公开(公告)号：US09761506B2

公开(公告)日：2017-09-12

申请号：US13403341

申请日：2012-02-23

Applicant: Takukazu Otsuka ,  Bryon Western ,  Brandon Passmore ,  Zach Cole

Inventor： Takukazu Otsuka ,  Bryon Western ,  Brandon Passmore ,  Zach Cole

IPC: H01L23/34 ,  H01L23/373 ,  H01L23/00 ,  H01L25/07 ,  H01L25/00

CPC classification number: H01L23/3735 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/8182 ,  H01L2224/8383 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/351 ,  H01L2924/00

Abstract: Provided is a double-sided cooling structure for a semiconductor device using a low processing temperature and reduced processing time utilizing solid phase diffusion bonding. The fabrication method for this system is provided. The semiconductor device 1 comprising: a mounting substrate 70; a semiconductor chip 10 disposed on the mounting substrate 70 and a semiconductor substrate 26, a source pad electrode SP and a gate pad electrode GP disposed on a surface of the semiconductor substrate 26, and a drain pad electrode 36 disposed on a back side surface of the semiconductor substrate 26 to be contacted with the mounting substrate 70; and a source connector SC disposed on the source pad electrode SP. The mounting substrate 70 and the drain pad electrode 36 are bonded by using solid phase diffusion bonding.

公开(公告)号：US08766720B2

公开(公告)日：2014-07-01

申请号：US13537572

申请日：2012-06-29

Applicant: David J. Mitchell ,  John R. Fraley ,  Jie Yang ,  Cora Schillig ,  Roberto Marcelo Schupbach ,  Bryon Western

Inventor： David J. Mitchell ,  John R. Fraley ,  Jie Yang ,  Cora Schillig ,  Roberto Marcelo Schupbach ,  Bryon Western

IPC: H03F3/45

CPC classification number: H03F3/45 ,  F01D5/14 ,  F01D5/3007 ,  F01D17/085 ,  F05D2270/54 ,  G01L1/225

Abstract: A circuitry (120) adapted to operate in a high-temperature environment of a turbine engine is provided. The circuitry may include a differential amplifier (122) having an input terminal (124) coupled to a sensing element to receive a voltage indicative of a sensed parameter. A hybrid load circuitry (125) may be AC-coupled to the differential amplifier. The hybrid load circuitry may include a resistor-capacitor circuit (134) arranged to provide a path to an AC signal component with respect to the drain terminal of the switch (e.g., 126) of a differential pair of semiconductor switches 126, 128, which receives the voltage indicative of the sensed parameter.

Abstract translation: 提供适于在涡轮发动机的高温环境中操作的电路（120）。 电路可以包括具有耦合到感测元件的输入端子（124）的差分放大器（122），以接收指示感测参数的电压。 混合负载电路（125）可以被AC耦合到差分放大器。 混合负载电路可以包括电阻器 - 电容器电路（134），其被布置成提供相对于差分对半导体开关126,128的开关（例如126）的漏极端子的AC信号分量的路径， 接收指示感测参数的电压。

公开(公告)号：US20140009222A1

公开(公告)日：2014-01-09

申请号：US13544159

申请日：2012-07-09

Applicant: David J. Mitchell ,  Jie Yang ,  Roberto Marcelo Schupbach ,  John R. Fraley ,  Cora Schillig ,  Bryon Western

Inventor： David J. Mitchell ,  Jie Yang ,  Roberto Marcelo Schupbach ,  John R. Fraley ,  Cora Schillig ,  Bryon Western

IPC: H03F3/45

CPC classification number: G01K7/021 ,  G01K13/08 ,  H04Q9/00 ,  H04Q2209/40

Abstract: Chopper circuitry may be adapted to operate in a high-temperature environment of a turbine. A first semiconductor switch (122) may have a first terminal coupled to receive a first output signal from a first leg (148) of a differential amplifier (150). A second switch (128) may have a first terminal coupled thru a first resistive element (R1) to a second terminal of the first semiconductor switch. The first terminal of the second semiconductor switch may be coupled to receive thru a second resistive element (R2) a second output signal from a second leg (152) of the amplifier. Switches (122,128) may be responsive to a switching control signal to respective gate terminals of the switches to supply an output signal, which alternates in correspondence with a frequency of the switching control signal from a first amplitude level to a second amplitude level, which effectively provides a doubling amplification factor.

