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公开(公告)号:USD1028141S1
公开(公告)日:2024-05-21
申请号:US35516444
申请日:2022-11-11
申请人: Golfyr AG
设计人: Alfredo Häberli
摘要: This US design patent application is related to U.S. Design patent application Ser. Nos. 35/516,091, 35/516,443, 35/516,464, 35/516,468, 35/516,494, and 35/516,501 filed on even date herewith.
FIG. 1.1 shows a right side view of the golf club head.
FIG. 1.2 shows a back side view of the golf club head.
FIG. 1.3 shows a top perspective view of the golf club head.
FIG. 1.4 shows a top view of the golf club head.
FIG. 1.5 shows a left side view of the golf club head.
FIG. 1.6 shows a bottom view of the golf club head.
FIG. 1.7 shows a front view of the golf club head.-
公开(公告)号:US11791437B2
公开(公告)日:2023-10-17
申请号:US16731193
申请日:2019-12-31
申请人: EXALOS AG
发明人: Marcus Dülk , Nicolai Matuschek
CPC分类号: H01L33/0045 , A61B1/0684 , A61B5/0066 , H01L33/10 , H01L33/32 , H01L33/60 , H01S5/50 , H04N9/315
摘要: An amplified spontaneous emission, ASE, source device combining a superluminescent light emitting diode, SLED, with a semiconductor optical amplifier, SOA, the SLED and SOA being arranged in series so that the SLED acts as a seed and the SOA acts as a broadband amplifier for the SLED output. Both SLED and SOA have a structure made up of a succession of epitaxial semiconductor layers which form a waveguide comprising a core of active region layers and surrounding cladding layers. The SLED and SOA confinement factors of the SLED and SOA, wherein confinement factor is the percentage of the optical mode power in the active region layers, is designed so that the SLED confinement factor is greater than that of the SOA by at least 20%. This allow higher power outputs, because the SLED power limits imposed by the onset of non-linear effects and catastrophic optical damage can be circumvented.
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公开(公告)号:USD1028147S1
公开(公告)日:2024-05-21
申请号:US35516501
申请日:2022-11-11
申请人: Golfyr AG
设计人: Alfredo Häberli
摘要: This U.S. design patent application is related to U.S. Design patent application Ser. Nos. 35/516,091, 35/516,443, 35/516,444, 35/516,464, 35/516,468, and 35/516,494 filed on even date herewith.
FIG. 1.1 shows a left side view of the golf club head.
FIG. 1.2 shows a back side view of the golf club head.
FIG. 1.3 shows a top perspective view of the golf club head.
FIG. 1.4 shows a top view of the golf club head.
FIG. 1.5 shows a right side view of the golf club head.
FIG. 1.6 shows a bottom view of the golf club head.
FIG. 1.7 shows a front view of the golf club head.-
公开(公告)号:USD993343S1
公开(公告)日:2023-07-25
申请号:US29760777
申请日:2020-12-03
申请人: ODR, LLC
设计人: Kevin Greco
摘要: This application is related to U.S. Design patent application filed Dec. 3, 2020 entitled “Hard-pack Snow Ski Cover”, U.S. application Ser. No. 29/760,783.
FIG. 1 is a back to front top perspective view of the hard-pack snow ski.
FIG. 2 is a top plan view thereof.
FIG. 3 is a left side view thereof. The right side being a mirror image thereto; and,
FIG. 4 is a bottom plan view thereof.-
公开(公告)号:USD1028143S1
公开(公告)日:2024-05-21
申请号:US35516468
申请日:2022-11-11
申请人: Golfyr AG
设计人: Alfredo Häberli
摘要: This US design patent application is related to U.S. Design patent application Ser. Nos. 35/516,091, 35/516,443, 35/516,444, 35/516,464, 35/516,494, and 35/516,501 filed on even date herewith.
FIG. 1.1 shows a left side view of the golf club head.
FIG. 1.2 shows a back side view of the golf club head.
FIG. 1.3 shows a top perspective view of the golf club head.
FIG. 1.4 shows a top view of the golf club head.
FIG. 1.5 shows a right side view of the golf club head.
FIG. 1.6 shows a bottom view of the golf club head.
FIG. 1.7 shows a front view of the golf club head.-
公开(公告)号:USD1028139S1
公开(公告)日:2024-05-21
申请号:US35516091
申请日:2022-11-11
申请人: Golfyr AG
设计人: Alfredo Häberli
摘要: This US design patent application is related to U.S. Design patent application Ser. Nos. 35/516,443, 35/516,444, 35/516,464, 35/516,468, 35/516,494, and 35/516,501 filed on even date herewith.
