公开(公告)号：US20110220631A1

公开(公告)日：2011-09-15

申请号：US12920801

申请日：2009-03-16

申请人： Oleg Grudin ,  Yougui Liao ,  Leslie M. Landsberger ,  Gennadiy Frolov ,  Lyudmila Grudina ,  Gerald Arzoumanian ,  Saed Salman ,  Tommy Tsang ,  Bowei Zhang

发明人： Oleg Grudin ,  Yougui Liao ,  Leslie M. Landsberger ,  Gennadiy Frolov ,  Lyudmila Grudina ,  Gerald Arzoumanian ,  Saed Salman ,  Tommy Tsang ,  Bowei Zhang

IPC分类号： C21D1/40

CPC分类号： H01L28/20 ,  H01C17/22 ,  H01C17/265 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49085

摘要： There is described a method for stabilizing a post-trimming resistance of a thermally isolated electrical component made from a thermally mutable material, the method comprising: generating at least one heating pulse, the at least one heating pulse having an initial amplitude corresponding to a trimming temperature, a slope corresponding to a given cooling rate and a duration corresponding to a given cooling time; and applying the at least one heating pulse to one of the thermally isolated electrical component and a heating device in heat transfer communication with the thermally isolated electrical component, after a trimming process, in order to cause the electrical component to cool in accordance with the given cooling rate, the given cooling rate being slower than a passive cooling rate determined by the thermal isolation of the electrical component

摘要翻译： 描述了一种用于稳定由热可变材料制成的热隔离电气部件的后修整电阻的方法，所述方法包括：产生至少一个加热脉冲，所述至少一个加热脉冲具有对应于修整的初始幅度 温度，对应于给定冷却速率的斜率和对应于给定冷却时间的持续时间; 以及在修整过程之后，将所述至少一个加热脉冲施加到所述热隔离电气部件中的一个和与所述热隔离电气部件传热通信的加热装置，以便使所述电气部件根据给定 冷却速率，给定的冷却速率比通过电气部件的热隔离确定的被动冷却速度慢

公开(公告)号：US20100073121A1

公开(公告)日：2010-03-25

申请号：US12524516

申请日：2008-02-06

申请人： Oleg Grudin ,  Salman Saed ,  Tommy Tsang ,  Bowei Zhang ,  Leslie M. Landsberger ,  L. Richard Williston

发明人： Oleg Grudin ,  Salman Saed ,  Tommy Tsang ,  Bowei Zhang ,  Leslie M. Landsberger ,  L. Richard Williston

IPC分类号： H01C17/22

CPC分类号： H01C17/267 ,  H01C17/22 ,  Y10T29/49082 ,  Y10T29/49099

摘要： A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.

摘要翻译： 一种用于在至少一个空腔上布置多个热隔离微结构的方法，每个微结构容纳至少一部分可热可调电阻器，所述热可微调电阻器具有至少一个功能电阻器，所述方法包括：提供成对的 面向微结构; 将一组相对的微结构分组在一起，每组具有至少一对面向的微结构; 并且在给定的组中布置微结构以使每个微结构暴露于来自相同电阻器的相同数量的微结构的面向，侧向和对角线相邻的热量。

公开(公告)号：US20130243655A1

公开(公告)日：2013-09-19

申请号：US13715110

申请日：2012-12-14

申请人： Zhenyu LI ,  Mona E. ZAGHLOUL ,  Bowei ZHANG ,  Can E. KORMAN

发明人： Zhenyu LI ,  Mona E. ZAGHLOUL ,  Bowei ZHANG ,  Can E. KORMAN

IPC分类号： G01N33/50 ,  H05K3/00

CPC分类号： G01N33/50 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2300/0663 ,  B01L2300/0816 ,  B01L2300/0848 ,  B81C1/0023 ,  G01N33/49 ,  H01L23/49822 ,  H01L2224/12105 ,  H05K3/0014 ,  H05K3/4038 ,  Y10T29/49155

摘要： A flexible IC/microfluidic hybrid integration and packaging method and resulting device. A single flexible elastomer substrate, such as polydimethylsiloxane (PDMS), has dedicated microchannels filled with liquid metals (or low melting point solders) to provide electrical interconnects to a solid-state IC die, such as CMOS, and additional microchannels for hybrid integration with microfluidics without performing any post-processing on the IC die. The liquid metal used can be a gallium-indium-tin eutectic alloy (also called Galinstan).

