YAMAMOTO
摘要： Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.
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公开(公告)号：US20190225795A1
公开(公告)日：2019-07-25
申请号：US16314037
申请日：2017-06-23
申请人： CEMEDINE CO., LTD.
发明人： Shingo YANO , Satoshi YOSHIKAWA , Naomi OKAMURA
IPC分类号： C08L63/00
摘要： Provided is a novel curable composition that is a two-pack type curable composition that includes an epoxy resin and a crosslinkable silicon group-containing organic polymer, excels in storage stability, and does not experience curing delays, an increase in viscosity of the base material, or the deterioration of the base material such as gelation or the deposition of insoluble material. Also provided is a novel curable composition that excels in storage stability even when water is added to improve deep portion curability. A two-pack type epoxy composition according to the present invention contains: a base material that includes (A) an epoxy resin, (B) a compound having an Si—F bond, and (C) an alkoxysilane not having at least one group selected from the group consisting of a primary amino group, a secondary amino group, and a mercapto group; and a curing agent that includes (D) a crosslinkable silicon group-containing organic polymer, and (E) a tertiary amine compound.
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公开(公告)号：US20160312089A1
公开(公告)日：2016-10-27
申请号：US15103492
申请日：2014-12-12
申请人： CEMEDINE CO., LTD.
发明人： Shouma KOUNO , Hiroshi YAMAGA , Naomi OKAMURA , Atsushi SAITO
IPC分类号： C09J171/02
CPC分类号： C09J171/02 , C08F230/08 , C08G18/289 , C08G18/718 , C08G18/8064 , C08G63/00 , C08G65/336 , C08G77/26 , C08G77/46 , C08L43/04 , C08L71/02 , C08L75/00 , C08L101/10 , C09J4/06 , C09J133/00 , C09J133/14 , C09J183/12 , C09J201/10
摘要： The present invention provides a curable composition containing an organic polymer having a crosslinkable silicon group, the composition having sufficient usable life and having adhesive properties with respect to an adherend (substrate) that are equivalent to those of the case where aminosilane is included. The composition comprises: (A) a crosslinkable silicon group-containing organic polymer; and (B) a crosslinkable silicon group-containing compound that forms, by means of light, at least one type of amino group selected from the group consisting of primary amino groups and secondary amino groups. The crosslinkable silicon group-containing organic polymer (A) is preferably at least one type selected from the group consisting of crosslinkable silicon group-containing polyoxyalkylene polymers and crosslinkable silicon group-containing (meth)acrylic-based polymers.
摘要翻译： 本发明提供一种含有交联性硅基团的有机聚合物的固化性组合物，该组合物相对于包含氨基硅烷的情况相当于被粘物（基材）具有足够的使用寿命和粘合性。 该组合物包含：（A）可交联的含硅基团的有机聚合物; 和（B）通过光形成至少一种选自伯氨基和仲氨基的氨基的可交联硅基化合物。 含交联性硅基的有机聚合物（A）优选为选自由含交联性硅基的聚氧化烯聚合物和含交联性硅基的（甲基）丙烯酸类聚合物组成的组中的至少一种。
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公开(公告)号：US20160152783A1
公开(公告)日：2016-06-02
申请号：US14905580
申请日：2014-07-11
申请人： CEMEDINE CO., LTD.
发明人： Hiroshi YAMAGA , Naomi OKAMURA , Yutaka WATANABE , Ryosuke ASAI , Shouma KOUNO , Atsushi SAITO
IPC分类号： C08J3/28 , C08L33/14 , C09D133/14 , C09J133/14 , C09D171/02 , C08L71/02 , C09J171/02
摘要： A rapid-curing photocurable composition exerting excellent adhesion performance even with a low cumulative light quantity and being curable in a short time, thus ensuring excellent workability, is provided. A photocurable composition is made to includes: (A) a crosslinkable silicon group-containing organic polymer; (B) a photobase generator; and (C1) a silicon compound having an Si—F bond and/or (C2) one or more fluorine-based compounds selected from the group consisting of boron trifluoride, a boron trifluoride complex, a fluorinating agent, and an alkali metal salt of a polyfluoro compound. The (B) photobase generator is preferably a photolatent tertiary amine.
摘要翻译： 快速固化的光固化性组合物即使在低的累积光量下也具有优异的粘合性能，并且在短时间内可固化，因此确保了优异的可加工性。 可光固化组合物包括：（A）可交联的含硅基团的有机聚合物; （B）光产生器; 和（C1）具有Si-F键的硅化合物和/或（C2）一种或多种选自三氟化硼，三氟化硼络合物，氟化剂和碱金属盐的氟基化合物 多氟化合物。 （B）光碱产生剂优选为光致叔胺。
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公开(公告)号：US20240218216A1
公开(公告)日：2024-07-04
申请号：US18563549
申请日：2022-05-19
申请人： CEMEDINE CO., LTD.
发明人： Jun KOTANI , Makoto KONNO
IPC分类号： C09J139/04 , C09J4/06 , C09J11/08
CPC分类号： C09J139/04 , C09J4/06 , C09J11/08
摘要： An object of the present invention is to provide an acrylic adhesive having excellent high-temperature adhesive strength and excellent cured product elongation. Accordingly, provided is a two-part acrylic adhesive composition including, as essential components, (A) a urethane (meth)acrylate having a backbone including a low-crystallinity polytetramethylene glycol, (B) a polymerizable vinyl monomer, (C) an organic peroxide, and (D) a reducing agent.
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