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公开(公告)号：US07030401B2
公开(公告)日：2006-04-18
申请号：US10257776
申请日：2001-04-12
CPC分类号： H01L21/67178 , H01L21/67167 , H01L21/67173 , H01L21/67259 , H01L21/681 , Y10T29/49004 , Y10T29/53187
摘要： A substrate measurement system including a measurement chamber and a substrate handling chamber possessing a substrate transfer and a substrate container interface arranged to receive a substrate to container. The handling chamber contains a first interface to connect the measurement chamber and the measurement chamber contains a second interface to connect the handling chamber. The transfer means is arranged to transfer substrates between the container and the measurement chamber through the handling chamber, in which system a second measurement chamber is provided, having the same second interface as the first measurement chamber to replace latter chamber.
摘要翻译： 一种基板测量系统，包括测量室和具有基板转印的基板处理室和布置成将基板接收到容器的基板容器接口。 处理室包含用于连接测量室的第一界面，并且测量室包含连接处理室的第二界面。 传送装置被布置成通过处理室在容器和测量室之间传送基板，其中设置有第二测量室，该第二测量室具有与第一测量室相同的第二界面以替换后一个室。
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公开(公告)号：US07244088B2
公开(公告)日：2007-07-17
申请号：US10734723
申请日：2003-12-12
申请人： Christophe Lero , Pierre Astegno , Alain Gaudon
发明人： Christophe Lero , Pierre Astegno , Alain Gaudon
IPC分类号： B65G49/07
CPC分类号： H01L21/67766 , B23Q7/043 , B23Q11/08 , H01L21/68707 , Y10S414/135
摘要： A device (12) picks up at least one semi-conductor wafer (11) from a container (14) of wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant. The device is on the opposite side (17) of the aperture and the pick-up is effected through it. The device incorporates a shutter (1) movable between open and closed positions. A wafer picking up means (2) is attached to the shutter and is designed to enter partially within the container below a wafer and seize the wafer by its edge. A pick up moving means (3) moves the picking up means (2) back and forth through the aperture (13).
摘要翻译： 装置（12）从安装在半导体的转移站（10）中的孔（13）的一侧（15）上的晶片的容器（14）中拾取至少一个半导体晶片（11） 晶圆加工厂。 该装置位于孔的相对侧（17）上，并通过它进行拾取。 该装置包括可在打开位置和关闭位置之间移动的快门（1）。 晶片拾取装置（2）附接到闸门，并被设计成部分地在晶片下面的容器内部进入并通过其边缘抓住晶片。 拾取移动装置（3）通过孔（13）来回移动拾取装置（2）。
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公开(公告)号：US06420864B1
公开(公告)日：2002-07-16
申请号：US09548773
申请日：2000-04-13
IPC分类号： G01R3126
CPC分类号： H01L21/6719 , H01L21/67196
摘要： Substrate measurement system including a measurement chamber (30), and a substrate handling chamber (7) possessing substrate transfer means (10) and a substrate container interface (1) arranged to receive a substrate container (8), the handling chamber (7) containing an interface (50) to connect the measurement chamber (30), the measurement chamber (30) containing an interface (51) to connect to the handling chamber (7), and the transfer means (10) being arranged to transfer substrates between the container (8) and the measurement chamber (30) through the handling chamber (7), in which a second measurement chamber (39) is provided, having the same interface (51) as the first measurement chamber (30) to replace the latter chamber (30).
摘要翻译： 基板测量系统包括测量室（30）和具有基板传送装置（10）的基板处理室（7）和布置成容纳基板容器（8）的基板容器接口（1），处理室（7） 包括用于连接测量室（30）的接口（50），包含连接到处理室（7）的接口（51）的测量室（30），以及传送装置（10） 通过处理室（7）的容器（8）和测量室（30），其中设有第二测量室（39），其具有与第一测量室（30）相同的界面（51） 后室（30）。
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公开(公告)号：US07108476B2
公开(公告)日：2006-09-19
申请号：US10693296
申请日：2003-10-24
申请人： Pierre Astegno , Ekaterina Esteve , Alain Gaudon
发明人： Pierre Astegno , Ekaterina Esteve , Alain Gaudon
CPC分类号： H01L21/6835 , H01L21/68707 , Y10S414/136 , Y10S414/141
摘要： A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.
