专利检索 ap:("Zhenyu LI" OR "Mona E. ZAGHLOUL" OR "Bowei ZHANG" OR "Can E. KORMAN") AND inv:"Can E. KORMAN" 第 1 页

1.

发明申请
Flexible IC/microfluidic integration and packaging 有权

公开(公告)号：US20130243655A1

公开(公告)日：2013-09-19

申请号：US13715110

申请日：2012-12-14

申请人： Zhenyu LI , Mona E. ZAGHLOUL , Bowei ZHANG , Can E. KORMAN

发明人： Zhenyu LI , Mona E. ZAGHLOUL , Bowei ZHANG , Can E. KORMAN

IPC分类号： G01N33/50 , H05K3/00

CPC分类号： G01N33/50 , B01L3/502707 , B01L3/502715 , B01L2200/12 , B01L2300/0663 , B01L2300/0816 , B01L2300/0848 , B81C1/0023 , G01N33/49 , H01L23/49822 , H01L2224/12105 , H05K3/0014 , H05K3/4038 , Y10T29/49155

摘要： A flexible IC/microfluidic hybrid integration and packaging method and resulting device. A single flexible elastomer substrate, such as polydimethylsiloxane (PDMS), has dedicated microchannels filled with liquid metals (or low melting point solders) to provide electrical interconnects to a solid-state IC die, such as CMOS, and additional microchannels for hybrid integration with microfluidics without performing any post-processing on the IC die. The liquid metal used can be a gallium-indium-tin eutectic alloy (also called Galinstan).