Abstract translation: 斩波器电路可以适于在涡轮机的高温环境中操作。 第一半导体开关（122）可以具有耦合以从差分放大器（150）的第一支路（148）接收第一输出信号的第一端子。 第二开关（128）可以具有通过第一电阻元件（R1）耦合到第一半导体开关的第二端子的第一端子。 第二半导体开关的第一端子可以被耦合以通过第二电阻元件（R2）接收来自放大器的第二支路（152）的第二输出信号。 开关（122,128）可以响应于开关的相应栅极端子的开关控制信号，以提供输出信号，该输出信号与切换控制信号的频率相对应，从第一幅度电平到第二幅度电平，这有效地 提供了倍增放大系数。

公开(公告)号：US08525036B2

公开(公告)日：2013-09-03

申请号：US13235984

申请日：2011-09-19

Applicant: David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

Inventor： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC: H05K1/00

CPC classification number: H05K1/092 ,  G01K1/024 ,  G01K13/02 ,  G01K2013/024 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2224/48644 ,  H01L2924/01322 ,  H01L2924/13062 ,  H01L2924/3011 ,  H05K3/102 ,  H05K3/1291 ,  H05K3/321 ,  H05K3/328 ,  H05K2201/10674 ,  H05K2203/0186 ,  H05K2203/049 ,  H05K2203/0557 ,  H05K2203/1126 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T428/2947 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752

Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Abstract translation: 公开了一种抵抗高温高压离心力的电路组件（34）。 印刷电路板（42）首先由氧化铝制成，并且通过使用厚膜金膏在其上形成所述电路的导电迹线。 电路组件的主动和被动部件通过在高温下扩散的金粉附着到印刷电路板上。 为了完成电路组件（34），金线用于电路迹线和有源部件之间的接合。 另外，公开了一种制造耐高温的电路组件的方法。

公开(公告)号：US08223036B2

公开(公告)日：2012-07-17

申请号：US12192324

申请日：2008-08-15

Applicant: David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

Inventor： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC: H04Q9/00 ,  F02C6/00 ,  H03F3/04

CPC classification number: G01D3/036 ,  G01K1/024 ,  G01K1/12 ,  G01K1/20 ,  G01K2205/00 ,  G01L1/2281 ,  H03F1/306 ,  H03F2200/18 ,  H03F2200/447

Abstract: In a telemetry system for use in an engine, a circuit structure (34) affixed to a moving part (20) of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier (102, 111) having an input for receiving a signal from a sensor (101, 110) disposed on the part. A voltage controlled oscillator (104, 115) with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer (105, 116) with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna (26) for transmitting the information to the receiver.

Abstract translation: 在用于发动机的遥测系统中，固定在发动机的运动部分（20）上的电路结构（34）被设置用于放大关于部件的状况的感测信息，并将感测到的信息传送到 发动机。 电路结构适用于发动机的高温环境，并且包括具有用于从设置在该部件上的传感器（101,110）接收信号的输入的差分放大器（102,111）。 具有耦合到放大器的输出的输入端的压控振荡器（104,115）产生具有表示感测状态的频率的振荡信号。 具有耦合到振荡器的输出的输入端的缓冲器（105,116）缓冲振荡信号，然后振荡信号被耦合到用于将信息发送到接收器的天线（26）。

公开(公告)号：US20120009056A1

公开(公告)日：2012-01-12

申请号：US13235984

申请日：2011-09-19

Applicant: DAVID J. MITCHELL ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander R. Lostetter ,  Brice McPherson ,  Bryon Western

