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公开(公告)号：US10296711B2
公开(公告)日：2019-05-21
申请号：US12781809
申请日：2010-05-17
Applicant: Allen Keith Bates , Louie Arthur Dickens , Timothy A. Johnson , Craig Anthony Klein , Yun Mou , Stephen Leonard Schwartz , Anna W. Topol , Daniel James Winarski
Inventor： Allen Keith Bates , Louie Arthur Dickens , Timothy A. Johnson , Craig Anthony Klein , Yun Mou , Stephen Leonard Schwartz , Anna W. Topol , Daniel James Winarski
Abstract: A system, method and computer program product for archiving image, audio, and text data with metadata encapsulation in a client-server storage library is described. The server receives and holds the images, audio, or text to be archived in an image, audio or text logical partition which includes a directory of the images, audio, or text. The information is encapsulated in a metadata wrapper and stored in the library as a closed image, audio, or text file along with a closed copy of the directory. The closed image, audio, or text directory is also stored in the client. The images may be encapsulated in MXF, DICOM, Tape Archive (TAR) or GZIP formats. The storage library may have magnetic tapes, magnetic disks or optical disks as storage media.
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公开(公告)号：US08768985B2
公开(公告)日：2014-07-01
申请号：US13369012
申请日：2012-02-08
Applicant: Mary P. Kusko , Frank E. Levine , Stella L. Taylor , Anna W. Topol
Inventor： Mary P. Kusko , Frank E. Levine , Stella L. Taylor , Anna W. Topol
CPC classification number: G06F17/30067 , G06F17/30147
Abstract: A processor-implemented method, system and/or computer program product for managing computer file storage is presented. A file, which is designated for storage, is received. Upon determining that the file exceeds a pre-determined size, the file is stored in a pre-designated folder that is reserved for oversized files. This pre-designated folder is protected such that any file stored within the pre-designated folder is prevented from being moved into archival storage.
Abstract translation: 提出了一种用于管理计算机文件存储的处理器实现的方法，系统和/或计算机程序产品。 被指定用于存储的文件被接收。 在确定该文件超过预定大小时，该文件被存储在为超大文件保留的预先指定的文件夹中。 该预先指定的文件夹被保护，使得存储在预先指定的文件夹内的任何文件被阻止移动到档案存储。
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公开(公告)号：US08755268B2
公开(公告)日：2014-06-17
申请号：US12963719
申请日：2010-12-09
Applicant: Alexander Abderrazag , Susan K. Schreitmueller , Anna W. Topol
Inventor： Alexander Abderrazag , Susan K. Schreitmueller , Anna W. Topol
IPC: G06F11/00
CPC classification number: G06F11/2005 , G06F11/2007
Abstract: A node communicates with a first network through a link aggregation of at least one primary port and at least one backup port. The link aggregation is for rerouting a communication with the first network to occur through the backup port in response to a malfunction in the communication through the primary port. In response to a malfunction in the communication through the backup port, the node communicates with a second network.
Abstract translation: 节点通过至少一个主端口和至少一个备份端口的链路聚合与第一网络进行通信。 链路聚合是为了响应于通过主端口的通信故障，通过备份端口重新路由与第一网络的通信。 响应于通过备份端口的通信故障，节点与第二网络通信。
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4.发明授权Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed 有权将金属 - 电介质图案与介电材料上升的金属和如此形成的结构粘合在一起公开(公告)号：US08617689B2
公开(公告)日：2013-12-31
申请号：US13443418
申请日：2012-04-10
Applicant: Kuan-Neng Chen , Bruce K. Furman , Sampath Purushothaman , David L. Rath , Anna W. Topol , Cornelia K. Tsang
Inventor： Kuan-Neng Chen , Bruce K. Furman , Sampath Purushothaman , David L. Rath , Anna W. Topol , Cornelia K. Tsang
CPC classification number: H01L24/05 , B23K20/023 , B23K20/233 , B23K20/24 , B23K2101/42 , H01L24/03 , H01L24/08 , H01L24/12 , H01L24/80 , H01L2224/0381 , H01L2224/03845 , H01L2224/0401 , H01L2224/05571 , H01L2224/05572 , H01L2224/08147 , H01L2224/08148 , H01L2224/80203 , H01L2224/80345 , H01L2224/80895 , H01L2224/80896 , H01L2224/80948 , H01L2224/80986 , H01L2924/14 , H01L2924/1461 , Y10T428/24479 , Y10T428/24521 , Y10T428/24545 , Y10T428/24612 , Y10T428/31678 , H01L2924/00012 , H01L2924/0001 , H01L2924/00
Abstract: Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.
