公开(公告)号：US20190300760A1

公开(公告)日：2019-10-03

申请号：US16315868

申请日：2017-07-07

申请人： CEMEDINE CO., LTD. ,  HONDA MOTOR CO., LTD.

发明人： Daisuke MAKINO ,  Atsuhiko SUZUKI ,  Yuusuke MURACHI ,  Katsutoshi ANDO

IPC分类号： C09J11/06 ,  C09J163/00 ,  C09J5/06

摘要： Provided are: a structure adhesive composition which changes color when heat-cured; a method for producing a vehicle structure using the same; and a vehicle structure. The structure adhesive composition which changes color when heat-cured is a structure adhesive composition including: (A) an epoxy resin; (B) an epoxy resin latent curing agent; and (C) a monoazo pigment, wherein a compounded proportion of the monoazo pigment in the structure adhesive composition constitutes 0.01-10 mass %. It is preferable for the structure adhesive composition to also contain (D) a curing accelerator.

公开(公告)号：US20210277294A1

公开(公告)日：2021-09-09

申请号：US16315788

申请日：2017-07-07

申请人： CEMEDINE CO., LTD. ,  HONDA MOTOR CO., LTD.

发明人： Daisuke MAKINO ,  Atsuhiko SUZUKI ,  Yuusuke MURACHI ,  Katsutoshi ANDO ,  Koji ODA

IPC分类号： C09J163/00 ,  C09J5/06 ,  C09J11/08

摘要： Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa·s) when a shearing speed is 5 (sec−1) and is from 1 to 30 (Pa·s) when the shearing speed is 200 (sec−1).

公开(公告)号：US20210102101A1

公开(公告)日：2021-04-08

申请号：US16497552

申请日：2018-03-23

申请人： CEMEDINE CO., LTD. ,  MAZDA MOTOR CORPORATION

发明人： Daisuke MAKINO ,  Atsuhiko SUZUKI ,  Yusuke MURACHI ,  Motoyasu ASAKAWA ,  Katsuya HIMURO ,  Kenichi YAMAMOTO

IPC分类号： C09J163/00 ,  C08G59/18 ,  C09J11/04 ,  C09J11/06 ,  C09J5/06 ,  B62D65/02 ,  C08K3/36 ,  C08K3/22

摘要： Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.