Abstract:
A process for producing a hollow article in an assembly comprising first and second mold members movable relative to each other between a closed position in which an inner surface of the assembly defines a cavity and an open position. The cavity is shaped to define a corresponding configuration to the article. According to this process, a charge containing at least one molten thermoplastic resin is supplied at the first and/or second mold member while the mold members are not in the closed position. The first mold member is moved relative to the second mold member into the closed position so as to define the cavity, and a first clamping force F1 is applied to the first and second mold members. The charge is then compressed within the mold cavity under the first clamping force F1. Thereafter, the clamping force is reduced from the first clamping force F1 to a second clamping force F2 before the molten thermoplastic resin in the mold cavity has completely solidified. A compressed gas is supplied into at least one unsolidified portion of the molten thermoplastic resin subsequent to the step of closing the mold members and before the molten thermoplastic resin in the mold cavity has completely solidified. The molten thermoplastic resin can then be cooled in the mold cavity and solidified while supplying the compressed gas.
Abstract:
A logic circuit verifying apparatus is provided which can control function verification in response to reports in progress as to the function verification.A logic circuit verifying apparatus is provided with: a first storage unit for storing thereinto circuit design information described in a hardware description language, in which a script description has been embedded in a description described in the hardware description language; a data converting unit for converting the hardware description portion of the circuit design information into first circuit data by compiling the circuit design information read from the first storage unit, and for converting the script description portion of the circuit design information into script data; a first simulation unit for performing a simulation by employing the first circuit data inputted from the data converting unit; and a script processing unit into which the script data is inputted from the data converting unit, and which processes the script data in response to an instruction issued from the first simulation unit.
Abstract:
The present invention provides a DMA transfer controller includes: a transfer parameter storing unit for storing a bus occupation time value and transfer parameters of one set or a plurality of sets of DMA transfers for each of a plurality of logical processors; a data transfer performing unit for performing the DMA transfer on the basis of the DMA transfer parameters; a control unit for controlling the receive and transmit of the DMA transfer parameters and the start and the interruption of the DMA transfers; and a time measuring unit for starting to measure bus occupation elapse time when a first DMA transfer is started for each of the logical processors. When the bus occupation elapse time reaches the bus occupation time value, the control unit interrupts the DMA transfer that is currently performed to start the DMA transfers based on the transfer parameters related to the logical processors of a prescribed sequence.
Abstract:
A resin film of a two-layer-construction comprising: (a) a resin layer R1 including a non-stretched resin film which contains a thermoplastic polyester resin containing 3 to 30 percent by weight in a weight fraction in the entire resin of a granular resin with a grain diameter of 0.1 to 5 μm, the granular resin being a modified polyolefin resin containing 2 to 20 percent by weight of a functional group derived from carboxylic acid in terms of carboxylic acid, and (b) a polyester resin layer R0 containing at least one of polyethylene terephthalate and isophthalic acid copolymerized polyethylene terephthalate, as a basic skeleton, wherein the resin layer R1 and the resin layer R2 are laminated to each other.
Abstract:
In fast Fourier transform, a necessary memory capacity is decreased, thereby decreasing a cost. The fast Fourier transform is performed on a symbol stored in a RAM by a butterfly operation unit in accordance with a RAM address generated by a RAM address generator. A RAM address conversion unit converts an input/output dummy address into an input/output real address by conducting bit reverse by a frequency specified in accordance with an input/output bit reverse signal, and converts a butterfly operation dummy address into a butterfly operation real address by conducting the bit reverse by a frequency specified in accordance with a butterfly operation bit reverse signal. In this manner, among output data of one symbol and input data of another symbol to be stored in the RAM subsequently to the output data of the one symbol, data having a common index indicating their orders in the symbols can be stored at the same address in the RAM. As a result, symbol input and symbol output can be overlapped.
Abstract:
According to the present invention, a hollow molded article of high quality can be produced by conducting the following steps of: providing a small-sized molding machine comprising a mold having a pair of mold halves wherein at least one of the mold halves comprises a body and a slidable block; supplying a resin in an unsolidified state between the mold halves to fill a mold cavity having a first clearance with the resin; supplying a pressured fluid into the resin lying between the mold surfaces; moving the slidable block from a first position to a second position; opening the mold until a cavity clearance becomes a second clearance which is larger than the first clearance; and opening the mold to take out the hollow molded article.
Abstract:
A process for producing a thermoplastic resin hollow molded article is disclosed. The process takes place in a molding machine including first and second mold halves having respective mold surfaces defining a mold cavity. At least one of the mold halves is movable relative to the other mold half to permit the mold surfaces to be moved both towards and away from each other between closed state and unclosed states. At least the first mold half has incorporated therein at least one slidable block defining a portion of the mold surface of the first mold half. According to the process, thermoplastic resin is supplied in a molten state between the mold surfaces while the mold halves are in the unclosed state, and at least one of the mold halves is moved relative to the other mold half to press and spread the thermoplastic resin so that the cavity is filled with the thermoplastic resin. During the process, compressed gas is supplied into the thermoplastic resin located in the cavity. In order to permit expansion of the thermoplastic resin caused by the compressed gas, the slidable block is moved from away from the cavity along the same direction that the mold halves move. The mold is then opened and the thermoplastic resin hollow molded article is removed from the mold cavity.
Abstract:
A positive type photoresist composition comprising a novolak resin and O-quinone diazide compound, the novolak resin being one which is obtained by the addition condensation reaction of a phenol and formaldehyde which is performed in one stage by using as a catalyst an organic acid salt of a divalent metal which is more electropositive than hydrogen, or in two stages by using an acid catalyst in the subsequent stage, the phenol being at least one compound represented by the formula ##STR1## wherein R is hydrogen or an alkyl group of carbon number 1 to 4, the compound being such that the average carbon number in the substituent per one phenol nucelus is 0.5 to 1.5 and the ones with the substituent at the ortho- or para-position with respect to the hydroxyl group account for less than 50 mol %, is disclosed. The positive type photoresist composition of the invention has an improved resolving power, i.e., .gamma.-value.
Abstract:
A photo-curable composite material used for preparing various stencils for screen printing, textile printing or the like, which comprises a flat, flexible and photo-transmitting thin film (A); a flat and flexible film (B); a liquid photo-curable resin and a flat screen material, said films (A) and (B) being air-tightly bonded to each other at the peripheral portion thereof to form a flat inner space therein, said liquid resin being filled in said inner space to form a layer and said screen material also being placed in the inner space substantially in parallel with the inner walls of the films (A) and (B).
Abstract:
In fast Fourier transform, a necessary memory capacity is decreased, thereby decreasing a cost. The fast Fourier transform is performed on a symbol stored in a random access memory (RAM) by a butterfly operation unit in accordance with a RAM address generated by a RAM address generator. A RAM address conversion unit converts an input/output dummy address into an input/output real address by conducting bit reverse by a frequency specified in accordance with an input/output bit reverse signal, and converts a butterfly operation dummy address into a butterfly operation real address by conducting the bit reverse by a frequency specified in accordance with a butterfly operation bit reverse signal. In this manner, among output data of one symbol and input data of another symbol to be stored in the RAM subsequently to the output data of the one symbol, data having a common index indicating their orders in the symbols can be stored at the same address in the RAM. As a result, symbol input and symbol output can be overlapped.