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公开(公告)号：US08131376B1
公开(公告)日：2012-03-06
申请号：US12209068
申请日：2008-09-11
申请人： Boozarjomehr Faraji , Kevin Jun Ha , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
发明人： Boozarjomehr Faraji , Kevin Jun Ha , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
IPC分类号： A61N1/00
CPC分类号： A61N1/0543 , A61N1/0526 , A61N1/36046 , A61N1/375 , G01N29/00 , G01N29/26
摘要： The present invention is a non-destructive method of inspecting a bond, particularly a braze bond, in a hermetic package. The invention involves a unique hermetic package design adapted for ultrasonic inspection and a method of inspecting the package. This package and non-destructive inspection process are particularly useful in implantable neural stimulators such as visual prostheses.
摘要翻译： 本发明是一种在密封包装中检查粘合剂，特别是钎焊粘合剂的非破坏性方法。 本发明涉及适用于超声波检查的独特的密封包装设计和检查包装的方法。 该包装和非破坏性检查过程在可植入的神经刺激器如视觉假体中特别有用。
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公开(公告)号：US08391987B2
公开(公告)日：2013-03-05
申请号：US13360480
申请日：2012-01-27
申请人： Boozarjomehr Faraji , Kevin Jun Ha , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
发明人： Boozarjomehr Faraji , Kevin Jun Ha , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
IPC分类号： A61N1/00
CPC分类号： A61N1/0543 , A61N1/0526 , A61N1/36046 , A61N1/375 , G01N29/00 , G01N29/26
摘要： The present invention is a non-destructive method of inspecting a bond, particularly a braze bond, in a hermetic package. The invention involves a unique hermetic package design adapted for ultrasonic inspection and a method of inspecting the package. This package and non-destructive inspection process are particularly useful in implantable neural stimulators such as visual prostheses.
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公开(公告)号：US20120136415A1
公开(公告)日：2012-05-31
申请号：US13360480
申请日：2012-01-27
申请人： Boozarjomehr Faraji , Kevin Jun Ha , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
发明人： Boozarjomehr Faraji , Kevin Jun Ha , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
CPC分类号： A61N1/0543 , A61N1/0526 , A61N1/36046 , A61N1/375 , G01N29/00 , G01N29/26
摘要： The present invention is a non-destructive method of inspecting a bond, particularly a braze bond, in a hermetic package. The invention involves a unique hermetic package design adapted for ultrasonic inspection and a method of inspecting the package. This package and non-destructive inspection process are particularly useful in implantable neural stimulators such as visual prostheses.
摘要翻译： 本发明是一种在密封包装中检查粘合剂，特别是钎焊粘合剂的非破坏性方法。 本发明涉及适用于超声波检查的独特的密封包装设计和检查包装的方法。 该包装和非破坏性检查过程在可植入的神经刺激器如视觉假体中特别有用。
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公开(公告)号：US20110270067A1
公开(公告)日：2011-11-03
申请号：US13097399
申请日：2011-04-29
申请人： Boozarjomehr Faraji , Robert J. Greenberg , James S. Little , Jerry Ok , Neil Hamilton Talbot , David Daomin Zhou
发明人： Boozarjomehr Faraji , Robert J. Greenberg , James S. Little , Jerry Ok , Neil Hamilton Talbot , David Daomin Zhou
CPC分类号： H01L21/563 , A61B5/04001 , A61B2562/125 , A61N1/0543 , A61N1/36046 , A61N1/3752 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81193 , H01L2224/81801 , H01L2224/838 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19107 , H01L2924/3011 , Y10T156/10 , H01L2924/00014 , H01L2924/00 , H01L2924/3512
摘要： The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as etching or applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.
摘要翻译： 本发明是一种用于将密封包装连接到诸如用于可植入装置中的电极阵列的柔性电路的装置和方法。 通过导电粘合剂将柔性电路上的金属焊盘连接到密封设备上的金属焊盘是已知的。 光滑的金属，如铂，不能很好地粘结到导电环氧树脂上。 本发明提供了粗糙化的表面，例如蚀刻或施加高表面积的白金灰，以改善与铂或其它金属垫的粘合性。
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