公开(公告)号：US09815978B2

公开(公告)日：2017-11-14

申请号：US15467164

申请日：2017-03-23

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Daigo Yamashina ,  Shuhei Uchiyama ,  Satoru Yamauchi

IPC: H01L33/00 ,  F21V11/00 ,  C08L33/00 ,  H01L33/58 ,  C09D133/00 ,  C09D7/12 ,  G02B5/02 ,  G02B1/04 ,  F21V29/87 ,  F21V9/00 ,  H01L33/54 ,  F21V9/02 ,  H01L33/56 ,  H01L33/52 ,  F21V9/04 ,  F21V9/06 ,  F21Y115/10

CPC classification number: C08L33/00 ,  C08K5/54 ,  C08L33/10 ,  C08L33/12 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/14 ,  C08L2205/22 ,  C09D7/69 ,  C09D7/70 ,  C09D133/00 ,  F21V3/0625 ,  F21V3/10 ,  F21V9/00 ,  F21V9/02 ,  F21V9/04 ,  F21V9/06 ,  F21V29/87 ,  F21Y2115/10 ,  G02B1/04 ,  G02B5/0242 ,  G02B5/0278 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2933/0091 ,  C08L33/08

Abstract: A light diffuser includes: a thermoplastic resin base which has a thermal expansion coefficient of at least 4×10−5/K and at most 8×10−5/K; and a light diffusion layer which is disposed on a surface of the thermoplastic resin base and includes an acrylic resin film and an acrylic resin particle, the acrylic resin film including one or more acrylic resins having a glass transition temperature of at least 30° C. and at most 50° C., the acrylic resin particle being included in the acrylic resin film and having an average particle size of at least 1 μm and at most 15 μm.

公开(公告)号：US20170276318A1

公开(公告)日：2017-09-28

申请号：US15512304

申请日：2015-09-15

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Huiling Pan ,  Paul Scott Martin ,  Albrecht Johannes Kraus ,  Chao Ding ,  Sze Kuang Lee

IPC: F21V3/04 ,  F21V7/22 ,  F21V29/87 ,  F21V29/77 ,  F21V3/02 ,  F21V23/00

CPC classification number: F21V3/0625 ,  F21K9/23 ,  F21K9/90 ,  F21V3/02 ,  F21V5/048 ,  F21V7/22 ,  F21V23/005 ,  F21V23/06 ,  F21V29/77 ,  F21V29/87 ,  F21Y2115/10

Abstract: A device according to embodiments of the invention includes a light emitting diode (LED) mounted on an electrically conducting substrate. A lens is disposed over the LED. A polymer body is molded over the electrically conducting substrate and in direct contact with the lens.

公开(公告)号：US09709221B2

公开(公告)日：2017-07-18

申请号：US14509798

申请日：2014-10-08

Applicant: Forever Bulb, LLC

Inventor： David W. Carroll ,  Wendell L. Carroll

IPC: F21K9/232 ,  F21K99/00 ,  F21V29/70 ,  F21V3/02 ,  H05B33/08 ,  F21V29/00 ,  F21V29/85 ,  F21V29/87 ,  F21V29/89 ,  F21Y115/10 ,  F21Y107/00

CPC classification number: F21V29/70 ,  F21K9/232 ,  F21V3/02 ,  F21V29/86 ,  F21V29/87 ,  F21V29/89 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05B33/0803 ,  Y02B20/383

Abstract: An LED light bulb device including a bulb body, a flex circuit leg, an LED, conversion circuitry and a cap.

公开(公告)号：US20170184258A1

公开(公告)日：2017-06-29

申请号：US14997599

申请日：2016-01-18

Applicant: ZHUHAI SEPSTAR ELECTRONIC CO., LTD.

Inventor： Meihua Yu

IPC: F21K99/00 ,  F21V29/85

CPC classification number: F21K9/90 ,  B29C45/0001 ,  B29K2077/00 ,  B29K2995/0013 ,  F21K9/20 ,  F21K9/30 ,  F21S8/02 ,  F21V15/01 ,  F21V19/005 ,  F21V23/006 ,  F21V29/507 ,  F21V29/85 ,  F21V29/87 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: The present invention relates to an LED lamp having an integrally injection-molded heat conductive plastic part and loading power substrate, comprising a lamp shell and LED modules, the lamp shell being injection-molded from heat conductive plastic material, the LED modules which are connected by injection being provided in the lamp shell; and each of the LED modules comprises an aluminum substrate and a power circuit module, and LED beads are provided on the aluminum substrate and in ON-connection with the power circuit module. Since the LED modules have been connected by injection during the injection of the lamp shell of the LED lamp of the present invention, this may greatly simplify the subsequent assembly processes, significantly improve the production efficiency and obviously reduce the number of operators for assembling.

