知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

9 records (took 0.017 seconds)

    Bonding LED die to lead frame strips
    4.
    发明授权
    Bonding LED die to lead frame strips 有权

    公开(公告)号：US09773762B2

    公开(公告)日：2017-09-26

    申请号：US15373710

    申请日：2016-12-09

    Applicant: KONINKLIJKE PHILIPS N.V.

    Inventor： Sze Kuang Lee ,  Paul Scott Martin ,  Albrecht Johannes Kraus ,  Chunheng Kang ,  Hui Ling Pan ,  Long Yin

    IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62 ,  H01L33/56 ,  H01L33/48

    Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.

    Bonding LED Die to Lead Frame Strips
    5.
    发明申请
    Bonding LED Die to Lead Frame Strips 有权
    粘合LED芯片引导框架条

    公开(公告)号：US20160329473A1

    公开(公告)日：2016-11-10

    申请号：US14901705

    申请日：2014-06-18

    Applicant: KONINKLIJKE PHILIPS N.V.

    Inventor： Sze Kuang Lee ,  Paul Scott Martin ,  Albrecht Johannes Kraus ,  Chunheng Kang ,  Hui Ling Pan ,  Long Yin

    IPC: H01L33/62 ,  H01L33/56 ,  H01L25/075

    CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.

    Abstract translation: 在一个实施例中，LED灯泡包括多个金属引线框架条，其包括至少第一条带，第二条带和第三条带。 第一LED管芯的底部电极电连接到第一条带的顶表面。 第二LED管芯的底部电极电连接到第二条带的顶表面。 第一LED芯片的顶部电极被引线接合到第二条带，并且第二LED管芯的顶部电极被引线接合到第三条带以将第一LED管芯和第二个LED管芯串联并联。 然后将条带弯曲以使LED管芯面向不同的方向，以在较小的空间中获得宽的发射图案。 然后将带封闭在具有电引线的导热灯泡中。

    Bonding LED die to lead frame strips
    8.
    发明授权
    Bonding LED die to lead frame strips 有权
    将LED模具接合到引线框条

    公开(公告)号：US09530949B2

    公开(公告)日：2016-12-27

    申请号：US14901705

    申请日：2014-06-18

    Applicant: KONINKLIJKE PHILIPS N.V.

    Inventor： Sze Kuang Lee ,  Paul Scott Martin ,  Albrecht Johannes Kraus ,  Chunheng Kang ,  Hui Ling Pan ,  Long Yin

    IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L33/56

    CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.

    Abstract translation: 在一个实施例中，LED灯泡包括多个金属引线框架条，其包括至少第一条带，第二条带和第三条带。 第一LED管芯的底部电极电连接到第一条带的顶表面。 第二LED管芯的底部电极电连接到第二条带的顶表面。 第一LED芯片的顶部电极被引线接合到第二条带，并且第二LED管芯的顶部电极被引线接合到第三条带以将第一LED管芯和第二个LED管芯串联并联。 然后将条带弯曲以使LED管芯面向不同的方向，以在较小的空间中获得宽的发射图案。 然后将带封闭在具有电引线的导热灯泡中。

Patent Agency Ranking