公开(公告)号：US20120185194A1

公开(公告)日：2012-07-19

申请号：US13280624

申请日：2011-10-25

Applicant: Akira Matsushita ,  Hiroyuki Mori ,  Akihiro Kawata ,  Masaomi Yoshida

Inventor： Akira Matsushita ,  Hiroyuki Mori ,  Akihiro Kawata ,  Masaomi Yoshida

IPC: G06F19/00

CPC classification number: G05B19/41875 ,  G05B2219/37439 ,  G05B2219/37448 ,  H05K13/0815 ,  H05K13/083 ,  Y02P90/04 ,  Y02P90/22 ,  Y02P90/265 ,  Y02P90/86

Abstract: An inspection item recognition unit references a component type table and recognizes inspection items necessary for specified components, an inspection means selection unit references an inspection machine capability table and selects an inspection means that performs inspection of each inspection item. By this processing, inspection menu information is generated, the inspection menu information associating, for each component, the component type and position information of the component with the inspection item performed on the component and information indicating the inspection means. Each inspection machine receives input of the inspection menu information and recognizes a component for which inspection by the inspection machine is defined, and generates inspection information by associating an inspection program with the position information of the component according to the component type of the component.

Abstract translation: 检查项目识别单元参考组件类型表并且识别特定组件所需的检查项目，检查单元选择单元参考检查机能力表，并选择对每个检查项目进行检查的检查单元。 通过该处理，生成检查菜单信息，检查菜单信息针对每个部件关于部件的部件类型和位置信息与对部件执行的检查项目和指示检查装置的信息相关联。 每个检查机器接收检查菜单信息的输入，并且识别由检查机器进行检查的部件，并且通过根据部件的部件类型将检查程序与部件的位置信息相关联来生成检查信息。

公开(公告)号：US20110218754A1

公开(公告)日：2011-09-08

申请号：US13033926

申请日：2011-02-24

Applicant: Hiroyuki Mori

Inventor： Hiroyuki Mori

IPC: G06F19/00

CPC classification number: H05K3/1216 ,  G01B11/00 ,  G01B11/06 ,  G01B11/28 ,  H05K3/225 ,  H05K13/083 ,  H05K2203/163

Abstract: In a solder printing inspection machine, an identification code and an inspection time of an inspection target board are accumulated in a memory. The accumulated data, whose identification code is matched with that of the current inspection target board, is searched while the accumulated data is traced back one by one. When the corresponding board is found, it is recognized that the board is extracted because of the defective board and the inspection target board is the reintroduced board that was previously extracted. A graph, in which pieces of information expressing the pieces of quality of the boards are arrayed in time series, is produced based on each time of inspection result and the graph is displayed on a monitor. In the pieces of data included in the graph, the data corresponding to the board that is recognized as the reintroduction is explicitly shown by a letter “R”.

Abstract translation: 在焊锡印刷检查机中，将检查对象板的识别码和检查时间累积在存储器中。 在累积数据逐个追溯的同时搜索其识别码与当前检查对象板的识别码相匹配的累积数据。 当发现对应的电路板时，由于缺陷电路板被认为是提取电路板，检查目标板是先前提取的再导入板。 基于检查结果的每个时间产生表示时间序列中的表示质量的信息的图形，并且将图表显示在监视器上。 在图中包含的数据中，与被识别为重新引入的板对应的数据明确地用字母“R”表示。

公开(公告)号：US20090082998A1

公开(公告)日：2009-03-26

申请号：US11914273

申请日：2006-06-26

Applicant: Yasuhiro Maenishi

Inventor： Yasuhiro Maenishi

IPC: G06F15/00 ,  B23P19/00

CPC classification number: H05K13/0853 ,  H05K13/0812 ,  H05K13/0815 ,  H05K13/083 ,  Y10T29/4913 ,  Y10T29/49432 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A method of determining a mounting condition of a mounter (100) mounting a component (A) onto a board (120), which includes the steps of: obtaining an operational state parameter; and determining, in the case where a value of the obtained operational state parameter is not within a predetermined range, a mounting condition so that the value of the operational state parameter falls within the predetermined range.