摘要翻译： 公开了一种用于定向和定位半导体晶片的机械装置和方法，同时通过仅接触其周边来避免元件在其表面上的污染。 该装置可以包括用于晶片支撑的框架和半导体晶片夹持臂。 夹持臂安装在一个平移器上，用于在X，Y和Z方向上移动，以便在支架之间，之间和之间移动晶片。 夹持臂包括刚性结构，其上安装有多个半导体支撑轮，以仅在其周边支撑晶片。 驱动轮被设置成在受支撑的晶片围绕其周边被支撑时旋转地定向支撑的晶片。 提供检测器以检测晶片相对于其周边上的凹口或其它位置标记的取向。
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公开(公告)号：US20050063797A1
公开(公告)日：2005-03-24
申请号：US10734723
申请日：2003-12-12
申请人： Christophe Lero , Pierre Astegno , Alain Gaudon
发明人： Christophe Lero , Pierre Astegno , Alain Gaudon
IPC分类号： B23Q7/04 , B23Q11/08 , H01L21/677 , H01L21/687 , B65G1/00
CPC分类号： H01L21/67766 , B23Q7/043 , B23Q11/08 , H01L21/68707 , Y10S414/135
摘要： A device (12) to pick up at least one disc-shaped semi-conductor wafer (11) from a container (14) of such wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant, the device being situated on the opposite side (17) of the said aperture and the pick-up being effected through it. The device incorporates: A moving shutter (1) designed to move between a first, closed aperture, position and a second, open aperture, position that allows access to the inside of the container. A means of moving (18) this shutter between these first and second positions, the said movement taking place, at least in part, in a plane approximately parallel to the plane of the aperture. The said device may be defined as including: Some means of picking up (2) at least one semi-conductor wafer (11) that is designed to enter partially within the said container below a wafer and seize this latter by its edge, Some means of moving (3) the said pick-ups between the said space on the second side of the aperture and the first side, and back again, Some means of attaching (4) the said pick-up mechanism to the shutter.
摘要翻译： 一种装置（12），用于从装配在转印站（10）中的孔（13）的一侧（15）上的这种晶片的容器（14）拾取至少一个盘形半导体晶片（11） 的半导体晶片处理设备，所述设备位于所述孔的相对侧（17）上，并且所述拾取器通过其进行。 该装置包括：移动快门（1），其被设计成在允许进入容器内部的第一，闭合孔径，位置和第二开口孔之间移动。 在这些第一和第二位置之间移动（18）该快门的装置，所述运动至少部分地在大致平行于孔的平面的平面中发生。 所述装置可以被定义为包括：一些拾取（2）至少一个半导体晶片（11）的装置，所述半导体晶片被设计成部分地在所述容器的下面部分地进入晶片下方并且通过其边缘将其卡住。 在所述孔的第二侧的所述空间和所述第一侧之间移动（3）所述拾取器，并且再次返回。将所述拾取机构附接（4）到所述挡板的一些装置。
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公开(公告)号：US09194834B2
公开(公告)日：2015-11-24
申请号：US14124342
申请日：2012-06-08
CPC分类号： G01N27/16 , G01N27/125 , G01N27/128
摘要： A multi-storey gas sensor is constructed by stacking chemoresistor type gas sensing elements and providing holes through each sensing element so gas can pass from one sensing element to the next, through the sensing layers. A rich data set can be obtained by selecting appropriate combinations of materials for the different sensing layers and varying the operating conditions of the different gas-sensing elements by: taking measurements when different combinations of sensing layers are activated, when given sensing layers are heated to different temperatures or according to different heating profiles, and/or when selected sensing layers are exposed to UV light. Sensor sensitivity and selectivity can be increased by applying UV pulses of controlled duration, and target gas species can be detected based on the transient response of the sensing layer at onset of UV irradiation. Each sensing element may have a micro-hotplate architecture.
摘要翻译： 多层气体传感器通过堆叠化学电阻型气体传感元件并通过每个感测元件提供孔而构成，使得气体可以通过感测层从一个感测元件传递到下一个感测元件。 可以通过选择用于不同感测层的材料的适当组合并且通过以下方式来改变不同气体感测元件的操作条件来获得丰富的数据集：当感测层的不同组合被激活时，当给定的感测层被加热到 不同的温度或根据不同的加热曲线，和/或当选定的感测层暴露于紫外光时。 传感器灵敏度和选择性可以通过施加持续时间的UV脉冲来增加，并且可以基于感测层在UV照射开始时的瞬态响应来检测目标气体种类。 每个感测元件可以具有微电热板结构。
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7.发明授权Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark 有权用于识别内含在包含取向标记的半导体晶片上的字符的装置和方法公开(公告)号：US06961639B2
公开(公告)日：2005-11-01
申请号：US10353845
申请日：2003-01-28
CPC分类号： G06K7/10861 , Y10S414/136 , Y10S414/141
摘要： A device and process are provided for identifying characters inscribed on a semiconductor wafer containing an orientation mark. A semiconductor wafer having characters inscribed on a surface near its periphery is supported about its periphery between three rotary supports mounted on a grasping arm. An orientation mark on the periphery of the wafer is located adjacent the inscribed characters. At least one of the three rotary supports is rotatably driven to orient the wafer such that the orientation mark is placed in a determined position. An optical reflector is positioned in a spatial zone in proximity to and above the characters to be identified. The characters to be identified are illuminated by a light beam reflected by the optical reflector. The characters reflect the light, which may be observed by an optical imager, such as a camera. An optical recognition subsystem may then be used to identify the characters.
