摘要:
An apparatus comprising a polarity switch. The polarity switch may comprise a number of transmission gates. An output of the polarity switch may selectably present either (i) a signal that varies in response to a control signal or (ii) a predetermined logic level that is independent of the control signal.
摘要:
An embodiment of the present invention provides a method and apparatus that effectuates a direct functional interface directly with individual constituent subcomponents of the internal die component, or with particular circuit nodes or conductive trace locales of the surface mount package, without high frequency signal degradation or other electrical problems. An embodiment of the present invention also provides a method and apparatus that effectuates testing access, directly to the internal die component of the surface mount package or to a particular circuit node or conductive trace locale of the surface mount package, enabling performance evaluation and system debugging. Further, an embodiment of the present invention provides a method and apparatus that effectuates integration of surface mount package with an opto-electronic package. Further still, an embodiment of the present invention provides a method and apparatus that achieves these advantages with minimal cost.
摘要:
A pump rod drive and torque release mechanism for use in association with a downhole pump positioned within a well. The pump rod drive and torque release mechanism comprises a central housing having a generally hollow interior, a drive shaft received within the central housing, a drive rod received within the central housing, and a torque transfer mechanism positioned within the central housing. The drive shaft may be operatively connected to a pump rod rotator to impart rotational movement to the drive shaft. The drive rod may be operatively connected to a downhole pump so as to enable transference of rotational energy from the drive rod to the downhole pump. The torque transfer mechanism has an engaged position wherein it operatively connects the drive shaft to the drive rod such that rotation of the drive shaft causes rotation of the drive rod. The torque transfer mechanism also has a disengaged position wherein it operatively disconnects the drive shaft from the drive rod. When it is in its disengaged position, the torque transfer mechanism permits rotation of the drive rod relative to the drive shaft and a release of torque exerted on the drive rod by fluid present in the well above and bearing against the downhole pump.
摘要:
This invention relates to the manufacture of Cadmium Mercury Telluride (CMT) on patterned silicon, especially to growth of CMT on silicon substrates bearing integrated circuitry. The method of the invention involves growing CMT in selected growth windows on the silicon substrate by first growing one or more buffer layers by MBE and then growing the CMT by MOVPE. The growth windows may be defined by masking the area outside of the growth windows. Growth within the growth windows is crystalline whereas any growth outside the growth windows is polycrystalline and can be removed by etching. The invention offers a method of growing CMT structures directly on integrated circuits removing the need for hybridisation.
摘要:
A tubing string rotator for rotating a tubing string in a well having a downhole pump. The tubing string rotator includes a housing having a first portion and a second portion. At least the second portion of the housing is adapted to be operatively connected to the end of a length of the tubing string such that rotational torque applied to the tubing string through the operation of the pump is transferred to the second portion of the housing. The rotator further includes means to permit the controlled rotation of the second portion, together with the tubing string connected thereto, relative to the first portion of the housing when the ability of the first portion to rotate is retarded or eliminated, and when rotational torque is supplied to the tubing string through the operation of the pump.
摘要:
A CAM and method for operating a CAM are presented. Copies of a CAM database are duplicated and placed in a first set of CAM locations and a second set of CAM locations. An error detector is used to determine false matches in the case of soft errors within the entries producing those false matches. While the entries producing a match should have the same index location, errors might cause those match lines to have an offset. If so, the present CAM, through use of duplicative sets of CAM locations, will detect the offset and thereafter the values in each index location that produces a match, along with the corresponding parity or error detection encoding bit(s). If the parity or error detection encoding bit(s) indicate an error in a particular entry, then that error is located and the corresponding entry at the same index within the other, duplicative set of CAM locations is copied into the that erroneous entry. Since duplicative copies are by design placed into the first and second sets of CAM locations, whatever value exists in the opposing entry can be written into the erroneous entry to correct errors in that search location. The first and second sets of CAM locations are configurable to be duplicative or distinct in content, allowing error detection and correction to be performed at multiple user-specified granularities. The error detection and correction during search is backward compatible to interim parity scrubbing and ECC scan, as well as use of FNH bits set by a user or provider.
摘要:
A pump rod clamp for gripping a pump rod in an oil, gas or water well. The pump rod clamp comprises a central housing having a longitudinal bore for receiving a pump rod, a plurality of clamping members receivable within the central housing, and one or more actuators to cause the clamping members to be moved between an activated position where they grippingly engage the pump rod and a deactivated position where they are released from contact with the pump rod. Each of the clamping members have a leading face that includes one or more gripping inserts releasably secured thereto. The gripping inserts having outer faces generally aligned with the pump rod for grippingly engaging the pump rod when the clamping members are in their activated position such that force exerted by each individual clamping member against the pump rod is concentrated and distributed over the outer faces of the one or more gripping inserts of each clamping member.
摘要:
A method for interconnecting a plurality of dies. The method generally includes receiving a plurality of interconnect requirements for the dies. The interconnect requirements may include a priority for each of a plurality of nets. A position and an angle for one of the dies relative to a substrate may be calculated in response to the interconnect requirements. A plurality of nets may then be routed among the dies and a plurality of substrate pads defining external connections for the substrate. The dies may be mounted to the substrate after routing has been finalized.
摘要:
A ball grid array (BGA) package is disclosed. An interconnect structure is formed on a substrate that electrically connects the electrical device to be housed in the BGA package to the solder balls thereon. Contact pads are formed over the top surface of the substrate. These contact pads electrically connect to the interconnect structure. A layer of solder mask is formed over the substrate that includes openings that overlie the contact pads. The BGA is then completed using conventional process steps. Thereby, a BGA package is formed that includes contact pads disposed such that the contact pads are accessible from the top of the BGA package, making these contact pads easily accessible. Thus, when the BGA is attached to a circuit board, connection to circuits of the electrical device is obtainable.
摘要:
A method of fabricating a semiconductor package that may contain two or more dies. The method generally comprises the steps of (A) mounting a first die having a first side on an assembly apparatus and (B) mounting a second die having a second side and an adjoining third side on said assembly apparatus. The second die may be oriented such that (i) the second side and the third side both face the first side and (ii) the second side and the third side are both substantially nonparallel to the first side.