公开(公告)号：US09605844B2

公开(公告)日：2017-03-28

申请号：US12551921

申请日：2009-09-01

Applicant: Paul Kenneth Pickard

Inventor： Paul Kenneth Pickard

IPC: F21V29/77 ,  F21V29/00 ,  F21V29/75 ,  F21V29/87 ,  F21V29/89 ,  F21V29/51 ,  F21V29/505 ,  F21V29/507 ,  F21Y101/00 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: F21V29/773 ,  F21V29/004 ,  F21V29/006 ,  F21V29/505 ,  F21V29/507 ,  F21V29/51 ,  F21V29/75 ,  F21V29/87 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A lighting device comprising at least a first light emitter, at least a first heat transfer element, and a plurality of heat dissipation elements. Each heat dissipation element has at least a first region and a second region, the first region being in contact with the first heat transfer element, the second region being closer to the first light emitter than the first region. The first light emitter is thermally coupled to the first heat transfer element.

公开(公告)号：US09605821B2

公开(公告)日：2017-03-28

申请号：US14547652

申请日：2014-11-19

Applicant: GE LIGHTING SOLUTIONS, LLC

Inventor： Bidour Al-Gaadi ,  Xavier Jacques Denis ,  Zoltán Hercz ,  Balázs Nagy

IPC: F21S8/08 ,  H05K1/02 ,  F21V15/01 ,  F21V29/87 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: F21S8/086 ,  F21V15/01 ,  F21V29/87 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: An outdoor light emitting diode (LED) luminaire includes a plastic housing having two or more surfaces, a printed circuit board (PCB) coupled to at least one of the two or more surfaces, the PCB including a substrate and a conductive surface on the substrate, a plurality of LED light sources mounted on the PCB, a first portion of the conductive surface forming conductive paths in electrical communication with the plurality of LED light sources, and a second portion of the conductive surface forming thermal pads at a plurality of locations that are at least one of between and around the plurality of LED light sources, the thermal pads configured to dissipate heat generated by the plurality of LED light sources.

公开(公告)号：US20170030568A1

公开(公告)日：2017-02-02

申请号：US15101100

申请日：2014-12-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Ji Hoon KIM

IPC: F21V29/70 ,  F21V3/00 ,  F21V29/89

CPC classification number: F21V29/70 ,  F21S41/141 ,  F21S45/47 ,  F21V3/00 ,  F21V29/507 ,  F21V29/71 ,  F21V29/87 ,  F21V29/89 ,  F21V29/90 ,  F21W2131/40 ,  F21Y2115/10

Abstract: The present invention relates to a heat sink and a lighting apparatus, and the heat sink, according to one embodiment of the present invention, comprises: a heat transfer module for transferring heat generated from a light source module; and a housing including the light source module and a heat sink module for radiating the heat transferred from the heat transfer module.

Abstract translation: 本发明涉及一种散热器和照明装置，并且根据本发明的一个实施例的散热器包括：传热模块，用于传递从光源模块产生的热量; 以及壳体，其包括光源模块和散热模块，用于辐射从传热模块传递的热量。

公开(公告)号：US09541253B2

公开(公告)日：2017-01-10

申请号：US14509480

申请日：2014-10-08

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Shien-Cheng Kuo

IPC: F21V3/00 ,  F21V1/00 ,  F21K99/00 ,  F21V29/00 ,  F21S8/08 ,  F21V5/00 ,  F21V29/80 ,  F21V29/87 ,  F21V29/85 ,  F21W131/103 ,  F21Y105/00 ,  F21Y101/00

CPC classification number: F21V1/00 ,  F21K9/00 ,  F21S8/08 ,  F21V5/007 ,  F21V29/80 ,  F21V29/85 ,  F21V29/87 ,  F21W2131/103 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  Y02B20/72

Abstract: LED light sources utilized in a street lamp include a base seat, a lamp shade mounted on the base seat, and a top housing coupled with the base seat. The base seat includes a plurality of first heat dissipation columns integrated with the base seat. The lamp shade includes a plurality of the LED light sources. The top housing includes a plurality of second heat dissipation columns integrated with the top housing. The base seat, the first heat dissipation columns, the top housing, and the second heat dissipation columns are made of a polyamide resin containing a graphite powder.

