公开(公告)号：US20210102101A1

公开(公告)日：2021-04-08

申请号：US16497552

申请日：2018-03-23

申请人： CEMEDINE CO., LTD. ,  MAZDA MOTOR CORPORATION

发明人： Daisuke MAKINO ,  Atsuhiko SUZUKI ,  Yusuke MURACHI ,  Motoyasu ASAKAWA ,  Katsuya HIMURO ,  Kenichi YAMAMOTO

IPC分类号： C09J163/00 ,  C08G59/18 ,  C09J11/04 ,  C09J11/06 ,  C09J5/06 ,  B62D65/02 ,  C08K3/36 ,  C08K3/22

摘要： Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.