Abstract translation: 一种确定将组件（A）安装到板（120）上的安装器（100）的安装状态的方法，其包括以下步骤：获得操作状态参数; 以及在所获得的操作状态参数的值不在预定范围内的情况下，确定所述操作状态参数的值落在预定范围内的安装条件。

公开(公告)号：US20080166039A1

公开(公告)日：2008-07-10

申请号：US11956951

申请日：2007-12-14

Applicant: Kazuki TATEYAMA ,  Hideki OGAWA ,  Satoshi IMI

Inventor： Kazuki TATEYAMA ,  Hideki OGAWA ,  Satoshi IMI

IPC: G06K9/00

CPC classification number: H05K3/3484 ,  H05K1/0269 ,  H05K3/1233 ,  H05K3/341 ,  H05K13/0817 ,  H05K13/083 ,  H05K2203/163 ,  Y10T29/49004

Abstract: A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data. The process control method includes: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein, calculating representative data for each said component from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each said component in a secondary recorder; and determining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder.

Abstract translation: 提供了一种用于表面安装线的工艺控制方法，该表面安装线包括用于在基板的表面上印刷焊料的焊料打印机，用于检查印刷焊料并输出印刷质量数据的焊料印刷检查器，用于将部件安装在基板上的安装器 焊接印刷，用于检查安装部件的状态并输出安装质量数据的安装检查器，用于加热焊料以将部件焊接到基板的回流炉，以及用于检查焊接和输出焊接通过状态的焊接检查器 /失败数据。 过程控制方法包括：通过记录在其中的打印质量数据，安装质量数据和焊接通过/失败数据，从主记录器检索打印质量数据，安装质量数据和焊接合格/不合格数据，计算 根据打印质量数据为每个所述组件提供代表性数据，并且在二次记录器中记录每个所述部件的代表性数据，安装质量数据和焊接合格/不合格数据; 并且通过使用表示符合记录在副记录器中的数据的焊接合格/不合格数据的部件的数据来确定焊料打印机和安装器是否需要调整。

公开(公告)号：US07356918B2

公开(公告)日：2008-04-15

申请号：US10537304

申请日：2003-12-02

Applicant: Osamu Okuda ,  Kazuo Kido ,  Hideki Uchida ,  Haneo Iwamoto ,  Takashi Yazawa ,  Kazuyuki Yoshidomi

Inventor： Osamu Okuda ,  Kazuo Kido ,  Hideki Uchida ,  Haneo Iwamoto ,  Takashi Yazawa ,  Kazuyuki Yoshidomi

IPC: H05K3/30

CPC classification number: H05K13/0812 ,  H05K13/083 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53178

Abstract: An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then an electronic component can be mounted in a prescribed position or almost in the prescribed position.

Abstract translation: 提供具有沿X轴方向和Y轴方向线性变形的结构的X-Y机器人，照相机基准标记和控制单元。 X-Y机器人不会发生翘曲等的位移，并且即使由于连续的动作而发生热量，也仅沿X轴方向和Y轴方向线性变形。 因此，如果通过用板识别摄像机拾取摄像机基准标记的图像而获得由于热量引起的XY机器人的伸缩量，并且基于扩展量校正元件放置位置， 收缩，则电子部件可以安装在规定位置或几乎在规定位置。

公开(公告)号：US20060048380A1

公开(公告)日：2006-03-09

申请号：US10537304

申请日：2003-12-02

Applicant: Osamu Okuda ,  Kazuo Kido ,  Hideki Uchida ,  Haneo Iwamoto ,  Takashi Yazawa ,  Kazuyuki Yoshidomi

Inventor： Osamu Okuda ,  Kazuo Kido ,  Hideki Uchida ,  Haneo Iwamoto ,  Takashi Yazawa ,  Kazuyuki Yoshidomi

IPC: H05K3/30

CPC classification number: H05K13/0812 ,  H05K13/083 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53178

Abstract: An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then the electronic component can be mounted in the prescribed position or almost in the prescribed position.

