公开(公告)号：US20170064834A1

公开(公告)日：2017-03-02

申请号：US15239943

申请日：2016-08-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Shinichiro KUROIWA

IPC: H05K1/18 ,  H01G4/12 ,  H05K1/02 ,  H01C7/00 ,  H01C1/01 ,  H01G4/30 ,  H01G4/248

CPC classification number: H05K1/181 ,  H01C1/01 ,  H01C1/014 ,  H01C1/142 ,  H01C1/148 ,  H01C7/008 ,  H01C7/18 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/0296 ,  H05K2201/0909 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

Abstract: A collective substrate for resistor devices includes a base, a first conductive pattern in a to-be-product region and a to-be-cut-away region of the base, and a resistive element in the to-be-product region of the base. The to-be-cut-away region includes a first region adjacent to the to-be-product region in a first direction, and a second region adjacent to the to-be-product region in a second direction. The first conductive pattern includes a first terminal portion connected to the resistive element and disposed in the to-be-product region, a first electrode portion disposed in the first region and larger in area than the first terminal portion, and a first interconnect portion extended from the first terminal portion toward the second region to be connected to the first electrode portion.

Abstract translation: 用于电阻器件的集合衬底包括基底，待产品区域中的第一导电图案和基底的待切割区域，以及在待产品区域中的电阻元件 基础。 待切割区域包括与第一方向上的待产品区域相邻的第一区域和与第二方向上的待产品区域相邻的第二区域。 第一导电图案包括连接到电阻元件并设置在产品区域中的第一端子部分，设置在第一区域中的第一电极部分和比第一端子部分大的区域，以及第一互连部分延伸 从第一端子部分朝向与第一电极部分连接的第二区域。

公开(公告)号：US09357634B2

公开(公告)日：2016-05-31

申请号：US13870414

申请日：2013-04-25

Applicant: KEMET Electronics Corporation

Inventor： John E. McConnell ,  Alan P. Webster ,  John Bultitude ,  Abhijit Gurav

IPC: H05K7/04 ,  H01L23/49 ,  H05K1/02 ,  H05K3/30 ,  H01G4/38 ,  H01C1/014 ,  H01C1/14 ,  H01C7/18 ,  H01G2/06 ,  H01G4/232 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01C1/014 ,  H01C1/14 ,  H01C7/18 ,  H01G2/06 ,  H01G4/232 ,  H01G4/38 ,  H05K1/181 ,  H05K1/182 ,  H05K3/30 ,  H05K3/301 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10454 ,  Y10T29/49121

Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.

Abstract translation: 描述了一种改进的离散电子设备和制造改进的分立电子设备的方法。 分立的电子设备具有带终端和引线框架的电子无源部件。 补偿兼容部件在终端和引线框架之间。 补偿柔性部件具有复合芯和复合芯上的第一导体。 第一个导线与端子电接触。 第二导体也在复合芯上，其中第二导体与引线框架电接触。

公开(公告)号：US20160141106A1

公开(公告)日：2016-05-19

申请号：US15007355

申请日：2016-01-27

Applicant: Kemet Electronics Corporation

Inventor： Maurice Perea ,  R Allen Hill ,  Reggie Phillips

IPC: H01G4/30

CPC classification number: H01G4/30 ,  H01C1/014 ,  H01C1/14 ,  H01G4/232 ,  Y10T29/417 ,  Y10T29/43

Abstract: A method of forcing a stacked electronic component, and an electronic component formed by the method, therein the method includes:providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination;providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads;providing a molded case comprising a cavity and a bottom; and terming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate which the barbs protruding towards the electronic components and the leads extending through the bottom.

Abstract translation: 一种强制堆叠电子元件的方法，以及通过该方法形成的电子部件，其中所述方法包括：提供多个电子部件，其中每个电子部件包括第一外部端接和第二外部端接; 提供第一引线框架板和第二引线框架板，其中第一引线框架板和第二引线框架板包括倒钩和引线; 提供包括空腔和底部的模制外壳; 并且将第一引线框架板和第二引线框架板之间的阵列中的电子部件的三明治命名为倒钩朝向电子部件突出的引线，并且引线延伸穿过底部。

公开(公告)号：US20150287505A1

公开(公告)日：2015-10-08

申请号：US14441840

申请日：2013-11-07

Applicant: SMART ELECTRONICS INC.