摘要翻译： 提供了用于识别内含在包含取向标记的半导体晶片上的字符的装置和工艺。 具有在其周边附近的表面上刻有字符的半导体晶片围绕安装在抓握臂上的三个旋转支架之间的周边被支撑。 在晶片周边上的取向标记位于相邻的内切字符处。 三个旋转支撑件中的至少一个被可旋转地驱动以使晶片定向，使得定向标记被放置在确定的位置。 光学反射器位于靠近和要被识别的字符之上的空间区域中。 待识别的字符由光反射器反射的光束照射。 这些字符反映光，可以通过诸如相机的光学成像器来观察。 然后可以使用光学识别子系统来识别字符。
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公开(公告)号：US20140105790A1
公开(公告)日：2014-04-17
申请号：US14124342
申请日：2012-06-08
IPC分类号： G01N27/16
CPC分类号： G01N27/16 , G01N27/125 , G01N27/128
摘要： A multi-storey gas sensor is constructed by stacking chemoresistor type gas sensing elements and providing holes through each sensing element so gas can pass from one sensing element to the next, through the sensing layers. A rich data set can be obtained by selecting appropriate combinations of materials for the different sensing layers and varying the operating conditions of the different gas-sensing elements by: taking measurements when different combinations of sensing layers are activated, when given sensing layers are heated to different temperatures or according to different heating profiles, and/or when selected sensing layers are exposed to UV light. Sensor sensitivity and selectivity can be increased by applying UV pulses of controlled duration, and target gas species can be detected based on the transient response of the sensing layer at onset of UV irradiation. Each sensing element may have a micro-hotplate architecture.
摘要翻译： 多层气体传感器通过堆叠化学电阻型气体传感元件并通过每个感测元件提供孔而构成，使得气体可以通过感测层从一个感测元件传递到下一个感测元件。 可以通过选择用于不同感测层的材料的适当组合并且通过以下方式来改变不同气体感测元件的操作条件来获得丰富的数据集：当感测层的不同组合被激活时，当给定的感测层被加热到 不同的温度或根据不同的加热曲线，和/或当选定的感测层暴露于紫外光时。 传感器灵敏度和选择性可以通过施加持续时间的UV脉冲来增加，并且可以基于感测层在UV照射开始时的瞬态响应来检测目标气体种类。 每个感测元件可以具有微电热板结构。
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公开(公告)号：US20070297885A1
公开(公告)日：2007-12-27
申请号：US11426800
申请日：2006-06-27
IPC分类号： B65B69/00
CPC分类号： H01L21/6835 , B28D5/0088
摘要： A product (Pr) can be used in the semiconductor, MEM, flat screen and/or solar cell industries, where the product is capable of being gripped by a handling system (Bm). The product can include: a plate (1) made of silicon, quartz, silicon carbide, silicon nitride, arsenic, and/or gallium arsenide, comprising one first (2) and one second (3) opposite faces, a plateau (4) defined by at least one face (5) opposite the plate, an attachment means (7) of the plate (1) on the plateau (4) so that the at least one face (5) of the plateau (4) is opposite the first (2) or second (3) face of the plate, and a first gripping means (11) mounted in association with the plateau (4), where these said first gripping means is able to cooperate and is removable with second gripping means (12) in addition to the first gripping means (11), the second additional gripping means belonging to the handling system (Bm). Another embodiment of the invention is directed to a system for handling the product.
摘要翻译： 产品（Pr）可用于半导体，MEM，平板和/或太阳能电池行业，其中产品能够被处理系统（Bm）夹持。 该产品可以包括：由硅，石英，碳化硅，氮化硅，砷和/或砷化镓制成的板（1），包括一个第一（2）和一个第二（3）相对的面，平台（4） 由与板相对的至少一个面（5）限定，平台（4）上的板（1）的附接装置（7），使得平台（4）的至少一个面（5）与 所述板的第一（2）或第二（3）面以及与所述平台（4）相关联地安装的第一夹持装置（11），其中所述第一夹持装置能够协作并且可与第二夹持装置 除了第一夹持装置（11）之外，第二附加夹持装置属于处理系统（Bm）。 本发明的另一个实施例涉及一种用于处理该产品的系统。
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10.发明申请Device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like and system for gripping such a plate comprising such a device 审中-公开用于通过粘合到玻璃或半导体板（晶片）表面等上的装置以及用于夹持包括这种装置的这种板的系统公开(公告)号：US20070221335A1
公开(公告)日：2007-09-27
申请号：US11389559
申请日：2006-03-23
申请人： Florent Haddad , Alain Gaudon
发明人： Florent Haddad , Alain Gaudon
IPC分类号： B29C65/00
CPC分类号： H01L21/68707 , Y10T156/1702
摘要： A device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like is disclosed. The device includes a base including a flexible material equipped with an adhesive contact surface intended to be attached to said plate surface by adhesion, and means for differentiating the separation resistance between said adhesive contact surface made of the flexible material and the surface of the plate, in a direction perpendicular to the adhesive contact surface and in a direction parallel to said adhesive contact surface.
摘要翻译： 公开了一种通过粘合到玻璃或半导体板（晶片）表面等来接触的装置。 该装置包括：基部，其包括柔性材料，该柔性材料配备有用于通过粘合附着到所述板表面的粘合剂接触表面;以及用于区分所述柔性材料制成的粘合剂接触表面与所述板的表面之间的分离电阻的装置， 在垂直于粘合剂接触表面的方向上并且在平行于所述粘合剂接触表面的方向上。
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