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133 条记录 (耗时 0.023 秒)

    SHOCK MOUNT IN ENVIRONMENT SENSOR PROTECTOR FOR NON-ISOLATED SYSTEMS
    81.
    发明申请
    SHOCK MOUNT IN ENVIRONMENT SENSOR PROTECTOR FOR NON-ISOLATED SYSTEMS 有权
    用于非隔离系统的环境传感器保护器中的震动

    公开(公告)号：US20170067759A1

    公开(公告)日：2017-03-09

    申请号：US14846047

    申请日：2015-09-04

    申请人： Honeywell International Inc.

    发明人： Todd Loren Braman ,  Scott James Goepfert ,  Terrance Troske

    IPC分类号： G01D11/10 ,  G01D11/24 ,  F16M13/02

    CPC分类号： G01D11/10 ,  B81B7/0016 ,  F16M13/02 ,  G01D11/245

    摘要： A shock mount assembly for a sensor protector apparatus is provided. The shock mount assembly comprises a support structure having a geometric configuration, with the support structure including at least one side wall having an outer edge section that defines a periphery of the support structure, and at least one mounting surface substantially perpendicular to the side wall. The mounting surface is configured for coupling at least one electronic device to the support structure. A shock absorber is mounted to at least a portion of the outer edge section, with the shock absorber substantially surrounding the periphery of the support structure. The shock mount assembly is configured for a non-isolated system, and is configured to protect the electronic device during vibration or shock events.

    摘要翻译： 提供了一种用于传感器保护装置的减震安装组件。 所述减震安装组件包括具有几何构型的支撑结构，所述支撑结构包括至少一个侧壁，所述至少一个侧壁具有限定所述支撑结构的周边的外边缘部分以及基本上垂直于所述侧壁的至少一个安装表面。 安装表面被配置为将至少一个电子设备耦合到支撑结构。 减震器安装在外边缘部分的至少一部分上，减震器基本上围绕支撑结构的周边。 防震安装组件配置为非隔离系统，并且被配置为在振动或冲击事件期间保护电子设备。

    CHIP STRUCTURE
    82.
    发明申请
    CHIP STRUCTURE 有权
    芯片结构

    公开(公告)号：US20160340180A1

    公开(公告)日：2016-11-24

    申请号：US14718152

    申请日：2015-05-21

    申请人： ams International AG

    发明人： Roel Daamen ,  Hendrik Bouman ,  Kailash Vijayakumar

    IPC分类号： B81C1/00 ,  B81B7/00

    CPC分类号： B81C1/00825 ,  B81B7/0016 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/015 ,  B81B2207/03 ,  B81C2201/0104 ,  B81C2201/0146 ,  B81C2203/0735 ,  H01L23/642

    摘要： One example discloses an chip, comprising: a substrate; a first side of a passivation layer coupled to the substrate; a device, having a device height and a cavity, wherein a first device surface is coupled to a second side of the passivation layer which is opposite to the first side of the passivation layer; and a set of structures coupled to the second side of the passivation layer and configured to have a structure height greater than or equal to the device height.

    摘要翻译： 一个实例公开了一种芯片，包括：基板; 耦合到所述衬底的钝化层的第一侧; 具有器件高度和空腔的器件，其中第一器件表面耦合到钝化层的与钝化层的第一侧相对的第二侧; 以及耦合到钝化层的第二侧并且被配置为具有大于或等于器件高度的结构高度的一组结构。

    Vibration isolation interposer die
    84.
    发明授权
    Vibration isolation interposer die 有权
    振动隔离插入器模具

    公开(公告)号：US09227835B2

    公开(公告)日：2016-01-05

    申请号：US13299485

    申请日：2011-11-18

    申请人： Robert D. Horning ,  Ryan Supino

    发明人： Robert D. Horning ,  Ryan Supino

    IPC分类号： B81B7/00

    CPC分类号： B81B7/0016 ,  B81B2201/025 ,  B81B2207/07

    摘要： In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.

    摘要翻译： 在一个示例中，提供了插入器芯片。 插入片包括基部和芯片安装部。 插入器芯片还包括将基部连接到芯片安装部分的一个或多个挠曲件。 此外，第一多个突起从基部朝向芯片安装部分延伸，并且第二多个突起从芯片安装部分朝向基部延伸并延伸到由第一多个突起形成的间隙中。

    Microelectromechanical system with a micro-scale spring suspension system and methods for making the same
    86.
    发明授权
    Microelectromechanical system with a micro-scale spring suspension system and methods for making the same 有权
    具有微尺度弹簧悬架系统的微机电系统及其制造方法