FIG. 1.1 shows a left side view of the golf club head.
FIG. 1.2 shows a back side view of the golf club head.
FIG. 1.3 shows a top right perspective view of the golf club head.
FIG. 1.4 shows a top view of the golf club head.
FIG. 1.5 shows a right side view of the golf club head.
FIG. 1.6 shows a bottom view of the golf club head.
FIG. 1.7 shows a front view of the golf club head.-
7.
公开(公告)号:US11950956B1
公开(公告)日:2024-04-09
申请号:US18146369
申请日:2022-12-24
申请人: RFNAV Inc.
CPC分类号: A61B8/4494 , B06B1/0633 , G01N29/2437 , H10N30/2047 , B06B1/00
摘要: Apparatuses, systems, and methods include a PMUT mechanically coupled to, and electrically isolated from, a receive sensor via a common flexible membrane. The receive sensor may be an optical sensor or a receive only PMUT providing a feedback signal based on a received waveform, VRO(t), to modify the drive voltage Vd(t) of the PMUT. The feedback signal may be used to modify the drive voltage Vd(t) of the PMUT to shorten the ring-down period and may be based on the received waveform, VRO(t), and a desired receive waveform, VROD(t), which may be selected to optimize one or more of Q, bandwidth, resonant frequency, and spectral content of the drive voltage Vd(t). The drive voltage Vd(t) may be modified to a minimize a difference between VRO(t), and a desired receive waveform, VROD(t), or a closed loop weighted (α, β) sum of the energy of VRO (t) and the blind zone duration.
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公开(公告)号:US11894130B2
公开(公告)日:2024-02-06
申请号:US17133167
申请日:2020-12-23
申请人: Augmenticon GmbH
发明人: Matthias Friebe
IPC分类号: G16H40/20 , H04N7/14 , G06Q50/04 , G06Q10/0639 , G06Q10/10 , G06Q10/0631 , G06F16/901 , G16H70/40 , G06V20/20 , G06F3/04847
CPC分类号: G16H40/20 , G06F16/9024 , G06Q10/06316 , G06Q10/06395 , G06Q10/103 , G06Q50/04 , G06V20/20 , G16H70/40 , H04N7/147 , G06F3/04847
摘要: A computer apparatus and computer-implemented process for generating a batch record (BR) from a master batch record (MBR) during manufacture of a batch of pharmaceutical product. In the control software, a graphical analysis interface is provided for processing graphs of spectroscopic or chromatographic analysis. A group of fields in the MBR is assigned to the analysis. The operator wears an augmented reality headset and uses this to capture an image of a graph from an instrument display. The graph image is then processed to extract the graph and its metadata, and then further processed to find peaks and assign attribute labels to the peaks, and thus populate the analysis fields. Overlay images are then transmitted to AR headset to present to the operator the populated analysis fields. The operator then accepts or rejects the populated analysis fields by issuing user interface commands.
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公开(公告)号:USD992066S1
公开(公告)日:2023-07-11
申请号:US29760783
申请日:2020-12-03
申请人: ODR, LLC
设计人: Kevin Greco
摘要: This application is related to U.S. Design patent application Ser. No. 29/760,777.
FIG. 1 is a front to back top perspective view of the hard-pack snow ski cover.
FIG. 2 is a left side view thereof. The right side is a mirror image.
FIG. 3 is a bottom plan view thereof with the front on the left.
FIG. 4 is a front to back bottom perspective view thereof.
FIG. 5 is a front view thereof; and,
FIG. 6 is a back view thereof.-
公开(公告)号:US12027810B2
公开(公告)日:2024-07-02
申请号:US17635504
申请日:2020-08-04
申请人: MENHIR PHOTONICS AG
发明人: Benjamin Rudin , Florian Emaury , Roger Valentin
CPC分类号: H01S3/025 , H01S3/034 , H01S3/0401 , H01S3/042 , H01S3/0627 , H01S3/091 , H01S3/0405 , H01S3/1118
摘要: A quasi-monolithic solid-state laser in which the optical components of the laser cavity are bonded to a common substrate via mounts. The optical components and their mounts are fixedly connected to each other and to the substrate by bonding. While the gain medium is bonded to a mount made of a different material with high thermal conductivity for heat sinking, the cavity's lens and mirror components and their mounts are all made of the same material as the substrate, or a different material that is thermally matched to the substrate, and fixedly mounted on the substrate solely with bonding. The bonding is achieved with adhesive bonding, or some other form of bonding such as molecular bonding, chemically activated direct bonding or hydroxide catalysis bonding.
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