Inventor： DAVID J. MITCHELL ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander R. Lostetter ,  Brice McPherson ,  Bryon Western

IPC: F01D25/00 ,  H05K7/00

CPC classification number: H05K1/092 ,  G01K1/024 ,  G01K13/02 ,  G01K2013/024 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2224/48644 ,  H01L2924/01322 ,  H01L2924/13062 ,  H01L2924/3011 ,  H05K3/102 ,  H05K3/1291 ,  H05K3/321 ,  H05K3/328 ,  H05K2201/10674 ,  H05K2203/0186 ,  H05K2203/049 ,  H05K2203/0557 ,  H05K2203/1126 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T428/2947 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752

Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste.Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Abstract translation: 公开了一种抵抗高温高压离心力的电路组件（34）。 印刷电路板（42）首先由氧化铝制成，并且通过使用厚膜金膏在其上形成所述电路的导电迹线。 电路组件的主动和被动部件通过在高温下扩散的金粉附着到印刷电路板上。 为了完成电路组件（34），金线用于电路迹线和有源部件之间的接合。 另外，公开了一种制造耐高温的电路组件的方法。

公开(公告)号：US08803703B2

公开(公告)日：2014-08-12

申请号：US13547380

申请日：2012-07-12

Applicant: David J. Mitchell ,  John R. Fraley ,  Jie Yang ,  Cora Schillig ,  Bryon Western ,  Roberto Marcelo Schupbach

Inventor： David J. Mitchell ,  John R. Fraley ,  Jie Yang ,  Cora Schillig ,  Bryon Western ,  Roberto Marcelo Schupbach

IPC: H04Q9/00

CPC classification number: G01D3/036 ,  F01D5/3007 ,  F01D11/20 ,  F01D17/085 ,  F05D2270/54 ,  G01K1/024 ,  G01K1/12 ,  G01K2013/024 ,  G01L1/2281 ,  H03F1/306 ,  H03F2200/18 ,  H03F2200/447 ,  Y02T50/672

Abstract: A circuitry adapted to operate in a high-temperature environment of a turbine engine is provided. A relatively high-gain differential amplifier (102) may have an input terminal coupled to receive a voltage indicative of a sensed parameter of a component (20) of the turbine engine. A hybrid load circuitry may be coupled to the differential amplifier. A voltage regulator circuitry (244) may be coupled to power the differential amplifier. The differential amplifier, the hybrid load circuitry and the voltage regulator circuitry may each be disposed in the high-temperature environment of the turbine engine.

Abstract translation: 提供一种适于在涡轮发动机的高温环境中操作的电路。 相对高增益的差分放大器（102）可以具有耦合以接收指示涡轮发动机的部件（20）的感测参数的电压的输入端子。 混合负载电路可以耦合到差分放大器。 电压调节器电路（244）可以被耦合以对差分放大器供电。 差分放大器，混合负载电路和电压调节器电路可以各自设置在涡轮发动机的高温环境中。

公开(公告)号：US20140002050A1

公开(公告)日：2014-01-02

申请号：US13537208

申请日：2012-06-29

Applicant: David J. Mitchell ,  John R. Fraley ,  Jie Yang ,  Cora Schillig ,  Bryon Western ,  Roberto Marcelo Schupbach

Inventor： David J. Mitchell ,  John R. Fraley ,  Jie Yang ,  Cora Schillig ,  Bryon Western ,  Roberto Marcelo Schupbach

IPC: G05F3/02

CPC classification number: G05F3/242 ,  F01D5/3007 ,  F01D11/20 ,  F01D17/085 ,  F05D2270/54

Abstract: A voltage regulator circuitry (50) adapted to operate in a high-temperature environment of a turbine engine is provided. The voltage regulator may include a constant current source (52) including a first semiconductor switch (54) and a first resistor (56) connected between a gate terminal (G) and a source terminal (S) of the first semiconductor switch. A second resistor (58) is connected to the gate terminal of the first semiconductor switch (54) and to an electrical ground (64). The constant current source is coupled to generate a voltage reference across the second resistor 58. A source follower output stage 66 may include a second semiconductor switch (68) and a third resistor (58) connected between the electrical ground and a source terminal of the second semiconductor switch. The generated voltage reference is applied to a gating terminal of the second semiconductor switch (58).

