公开(公告)号：US4366925A

公开(公告)日：1983-01-04

申请号：US158708

申请日：1980-06-12

申请人： Bernard Fanene

发明人： Bernard Fanene

IPC分类号： H05K13/00 ,  H01L21/52 ,  H01L21/58 ,  H01L23/32 ,  H05K3/34 ,  H05K13/04 ,  B23K3/00

CPC分类号： H01L24/83 ,  H01L24/26 ,  H05K13/0486 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T156/1939

摘要： A device for semi-automatic dismantling of a modular component which is soldered and attached to a substrate forming a printed circuit. The component to be dismantled is placed under a hot gas source while a force member applies a resilient thrust, the force member comprising a needle arranged to be placed at the base of the component. The needle is slightly bent to apply a biasing force before controlling the ejection of the hot gas to cause melting of the solder at the ends of the connecting pieces and melting of the adhesive layer by which the component is attached to the substrate.

摘要翻译： 用于半自动拆卸模块化部件的装置，其被焊接并附接到形成印刷电路的基板。 要拆卸的部件放置在热气源下方，同时力部件施加弹性推力，该力部件包括布置成放置在部件底部的针。 在控制热气体的喷射之前，针稍微弯曲以施加偏置力，从而在连接件的端部处熔化焊料并使粘合剂层熔化成粘合剂层，通过该粘合剂层将组分附着到基底上。

公开(公告)号：US4351468A

公开(公告)日：1982-09-28

申请号：US188020

申请日：1980-09-17

申请人： Claude P. Floury ,  Claude L. J. M. Guillet ,  James A. Lokocki ,  Maurice R. Devoille ,  Bernard Fanene

发明人： Claude P. Floury ,  Claude L. J. M. Guillet ,  James A. Lokocki ,  Maurice R. Devoille ,  Bernard Fanene

IPC分类号： B23K1/00 ,  H01B13/012 ,  H01R43/02 ,  H05K3/10 ,  H05K3/38 ,  H05K13/06

CPC分类号： H05K13/06 ,  H05K3/10 ,  H05K3/386 ,  Y10T156/1724 ,  Y10T29/49162

摘要： The surface of a substrate, particularly a multi-layer substrate, is wiredy an apparatus including a tool carrier and a substrate carrier. The substrate carrier is positioned in a substantially horizontal plane so it is situated opposite the tool carrier. The substrate carrier is displaced relative to the tool carrier in the horizontal plane, i.e., relative to the vertical plane. A heating element and an electric wire dispenser are carried by the tool carrier. The dispenser includes a wire outlet orifice situated close to an end of the heating element. The heating element is longitudinally translated within a sleeve having an axis directed toward the substrate carrier. A rotary support carrying the dispenser is rotatable around the sleeve axis to enable the wire outlet orifice to be positioned with respect to the end of the heating element as a function of the relative displacement between the substrate carrier and tool carrier.

摘要翻译： 基板的表面，特别是多层基板，由包括工具载体和基板载体的装置布线。 衬底载体定位在基本上水平的平面中，使得其与工具架相对。 衬底载体相对于工具载体在水平平面中移位，即相对于垂直平面移位。 加热元件和电线分配器由工具托架承载。 分配器包括位于加热元件的端部附近的线出口孔。 加热元件在具有指向衬底载体的轴的套筒内纵向平移。 承载分配器的旋转支撑件可围绕套筒轴线旋转，以使出线孔出口孔相对于加热元件的端部被定位为衬底托架和刀架之间的相对位移的函数。