Inventor： Jong il Jung ,  Doo Won Kang ,  Gyu Jin Ahn ,  Sang Joon Jin ,  Hyun Chang Kim ,  Kyung Mi Lee

IPC: H01C1/024 ,  H01C17/02 ,  B23K35/30 ,  B23K1/00 ,  B23K1/19 ,  B23K35/02 ,  H01C1/026 ,  H01C17/28

CPC classification number: H01C1/024 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/3006 ,  H01C1/014 ,  H01C1/026 ,  H01C1/08 ,  H01C1/144 ,  H01C17/02 ,  H01C17/28 ,  H01H85/048

Abstract: A resistor and a manufacturing method thereof are disclosed. Since a ceramic tube formed of a ceramic material is used and the ceramic tube is joined to sealing electrodes by use of brazing rings, joining strength and durability of the resistor are considerably improved. The resistor may be stably used at a high voltage due to excellent heat dissipation characteristics thereof.

Abstract translation: 公开了一种电阻器及其制造方法。 由于使用由陶瓷材料形成的陶瓷管，并且通过使用钎焊环将陶瓷管接合到密封电极，所以电阻器的接合强度和耐久性显着提高。 由于其优异的散热特性，电阻器可以在高电压下稳定地使用。

公开(公告)号：US20130335189A1

公开(公告)日：2013-12-19

申请号：US13985473

申请日：2012-04-16

Applicant: Yuuichi Abe ,  Kenji Oka ,  Fuyuki Abe ,  Kazuhiro Miura ,  Mikinori Amisawa ,  Atsumi Miyakawa ,  Takahiro Senshu ,  Yuji Yamagishi ,  Jun Ootsuki

Inventor： Yuuichi Abe ,  Kenji Oka ,  Fuyuki Abe ,  Kazuhiro Miura ,  Mikinori Amisawa ,  Atsumi Miyakawa ,  Takahiro Senshu ,  Yuji Yamagishi ,  Jun Ootsuki

IPC: H02H9/04 ,  H01C17/30

CPC classification number: H02H9/04 ,  H01C1/014 ,  H01C7/1006 ,  H01C7/102 ,  H01C7/112 ,  H01C17/30 ,  Y10T29/49082

Abstract: An electrostatic discharge (ESD) protector includes a first high heat-conductive substrate, a second high heat-conductive substrate, a varistor layer, and a plurality of via-hole electrodes. The first high heat-conductive substrate is provided with a plurality of first through-holes. The second high heat-conductive substrate is provided with a plurality of second through-holes. The varistor layer that is mainly composed of zinc oxide is disposed between the first high heat-conductive substrate and the second high heat-conductive substrate. The varistor layer includes internal electrodes. Each of via-hole electrodes penetrates the varistor layer and fills both one of the first through-holes and one of the second through-holes to couple both the ones to each other.

Abstract translation: 静电放电（ESD）保护器包括第一高导热衬底，第二高导热衬底，变阻器层和多个通孔电极。 第一高导热基板设置有多个第一通孔。 第二高导热基板设置有多个第二通孔。 主要由氧化锌构成的变阻器层配置在第一高导热性基板和第二高导热性基板之间。 压敏电阻层包括内部电极。 每个通孔电极穿透压敏电阻层，并且填充第一通孔和第二通孔中的一个，以将两者彼此连接。

公开(公告)号：US20130328153A1

公开(公告)日：2013-12-12

申请号：US13966317

申请日：2013-08-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadamasa MIURA

IPC: H01L35/02

CPC classification number: H01L35/02 ,  H01C1/014 ,  H01C1/14 ,  H01C1/1406 ,  H01C1/1413 ,  H01C1/144 ,  H01C7/008 ,  H01L24/16 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: An electronic-component mounting structure includes an electronic component which includes a metal substrate, a semiconductor ceramic layer located on the metal substrate, a pair of split electrodes located on the semiconductor ceramic layer, and plating films located on the split electrodes and the metal substrate, and a mounting body on which lands to be connected to the respective split electrodes of the electronic component are provided. The position of a peripheral end portion of each land to be connected to the corresponding split electrode is located farther inside than the position of a peripheral end portion of the split electrode. In addition, a plane area of the land is smaller than that of the split electrode.