Abstract translation: 提供一种适于在涡轮发动机的高温环境中操作的调压器电路（50）。 电压调节器可以包括恒定电流源（52），其包括连接在第一半导体开关的栅极端子（G）和源极端子（S）之间的第一半导体开关（54）和第一电阻器（56）。 第二电阻器（58）连接到第一半导体开关（54）的栅极端子和电接地（64）。 耦合恒流源以在第二电阻器58上产生电压基准。源极跟随器输出级66可以包括第二半导体开关（68）和第三电阻器（58），第三电阻器连接在电接地和源极端子之间 第二半导体开关。 所产生的参考电压被施加到第二半导体开关（58）的选通端子。

公开(公告)号：US08458899B2

公开(公告)日：2013-06-11

申请号：US13236083

申请日：2011-09-19

Applicant: David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

Inventor： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC: H05K3/20

CPC classification number: H05K1/092 ,  G01K1/024 ,  G01K13/02 ,  G01K2013/024 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2224/48644 ,  H01L2924/01322 ,  H01L2924/13062 ,  H01L2924/3011 ,  H05K3/102 ,  H05K3/1291 ,  H05K3/321 ,  H05K3/328 ,  H05K2201/10674 ,  H05K2203/0186 ,  H05K2203/049 ,  H05K2203/0557 ,  H05K2203/1126 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T428/2947 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752

Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Abstract translation: 公开了一种抵抗高温高压离心力的电路组件（34）。 印刷电路板（42）首先由氧化铝制成，并且通过使用厚膜金膏在其上形成所述电路的导电迹线。 电路组件的主动和被动部件通过在高温下扩散的金粉附着到印刷电路板上。 为了完成电路组件（34），金线用于电路迹线和有源部件之间的接合。 另外，公开了一种制造耐高温的电路组件的方法。

公开(公告)号：US08092080B2

公开(公告)日：2012-01-10

申请号：US12192366

申请日：2008-08-15

Applicant: David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

Inventor： David J. Mitchell ,  Anand A. Kulkarni ,  Ramesh Subramanian ,  Edward R. Roesch ,  Rod Waits ,  Roberto Schupbach ,  John R. Fraley ,  Alexander B. Lostetter ,  Brice McPherson ,  Bryon Western

IPC: G01K1/00

CPC classification number: H04Q9/00 ,  G01K1/024 ,  G01K1/026 ,  G01K7/021 ,  G01K7/13 ,  G01K7/34 ,  G01K13/08 ,  H04Q2209/40

Abstract: A circuit affixed to a moving part of an engine for sensing and processing the temperature of the part. The circuit generates a signal representative of the temperature sensed by a thermocouple (110) and amplified by an amplifier (112). A square wave oscillator (113) with a temperature sensitive capacitor (C8) varies its frequency in response to changes of a local temperature of the circuit. A chopper (114, J27) converts the output of the amplifier into an alternating current signal. The chopper is gated by the square wave oscillator and a second input is coupled to an output of the amplifier. Thus, the chopper has an output signal having a frequency representative of the local temperature and an amplitude representative of the thermocouple temperature, whereby the combined signals represent the true temperature of the part.

Abstract translation: 固定在发动机运动部分的电路，用于检测和处理部件的温度。 电路产生代表由热电偶（110）感测并由放大器（112）放大的温度的信号。 具有温度敏感电容器（C8）的方波振荡器（113）响应于电路的局部温度的变化而改变其频率。 斩波器（114，J27）将放大器的输出转换为交流信号。 斩波器由方波振荡器门控，第二输入端连接到放大器的输出端。 因此，斩波器具有表示局部温度的频率的输出信号和表示热电偶温度的振幅，由此组合的信号表示部件的真实温度。