公开(公告)号：US08111128B2

公开(公告)日：2012-02-07

申请号：US12524516

申请日：2008-02-06

申请人： Oleg Grudin ,  Salman Saed ,  Tommy Tsang ,  Bowei Zhang ,  Leslie M. Landsberger ,  L. Richard Williston

发明人： Oleg Grudin ,  Salman Saed ,  Tommy Tsang ,  Bowei Zhang ,  Leslie M. Landsberger ,  L. Richard Williston

IPC分类号： H01C3/04

CPC分类号： H01C17/267 ,  H01C17/22 ,  Y10T29/49082 ,  Y10T29/49099

摘要： A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.

摘要翻译： 一种用于在至少一个空腔上布置多个热隔离微结构的方法，每个微结构容纳至少一部分可热可调电阻器，所述热可微调电阻器具有至少一个功能电阻器，所述方法包括：提供成对的 面向微结构; 将一组相对的微结构分组在一起，每组具有至少一对面向的微结构; 并且在给定的组中布置微结构以使每个微结构暴露于来自相同电阻器的相同数量的微结构的面向，侧向和对角线相邻的热量。

公开(公告)号：US08847117B2

公开(公告)日：2014-09-30

申请号：US12920801

申请日：2009-03-16

申请人： Oleg Grudin ,  Yougui Liao ,  Leslie M. Landsberger ,  Gennadiy Frolov ,  Lyudmila Grudina ,  Gerald Arzoumanian ,  Saed Salman ,  Tommy Tsang ,  Bowei Zhang

发明人： Oleg Grudin ,  Yougui Liao ,  Leslie M. Landsberger ,  Gennadiy Frolov ,  Lyudmila Grudina ,  Gerald Arzoumanian ,  Saed Salman ,  Tommy Tsang ,  Bowei Zhang

IPC分类号： F23Q7/00 ,  B23H5/00 ,  B23K15/02 ,  H05B1/02 ,  H05B3/02 ,  H01C10/00 ,  H01C17/00 ,  H05B3/00 ,  H01C7/04 ,  B60L1/02 ,  A22C7/00 ,  A47J39/00 ,  H01L49/02 ,  H01C17/22 ,  H01C17/26

CPC分类号： H01L28/20 ,  H01C17/22 ,  H01C17/265 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49085

摘要： There is described a method for stabilizing a post-trimming resistance of a thermally isolated electrical component made from a thermally mutable material, the method comprising: generating at least one heating pulse, the at least one heating pulse having an initial amplitude corresponding to a trimming temperature, a slope corresponding to a given cooling rate and a duration corresponding to a given cooling time; and applying the at least one heating pulse to one of the thermally isolated electrical component and a heating device in heat transfer communication with the thermally isolated electrical component, after a trimming process, in order to cause the electrical component to cool in accordance with the given cooling rate, the given cooling rate being slower than a passive cooling rate determined by the thermal isolation of the electrical component.

摘要翻译： 描述了一种用于稳定由热可变材料制成的热隔离电气部件的后修整电阻的方法，所述方法包括：产生至少一个加热脉冲，所述至少一个加热脉冲具有对应于修整的初始幅度 温度，对应于给定冷却速率的斜率和对应于给定冷却时间的持续时间; 以及在修整过程之后，将所述至少一个加热脉冲施加到所述热隔离电气部件中的一个和与所述热隔离电气部件传热通信的加热装置，以便使所述电气部件根据给定 冷却速率，给定的冷却速率比通过电气部件的热隔离确定的被动冷却速度慢。