    公开(公告)号：US09136822B2

    公开(公告)日：2015-09-15

    申请号：US13970209

    申请日：2013-08-19

    申请人： HARRIS CORPORATION

    发明人： John E. Rogers

    IPC分类号： H03H9/46 ,  H03H9/52 ,  B81B7/00 ,  H01G5/16

    CPC分类号： H03H9/462 ,  B81B7/0016 ,  B81B2201/0271 ,  H01G5/16 ,  H01G5/40 ,  H03H9/525 ,  Y10T29/4913

    摘要： Integrated Microelectromechanical System (“MEMS”) devices and methods for making the same. The MEMS devices comprise a substrate (200) and a MEMS filter device (100) mechanically suspended above a major surface of the substrate. A first gas gap (202) exists between the major surface of the substrate and the MEMS filter device. An isolation platform (600) is provided to absorb vibrations from an external environment prior to reaching the MEMS filter device. In this regard, the isolation platform comprises: a frame structure (610) framing a periphery of the MEMS filter device; and at least one resilient component (612-618) coupled between the frame structure and the MEMS filter device. The frame structure is mechanically connected to the substrate. Electronic circuitry is connected to the MEMS filter device via a resilient interconnection (204, 206) that is movable in at least one direction of the vibrations.

    摘要翻译： 集成微机电系统（“MEMS”）器件及其制造方法。 MEMS器件包括机械悬浮在衬底的主表面上方的衬底（200）和MEMS过滤器装置（100）。 在衬底的主表面和MEMS过滤器装置之间存在第一气隙（202）。 提供隔离平台（600）以在到达MEMS滤波器装置之前吸收来自外部环境的振动。 在这方面，隔离平台包括：框架结构（610），框架MEMS滤波器装置的外围; 以及耦合在所述框架结构和所述MEMS滤波器装置之间的至少一个弹性部件（612-618）。 框架结构机械连接到基板。 电子电路通过可在振动的至少一个方向上移动的弹性互连（204,206）连接到MEMS滤波器装置。

    Actuator motion control features
    89.
    发明授权
    Actuator motion control features 有权
    执行器运动控制功能

    公开(公告)号：US09061883B2

    公开(公告)日：2015-06-23

    申请号：US12946624

    申请日：2010-11-15

    申请人： Roman C. Gutierrez ,  Robert J. Calvet ,  Xiaolei Liu ,  Guiqin Wang ,  Ankur Jain

    发明人： Roman C. Gutierrez ,  Robert J. Calvet ,  Xiaolei Liu ,  Guiqin Wang ,  Ankur Jain

    IPC分类号： G02B7/04 ,  G03B13/34 ,  B81B7/00

    CPC分类号： B81B7/00 ,  B81B7/0016 ,  B81B2201/047 ,  Y10T29/49002

    摘要： A method for making a motion control feature for an actuator device of a type that has a moveable component coupled to an opposing fixed component for out-of-plane rotational movement relative thereto includes forming first and second flaps respectively extending from the moveable and fixed components and toward the opposing component and operable to effect one or more of damping movement of the moveable component relative to the fixed component and/or restraining movement of the moveable component relative to the fixed component in a direction substantially perpendicular to the actuator device.

    摘要翻译： 一种制造用于致动器装置的运动控制特征的方法，所述致动器装置具有联接到相对的固定部件的可移动部件，用于相对于其相对的固定部件进行平面外旋转运动，所述方法包括形成分别从可移动和固定部件延伸的第一和第二翼片 并且朝向相对的部件并且可操作以实现可移动部件相对于固定部件的阻尼运动和/或可移动部件相对于固定部件在大致垂直于致动器装置的方向上的约束运动中的一个或多个。

    Device with MEMS structure and ventilation path in support structure
    90.
    发明授权
    Device with MEMS structure and ventilation path in support structure 有权
    具有MEMS结构的装置和支撑结构中的通风路径

    公开(公告)号：US09024396B2

    公开(公告)日：2015-05-05

    申请号：US13941318

    申请日：2013-07-12

    申请人： Infineon Technologies AG

    发明人： Alfons Dehe

    IPC分类号： H01L29/84 ,  B81B3/00

    CPC分类号： B81B3/0021 ,  B81B3/0094 ,  B81B7/0016 ,  B81B2201/0257 ,  B81B2203/0127 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/15151 ,  H01L2924/16152

    摘要： A device includes a support structure, a sound port disposed in the support structure, and a MEMS structure including a membrane acoustically coupled to the sound port. The membrane separates a first space contacting a first side of the membrane from a second space contacting an opposite second side of the membrane. The device further includes an adjustable ventilation path disposed in the support structure and extending from the sound port to the second space.

    摘要翻译： 一种装置包括支撑结构，设置在支撑结构中的声音端口，以及包括声耦合到声音端口的膜的MEMS结构。 膜将与膜的第一侧接触的第一空间与接触膜的相对的第二侧的第二空间分离。 该装置还包括设置在支撑结构中并从声音端口延伸到第二空间的可调整的通风路径。