Abstract translation: 公开了包括金属电介质图案在表面上与在电介质上方凸起的金属以及相关结构的接合。 一种方法包括在其表面上提供具有金属 - 电介质图案的第一基板; 提供在其表面上具有金属 - 电介质图案的第二基板; 执行导致金属在电介质上方升高的过程; 清洗金属; 以及将所述第一基板接合到所述第二基板。 还公开了相关的结构。 凸起金属的结合提供了强大的粘合介质，以及良好的电气和热连接，能够创建具有增强功能的三维集成结构。
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5.发明授权Automated termination of selected software applications in response system events 失效在响应系统事件中自动终止选定的软件应用程序公开(公告)号：US08255928B2
公开(公告)日：2012-08-28
申请号：US12389163
申请日：2009-02-19
Applicant: Mary P. Kusko , Frank Eliot Levine , Stella Lee Taylor , Anna W. Topol
Inventor： Mary P. Kusko , Frank Eliot Levine , Stella Lee Taylor , Anna W. Topol
IPC: G06F13/00
Abstract: A process registers a system management event in an application configuration database. Responsive to detecting the registered system management event during execution of one application of the set of applications, the process identifies applications of the set of applications associated with the registered system management event that are executing. The process then terminates the applications of the set of applications associated with the registered system management event that are executing. Responsive to terminating the applications of the set of applications associated with the registered system managing event that are executing, the process then executes a handler that processes the registered system management event.
Abstract translation: 进程在应用程序配置数据库中注册系统管理事件。 响应于在执行一组应用程序的一个应用程序期间检测注册的系统管理事件，该过程识别与正在执行的注册的系统管理事件相关联的应用程序的应用程序。 然后，该过程终止与正在执行的注册的系统管理事件相关联的一组应用的应用。 响应于终止与正在执行的注册系统管理事件相关联的一组应用的应用，该过程然后执行处理注册的系统管理事件的处理程序。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20110282844A1
公开(公告)日：2011-11-17
申请号：US12781809
申请日：2010-05-17
Applicant: Allen Keith Bates , Louie Arthur Dickens , Timothy A. Johnson , Craig Anthony Klein , Yun Mou , Stephen Leonard Schwartz , Anna W. Topol , Daniel James Winarski
Inventor： Allen Keith Bates , Louie Arthur Dickens , Timothy A. Johnson , Craig Anthony Klein , Yun Mou , Stephen Leonard Schwartz , Anna W. Topol , Daniel James Winarski
IPC: G06F17/30
CPC classification number: G06F19/321 , G06F17/30073 , G06F19/00 , G16H30/20
Abstract: A system, method and computer program product for archiving image, audio, and text data with metadata encapsulation in a client-server storage library is described. The server receives and holds the images, audio, or text to be archived in an image, audio or text logical partition which includes a directory of the images, audio, or text. The information is encapsulated in a metadata wrapper and stored in the library as a closed image, audio, or text file along with a closed copy of the directory. The closed image, audio, or text directory is also stored in the client. The images may be encapsulated in MXF, DICOM, Tape Archive (TAR) or GZIP formats. The storage library may have magnetic tapes, magnetic disks or optical disks as storage media.
Abstract translation: 描述了用于将图像，音频和文本数据与元数据封装存储在客户机 - 服务器存储库中的系统，方法和计算机程序产品。 服务器接收并保存要存档在包括图像，音频或文本目录的图像，音频或文本逻辑分区中的图像，音频或文本。 信息封装在元数据包装器中，并作为封闭图像，音频或文本文件以及目录的封闭副本存储在库中。 封闭的图像，音频或文本目录也存储在客户端中。 图像可以封装在MXF，DICOM，磁带存档（TAR）或GZIP格式中。 存储库可以具有作为存储介质的磁带，磁盘或光盘。
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7.发明申请SERVO CONTROL CIRCUIT FOR DETECTING ANALYTES VIA NANOPARTICLE-LABELED SUBSTANCES WITH ELECTROMAGNETIC READ-WRITE HEADS 有权用于通过电磁读写头检测纳米材料标签物质的分析仪的伺服控制电路公开(公告)号：US20110077902A1
公开(公告)日：2011-03-31
申请号：US12888403
申请日：2010-09-22
Applicant: Tara L. Awezec , Dylan Joseph Boday , Stephen Leonard Schwartz , Anna W. Topol , Daniel James Winarski
Inventor： Tara L. Awezec , Dylan Joseph Boday , Stephen Leonard Schwartz , Anna W. Topol , Daniel James Winarski
CPC classification number: G01N33/54346 , B82Y15/00 , G01N33/54326 , G01N33/54333
Abstract: A circuit for controlling an electromagnetic head module to detect antigens on a biosample track comprising a processor for receiving position-error-servo signal from the PES read sensor, a write head for magnetizing nanoparticles attached to antigens, and a read sensor for detecting the nanoparticle-labeled antigens. The circuit may further comprise an X-axis actuator for controlling the head module in the direction perpendicular to the track and an Y-axis actuator coupled to the head module and the X-axis actuator for controlling the head module in the direction of the track. Target antigens are attached to the biosample track and nanoparticles via antibodies.
