摘要:
An emission map of a circuit to be tested for alterations is obtained by measuring the physical circuit to be tested. An emission map of a reference circuit is obtained by measuring a physical reference circuit or by simulating the emissions expected from the reference circuit. The emission map of the circuit to be tested is compared with the emission map of the reference circuit, to determine presence of alterations in the circuit to be tested, as compared to the reference circuit.
摘要:
A method of optimizing power usage in an integrated circuit design analyzes multiple operating speed cut points that are expected to be produced by the integrated circuit design. The operating speed cut points are used to divide identically designed integrated circuit devices after manufacture into relatively slow integrated circuits and relatively fast integrated circuit devices. The method selects an initial operating speed cut point to minimize a maximum power level of the relatively slow integrated circuits and relatively fast integrated circuit devices. The method then manufactures the integrated circuit devices using the integrated circuit design and tests the operating speeds and power consumption levels of the integrated circuit devices. Then, the method adjusts the initial cut point to a final cut point based on the testing, to minimize the maximum power level of the relatively slow integrated circuits and relatively fast integrated circuit devices.
摘要:
A method and service of balancing delay in a circuit design begins with nodes that are to be connected together by a wiring design, or by being supplied with an initial wiring design that is to be altered. The wiring design will have many wiring paths, such as a first wiring path, a second wiring path, etc. Two or more of the wiring paths are designed to have matching timing, such that the time needed for a signal to travel along the first wiring path is about the same time needed for a signal to travel along the second wiring path, the third path, etc. The method/service designs one or all of the wiring paths to make the paths traverse wire segments of about the same length and orientation, within each wiring level that the first wiring path and the second wiring path traverse. Also, this process makes the first wiring path and the second wiring path traverse the wire segments in the same order, within each wiring level that the first wiring path and the second wiring path traverse.
摘要:
An emission map of a circuit to be tested for alterations is obtained by measuring the physical circuit to be tested. An emission map of a reference circuit is obtained by measuring a physical reference circuit or by simulating the emissions expected from the reference circuit. The emission map of the circuit to be tested is compared with the emission map of the reference circuit, to determine presence of alterations in the circuit to be tested, as compared to the reference circuit.
摘要:
A method and service of balancing delay in a circuit design begins with nodes that are to be connected together by a wiring design, or by being supplied with an initial wiring design that is to be altered. The wiring design will have many wiring paths, such as a first wiring path, a second wiring path, etc. Two or more of the wiring paths are designed to have matching timing, such that the time needed for a signal to travel along the first wiring path is about the same time needed for a signal to travel along the second wiring path, the third path, etc. The method/service designs one or all of the wiring paths to make the paths traverse wire segments of about the same length and orientation, within each wiring level that the first wiring path and the second wiring path traverse. Also, this process makes the first wiring path and the second wiring path traverse the wire segments in the same order, within each wiring level that the first wiring path and the second wiring path traverse.
摘要:
A method of optimizing power usage in an integrated circuit design analyzes multiple operating speed cut points that are expected to be produced by the integrated circuit design. The operating speed cut points are used to divide identically designed integrated circuit devices after manufacture into relatively slow integrated circuit devices and relatively fast integrated circuit devices. The method selects an initial operating speed cut point to minimize a maximum power consumption level of the relatively slow integrated circuit devices and the relatively fast identically designed integrated circuit devices. The method then manufactures the integrated circuit devices using the integrated circuit design and tests operating speeds and power consumption levels of the identically designed integrated circuit devices. Then, the method adjusts the initial operating speed cut point to a final operating speed cut point based on the testing, to minimize the maximum power consumption level of the relatively slow integrated circuit devices and the relatively fast integrated circuit devices.
摘要:
Systems and methods are provided for analyzing the timing of circuits, including integrated circuits, by taking into account the location of cells or elements in the paths or logic cones of the circuit. In one embodiment, a bounding region may be defined around cells or elements of interest, and the size of the bounding region may be used to calculate a timing slack variation factor. The size of the bounding region may be adjusted to account for variability in timing delays. In other embodiments, centroids may be calculated using either the location or the delay-weighted location of elements or cells within the path or cone and the centroids used to calculate timing slack variation factor. The timing slack variation factors are used to calculate a new timing slack for the path or logic cone of the circuit.
摘要:
Disclosed is a method of laying out individual cells of an integrated circuit design, based at least in part on the known polysilicon perimeter densities of those cells. That is, the method embodiments use the knowledge of polysilicon perimeter density for known cells to drive placement of those cells on a chip (i.e., to drive floor-planning). The method embodiments can be used to achieve approximately uniform across-chip polysilicon perimeter density and, thereby to limit performance parameter variations between functional devices that are attributable to variations in polysilicon perimeter density. Alternatively, the method embodiments can be used to selectively control variations in the average polysilicon perimeter density of different regions of a chip and, thereby to selectively control certain performance parameter variations between functional devices located in those different regions.
摘要:
IC chip design modeling using perimeter density to an electrical characteristic correlation is disclosed. In one embodiment, a method may include determining a perimeter density of conductive structure within each region of a plurality of regions of an integrated circuit (IC) chip design; correlating a measured electrical characteristic within a respective region of an IC chip that is based on the IC chip design to the perimeter density; and modeling the IC chip design based on the correlation.
摘要:
A design structure for an integrated circuit that includes input/output (I/O) state saving circuitry capable of stabilizing the I/O states during any predicted I/O disturbance event. The I/O state saving circuitry includes a plurality of transparent latches arranged between the output of a plurality of respective I/O receivers and the internal digital, analog, or mixed-signal circuitry of the integrated circuit. The transparent latches are transitioned between a pass-through mode and a state-saving mode via a common control signal. In anticipation of, for example, a predicted I/O signal disturbance generating event, the transparent latches are set to the state-saving mode. Consequently, the outputs of the transparent latches are held stable and glitchless during the disturbance event, which ensures that the internal logic of the integrated circuit does not lose state.