Abstract translation: 提供具有沿X轴方向和Y轴方向线性变形的结构的X-Y机器人，照相机基准标记和控制单元。 X-Y机器人不会发生翘曲等的位移，并且即使由于连续的动作而发生热量，也仅沿X轴方向和Y轴方向线性变形。 因此，如果通过用板识别摄像机拾取摄像机基准标记的图像而获得由于热量引起的XY机器人的伸缩量，并且基于扩展量校正元件放置位置， 收缩，则电子部件可以安装在规定位置或几乎在规定位置。

公开(公告)号：US07003477B2

公开(公告)日：2006-02-21

申请号：US10374483

申请日：2003-02-26

Applicant: Phillip Zarrow

Inventor： Phillip Zarrow

IPC: G06F17/60

CPC classification number: G06Q10/10 ,  G06Q10/063 ,  G06Q10/0631 ,  G06Q10/06311 ,  G06Q10/063112 ,  G06Q10/06395 ,  H05K3/00 ,  H05K13/083 ,  H05K13/0888

Abstract: An improved method for certifying that a manufacturing facility is capable of producing quality products of a particular type is disclosed. The improved method may comprise auditing the manufacturing facility against a process standard and issuing a certification to the process standard if the manufacturing facility passes the audit. This improved method is particularly suited to manufacturing facilities producing printed circuit assemblies and/or printed circuit boards.

公开(公告)号：US20030030429A1

公开(公告)日：2003-02-13

申请号：US09924279

申请日：2001-08-08

Inventor： Yuen-Foo Michael Kou

IPC: G01R001/00

CPC classification number: G01R31/2881 ,  G01R31/287 ,  H05K13/083 ,  H05K13/086

Abstract: A method is disclosed of monitoring an environmental condition associated with a container with a set of electronic components including attaching a moisture recorder to the container, the moisture recorder comprising a sensing element responsive to atmospheric moisture content, a memory storage device, and a processor electrically coupled to the sensing element and the memory storage device, the processor being configured to periodically receive information from the sensing element indicative of atmospheric moisture content and to store data in the memory storage device based on the received information.

Abstract translation: 公开了一种监测与具有一组电子部件的容器相关联的环境条件的方法，包括将水分记录器附接到容器，水分记录器包括响应于大气含水量的感测元件，存储器存储装置和电子处理器 耦合到感测元件和存储器存储设备，处理器被配置为周期性地从感测元件接收指示大气含水量的信息，并且基于接收到的信息将数据存储在存储器存储设备中。

公开(公告)号：US20020083570A1

公开(公告)日：2002-07-04

申请号：US10037094

申请日：2001-10-25

Inventor： Masafumi Inoue ,  Mitsuhaya Tsukamoto ,  Masato Fujioka

IPC: B23P011/00 ,  B21D039/03 ,  H01S004/00

CPC classification number: H05K13/0465 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/1216 ,  H05K13/0817 ,  H05K13/083 ,  Y10T29/49002 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49826 ,  Y10T29/53052 ,  Y10T29/53091 ,  Y10T29/53178

Abstract: A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.

Abstract translation: 一种部件安装系统，其包括用于在形成在板上的电极上印刷焊料的打印机; 第一检查单元，用于检测印刷焊料的位置并输出焊料位置检测结果; 组件安装单元，用于从部件供给器托架拾取部件，并使用安装头将部件放置在板上; 第二检查单元，用于检查放置的部件的位置并输出部件位置检测结果; 焊接单元，用于通过加热和熔化焊料将部件焊接到板上; 至少基于焊料位置检测结果或分量位置检测结果，至少更新用于控制打印机操作的控制参数或部件安装单元操作的控制参数的主控制器。 上述配置使得能够在整个安装过程中进行准确和有效的质量控制。