Abstract translation: 一种电子部件安装结构，包括电子部件，其包括金属基板，位于金属基板上的半导体陶瓷层，位于半导体陶瓷层上的一对分裂电极以及位于分割电极和金属基板上的镀膜 以及安装体，其上设置有与电子部件的各个分割电极连接的焊盘。 要连接到相应的分裂电极的每个焊盘的外围端部的位置位于比分裂电极的外周端部的位置更远的位置。 此外，焊盘的平面面积小于分割电极的平面面积。

公开(公告)号：US20120126933A1

公开(公告)日：2012-05-24

申请号：US13255499

申请日：2011-06-16

Applicant: Yufeng Qiu ,  Guang fu Tang ,  Juan Zhang

Inventor： Yufeng Qiu ,  Guang fu Tang ,  Juan Zhang

IPC: H01C1/08

CPC classification number: H01C1/082 ,  H01C1/014

Abstract: This present invention provides a high power water-cooling resistor used for high voltage direct current converter valve, which adopts water-cooling directly. It is characterized by that there are four resistance films, the resistance layer with required resistance, wherein the power of each resistance film can be up to 1500 w at least to form high power resistor. The water flows through one side of resistance film-substrate to take away the heat produced by resistor. The resistor adopts insulated cooling. The thermal resistance between resistor and water is extremely low, and the heat transfer area is also large, the temperature of the resistor declines greatly at the same power. It makes the high power water-cooling resistor have high power to volume ratio; its power can be up to 6 kW under adequate water flow condition. It is suitable for high power condition. The inside space of resistor body is large, so there are some advantages when water cut off is test. The case of the resistor is made of white high strength pps engineering plastic, and it can bear 2 Mpa water pressure, which is better than PVDF material. The inlet and outlet are all the bottom of the resistor, and the wire terminals are the top.

Abstract translation: 本发明提供了一种直接采用水冷的高压直流换流阀所用的大功率水冷电阻器。 其特征在于有四个电阻膜，具有所需电阻的电阻层，其中每个电阻膜的功率可以高达1500W，至少形成高功率电阻。 水流过电阻膜基板的一侧，以消除电阻产生的热量。 电阻采用绝缘冷却。 电阻与水之间的热阻极低，传热面积也大，电阻温度在相同的功率下大幅下降。 大功率水冷电阻器具有较高的功率/体积比; 在足够的水流条件下，其功率可达6 kW。 适用于高功率条件。 电阻体的内部空间大，因此在切断水时有一些优点。 电阻器由白色高强度pps工程塑料制成，可承受2 Mpa的水压，优于PVDF材料。 入口和出口都是电阻的底部，电线端子是顶部。

公开(公告)号：US20110285498A1

公开(公告)日：2011-11-24

申请号：US13109276

申请日：2011-05-17

Applicant: Masaki YONEDA ,  Makoto TOYONAGA

Inventor： Masaki YONEDA ,  Makoto TOYONAGA

IPC: H01C1/012

CPC classification number: H01C1/014 ,  H01C1/144 ,  H01C7/003

Abstract: A surface-mounted resistor includes a flat-type base member having a first surface, a second surface, and a lateral surface. Each of the first and second surfaces has a rectangular shape. The surface-mounted resistor also includes a resistance element faulted on the first surface; a pair of internal electrodes formed on both ends of the resistance element by being partially superposed with the resistance element; and a pair of external electrodes. Each of the external electrodes has a first bended portion having an L-shape formed by an internal electrode connection portion and a lateral portion, and a second bended portion having an L-shape formed by the lateral portion and a substrate connection portion. The internal electrode and the internal electrode connection portion are fixed to each other through a conductive fixation material, and a position of the base member is biased in a thickness direction toward the first bended portion.