Abstract translation: 一种用于控制电磁头模块以检测生物样本轨道上的抗原的电路，包括用于从PES读取传感器接收位置误差伺服信号的处理器，用于磁化附着于抗原的纳米颗粒的写入头和用于检测纳米颗粒的读取传感器 标记的抗原。 电路还可以包括用于在垂直于轨道的方向上控制头模块的X轴致动器，以及耦合到头模块的Y轴致动器和用于在轨道方向上控制头模块的X轴致动器 。 靶抗原通过抗体连接到生物样品轨道和纳米颗粒上。
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公开(公告)号：US07786596B2
公开(公告)日：2010-08-31
申请号：US12038501
申请日：2008-02-27
Applicant: Kuan-Neng Chen , Bruce K. Furman , Edmund J. Sprogis , Anna W. Topol , Cornelia K. Tsang , Matthew R. Wordeman , Albert M. Young
Inventor： Kuan-Neng Chen , Bruce K. Furman , Edmund J. Sprogis , Anna W. Topol , Cornelia K. Tsang , Matthew R. Wordeman , Albert M. Young
IPC: H01L23/48
CPC classification number: H01L25/50 , H01L2225/06513 , H01L2225/06593 , H01L2924/0002 , H01L2924/00
Abstract: A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.
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9.发明申请HIGH PERFORMANCE CMOS DEVICES COMPRISING GAPPED DUAL STRESSORS WITH DIELECTRIC GAP FILLERS, AND METHODS OF FABRICATING THE SAME 有权包含带有电介质隙隙填料的双层压缩机的高性能CMOS器件及其制造方法公开(公告)号：US20090321847A1
公开(公告)日：2009-12-31
申请号：US12556261
申请日：2009-09-09
Applicant: Bruce B. Doris , Thomas W. Dyer , David R. Medeiros , Anna W. Topol
Inventor： Bruce B. Doris , Thomas W. Dyer , David R. Medeiros , Anna W. Topol
IPC: H01L27/092 , H01L21/31 , H01L21/8238
CPC classification number: H01L21/823807 , H01L21/823864 , H01L21/823871 , H01L29/7843
Abstract: The present invention relates to complementary metal-oxide-semiconductor (CMOS) devices having gapped dual stressors with dielectric gap fillers. Specifically, each CMOS device of the present invention includes at least one n-channel field effect transistor (n-FET) and at least one p-channel field effect transistor (p-FET). A tensilely stressed dielectric layer overlays the n-FET, and a compressively stressed dielectric layer overlays the p-FET. A gap is located between the tensilely and compressively stressed dielectric layers and is filled with a dielectric filler material. In one specific embodiment of the present invention, both the tensilely and compressively stressed dielectric layers are covered by a layer of the dielectric filler material, which is essentially free of stress. In an alternatively embodiment of the present invention, the dielectric filler material is only present in the gap between the tensilely and compressively stressed dielectric layers.
Abstract translation: 本发明涉及具有间隙填充物的具有间隙双重应力的互补金属氧化物半导体（CMOS）器件。 具体地，本发明的每个CMOS器件包括至少一个n沟道场效应晶体管（n-FET）和至少一个p沟道场效应晶体管（p-FET）。 拉伸应力介电层覆盖n-FET，并且压应力介电层覆盖p-FET。 间隙位于拉伸和压应力介电层之间，并填充有介电填料。 在本发明的一个具体实施方案中，拉伸和压缩应力介电层都被基本上没有应力的介电填料材料层覆盖。 在本发明的替代实施例中，电介质填充材料仅存在于拉伸和压缩应力介电层之间的间隙中。
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10.发明申请公开(公告)号：US20090140404A1
公开(公告)日：2009-06-04
申请号：US12038501
申请日：2008-02-27
Applicant: Kuan-Neng Chen , Bruce K. Furman , Edmund J. Sprogis , Anna W. Topol , Cornelia K. Tsang , Matthew R. Wordeman , Albert M. Young
Inventor： Kuan-Neng Chen , Bruce K. Furman , Edmund J. Sprogis , Anna W. Topol , Cornelia K. Tsang , Matthew R. Wordeman , Albert M. Young
IPC: H01L23/10
CPC classification number: H01L25/50 , H01L2225/06513 , H01L2225/06593 , H01L2924/0002 , H01L2924/00
Abstract: A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.
Abstract translation: 一种密封的微电子结构，其提供机械应力耐久性并且包括在多个位置处电连接到半导体结构的至少两个芯片。 每个芯片沿着其周边包括连续的接合材料，以及连接到位于每个芯片的周边内的每个芯片的至少一个支撑柱。 每个支撑柱向外延伸，使得当至少两个芯片彼此定位时，支撑柱彼此配合。 至少两个芯片之间的密封由芯片彼此的重叠关系产生，使得接合材料和支撑柱彼此配合。 因此，当至少两个芯片配合在一起时形成密封，并且导致粘合芯片结构。
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