Abstract translation: 在路灯中使用的LED光源包括基座，安装在基座上的灯罩，以及与基座连接的顶壳。 基座包括与基座一体化的多个第一散热柱。 灯罩包括多个LED光源。 顶部壳体包括与顶部壳体集成的多个第二散热塔。 基座，第一散热柱，顶壳和第二散热柱由含有石墨粉的聚酰胺树脂制成。

公开(公告)号：US09534765B2

公开(公告)日：2017-01-03

申请号：US13338437

申请日：2011-12-28

Applicant: Paul Kenneth Pickard ,  Dong Lu ,  James Michael Lay ,  Joe Janisch

Inventor： Paul Kenneth Pickard ,  Dong Lu ,  James Michael Lay ,  Joe Janisch

IPC: F21S4/00 ,  F21V21/00 ,  F21V13/04 ,  B29C47/06 ,  F21V7/00 ,  B29C47/00 ,  F21S2/00 ,  F21S8/06 ,  F21V3/04 ,  F21V7/22 ,  F21V21/005 ,  F21V29/74 ,  F21V29/75 ,  F21V29/77 ,  F21V29/87 ,  F21V29/89 ,  F21Y101/00

CPC classification number: F21V13/04 ,  B29C47/003 ,  B29C47/067 ,  F21S2/00 ,  F21S8/06 ,  F21V3/06 ,  F21V7/0016 ,  F21V7/005 ,  F21V7/22 ,  F21V21/005 ,  F21V29/745 ,  F21V29/75 ,  F21V29/777 ,  F21V29/87 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  Y10T29/49002

Abstract: A light fixture with coextruded components is disclosed. Embodiments of the present invention provide a solid-state light fixture suitable for use in commercial environments. A light fixture according to example embodiments of the invention includes an LED light source and a coextruded optical assembly. In some embodiments, the reflector portion of the assembly includes a thin skin of reflective material. In some embodiments, the assembly includes an interlocking mechanical interface between the reflector and lens portions of the assembly. In some embodiments, the lens portion of the assembly includes two lens plates. In some embodiments, a longer fixture can be assembled by using two, coextruded portions of an optical assembly, where these portions are adapted to be joined end-to-end. Reinforcing members can be used in the reflector and lens assembly.

Abstract translation: 公开了一种具有共挤出部件的灯具。 本发明的实施例提供适用于商业环境的固态灯具。 根据本发明的示例性实施例的灯具包括LED光源和共挤出的光学组件。 在一些实施例中，组件的反射器部分包括反光材料的薄皮。 在一些实施例中，组件包括在组件的反射器和透镜部分之间的互锁机械接口。 在一些实施例中，组件的透镜部分包括两个透镜板。 在一些实施例中，可以通过使用光学组件的两个共挤出部分来组装更长的夹具，其中这些部分适于端对端连接。 加强构件可以用在反射器和透镜组件中。

公开(公告)号：US20160178133A1

公开(公告)日：2016-06-23

申请号：US14572911

申请日：2014-12-17

Applicant: GE Lighting Solutions, LLC

Inventor： Ming KONG ,  Jeffrey BISBERG ,  John POWELL

IPC: F21K99/00 ,  F21S4/00 ,  F21V19/00 ,  F21V29/70

CPC classification number: H01L25/075 ,  F21K9/232 ,  F21S4/22 ,  F21V3/02 ,  F21V29/70 ,  F21V29/87 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An LED lead frame assembly includes a circuit strip assembly, a plastic dam member overmoulded onto the circuit strip assembly and a LED chip assembly disposed in a pocket of the plastic dam member. The LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly.

Abstract translation: LED引线框架组件包括电路板组件，包覆在电路板组件上的塑料阻挡构件以及设置在塑料坝构件的口袋中的LED芯片组件。 LED芯片组件电耦合到电路板组件以为LED芯片组件供电。