Abstract translation: 表面安装的电阻器包括具有第一表面，第二表面和侧表面的平坦型基底构件。 第一和第二表面中的每一个具有矩形形状。 表面安装电阻器还包括在第一表面上故障的电阻元件; 一对内电极，与所述电阻元件部分重叠地形成在所述电阻元件的两端; 和一对外部电极。 每个外部电极具有由内部电极连接部分和侧部形成的具有L形的第一弯曲部分和由侧部形成的L形的第二弯曲部分和基板连接部分。 内部电极和内部电极连接部分通过导电固定材料彼此固定，并且基底部件的位置朝向第一弯曲部分的厚度方向偏置。

公开(公告)号：US07936247B2

公开(公告)日：2011-05-03

申请号：US12356417

申请日：2009-01-20

Applicant: Jan Ihle ,  Werner Kahr

Inventor： Jan Ihle ,  Werner Kahr

IPC: H01C3/00

CPC classification number: H05B3/34 ,  H01C1/014 ,  H01C1/082 ,  H01C1/14 ,  H01C7/02 ,  H01C13/02 ,  H05B2203/005 ,  H05B2203/009 ,  H05B2203/017 ,  H05B2203/02 ,  H05K1/189

Abstract: A resistor arrangement with resistor elements is specified that are arranged essentially regularly and that are spaced apart from each other and that are interconnected by a flexible substrate. According to a first preferred embodiment, intermediate spaces that are provided to carry a flow of flowing medium are arranged between the resistor elements. According to a second preferred embodiment, the resistor elements are arranged between two flexible substrates and are rigidly connected to these substrates. According to a third preferred embodiment, an electrically insulating adhesive layer that has openings through which the resistor elements are conductively connected to the substrate is arranged between the resistor elements and the substrate. According to a fourth preferred embodiment, the substrate is composed of, as a ground material, an elastic plastic that is filled with electrically conductive particles. In addition, a method for producing the resistor arrangement is specified.

Abstract translation: 具有电阻器元件的电阻器布置被规定为基本上规则地布置并且彼此间隔开并且通过柔性基板互连。 根据第一优选实施例，设置用于承载流动介质流的中间空间布置在电阻元件之间。 根据第二优选实施例，电阻器元件布置在两个柔性基板之间并刚性地连接到这些基板。 根据第三优选实施例，具有开口的电绝缘粘合剂层布置在电阻器元件和基板之间，电阻元件与基板导电连接。 根据第四优选实施例，基板由填充有导电颗粒的弹性塑料作为研磨材料构成。 另外，规定了电阻装置的制造方法。

公开(公告)号：US20110063071A1

公开(公告)日：2011-03-17

申请号：US12950177

申请日：2010-11-19

Applicant: FELIX ZANDMAN ,  CLARK L. SMITH ,  TODD L. WYATT ,  THOMAS L. VEIK ,  THOMAS L. BERTSCH

Inventor： FELIX ZANDMAN ,  CLARK L. SMITH ,  TODD L. WYATT ,  THOMAS L. VEIK ,  THOMAS L. BERTSCH

IPC: H01C1/034 ,  H01C17/02

CPC classification number: H01C1/08 ,  H01C1/014 ,  H01C13/02 ,  H01C17/23 ,  Y10T29/49087 ,  Y10T29/49098 ,  Y10T29/49101

Abstract: A power resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the power resistor. The power resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material.

Abstract translation: 功率电阻器包括第一和第二相对端子，由第一和第二相对端子之间的多个电阻元件段形成的电阻元件，分隔两个电阻元件段之间的至少一个分段导电条，以及至少一个开口区域， 第一和第二相对端子并且分离至少两个电阻元件段。 多个电阻元件段的分离有助于在整个功率电阻器中传播热量。 功率电阻器或其他电子部件可以通过用导热和电绝缘材料结合到散热片上来封装。