摘要:
Disclosed herein are a probe positioning and bonding device and a probe bonding method, and more particularly a probe positioning and bonding device used to fix probes to prescribed positions on a substrate so that a probe card used for semiconductor integrated circuit testing equipment is manufactured, and a probe bonding method using the same. The probe positioning and bonding device comprises a stage unit disposed on a working table, a microscope disposed above the stage unit while being supported by means of a first supporting member disposed on the working table, a probe fixing unit disposed above the stage unit and below the microscope while being supported by means of a second supporting member disposed on the working table, and a light source unit supported by means of a third supporting member disposed on the working table. The light source unit is disposed toward the upper part of the stage unit.
摘要:
Disclosed is an electrical contact element used to test an electronic device. The electrical contact element has a beam portion and a tip portion attached to an end of the beam portion. In representative embodiments, a part of the beam portion is bent, e.g., such that the beam portion is zigzagged one or more times. A projection may be formed around a proximal end of the tip portion.
摘要:
Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.
摘要:
Provided is a probe card and method of fabricating the same. This method comprises forming soldering bumpers electrically connected to conductive patterns on a substrate, forming probes connected to the conductive patterns and supported by the soldering bumpers, and then melting the soldering bumpers to fixing the probes to the substrate. Forming the soldering bumpers includes a step of forming the soldering bumpers in the same pattern and size by means of a photolithography process.
摘要:
Provided is a probe card of a semiconductor testing apparatus, including a printed circuit board to which an electrical signal is applied from external, a space transformer having a plurality of probes directly contacting with a test object, and interconnectors connecting the printed circuit board to the probes of the space transformer. The space transformer includes substrate pieces which the probes are installed on one sides of, and a combination member joining and unifying the substrate pieces together so as to form a large-area substrate with the substrate pieces on the same plane. This probe card is advantageous to improving flatness even with a large area, as well as testing semiconductor chips formed on a wafer in a lump.
摘要:
The present invention relates to a contact tip structure of a connecting element designed for electric testing of electronic components. The connecting element comprises a fixing post coupled to a first electronic component; a beam extending away from said fixing post; a base coupled at one end of the said beam; and a contact tip extending vertically from the bottom surface of the said base. The beam includes an elastic region and an inelastic region extending at a shorter distance than the elastic region. The base vertically extends from the inelastic region in a certain distance and the horizontally extended length (L) of the elastic region of the beam and the vertically extended length (D) of the base are determined such that the contact tip is horizontally extended at a pre-determined distance according to the following formula: Dsin θ+L(cos θ−1)(θ means an angle of elastic deformation of the beam).
摘要:
In a bone conduction speaker, a body has a shape of a cylinder, and a vibrating plate is inserted to a mastoid to close an upper opening portion of the body. An auxiliary vibrating plate is inserted to the mastoid under the vibrating plate. A vibrating coil is attached on a lower side of the auxiliary vibrating plate. A speaker plate is fixed at an inner central portion of the body, and a ring type magnet is fixed on the speaker plate. An edge portion of a yoke is fixed on the ring type magnet and a central portion of the yoke has a protrusion which protrudes in the inside direction of a central hole of the speaker plate. An acoustic vibrating plate is fixed at a lower portion of the body, and an acoustic coil is fixed on the acoustic vibrating plate.
摘要:
In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured.
摘要:
Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.
摘要:
A probe card is disclosed that is easily assembled and maintained and configured to prevent the controlled level of a space transformer from changing due to various causes such as a thermal deformation during a test process. The probe card includes an installation member where probe tips are provided and a printed circuit board (PCB) disposed on the installation member. A reinforcement member is fixed to a top surface of the PCB, and a contact member is disposed between the PCB and the reinforcement member. The contact member and the installation member are fixed by a connect member inserted into an insert hole formed at the PCB, and a control bolt provided for controlling the level of the installation member is inserted into control holes formed at the installation member, the PCB, and the reinforcement member sequentially in a bottom-to-top direction. Due to a convex-up top surface of the contact member, the contact member continues to contact the reinforcement member even though the installation member and the contact member are inclined while controlling the level of the installation member.