公开(公告)号：US10788389B2

公开(公告)日：2020-09-29

申请号：US15797773

申请日：2017-10-30

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01L25/00 ,  G01L1/16 ,  G01L1/22 ,  G01L1/26

Abstract: A pressure sensor is for positioning within a structure. The pressure sensor may include a pressure sensor integrated circuit (IC) having a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit. The pressure sensor may include a support body having a recess therein coupled to the pressure sensor IC so that the pressure sensor IC bends into the recess when the pressure sensor IC is subjected to external pressure.

公开(公告)号：US10775426B2

公开(公告)日：2020-09-15

申请号：US15841585

申请日：2017-12-14

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01R31/26 ,  H01L21/66 ,  H01L21/768 ,  G01R31/27 ,  H01L23/48 ,  G01R31/28

Abstract: A testing system for carrying out electrical testing of at least one first through via forms an insulated via structure extending only part way through a substrate of a first body of semiconductor material. The testing system has a first electrical test circuit integrated in the first body and electrically coupled to the insulated via structure. The first electrical test circuit enables detection of at least one electrical parameter of the insulated via structure.

公开(公告)号：US10746787B2

公开(公告)日：2020-08-18

申请号：US16211882

申请日：2018-12-06

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01R31/28 ,  H01L21/66 ,  H01L23/58 ,  H01L23/00

Abstract: A testing architecture for integrated circuits on a wafer includes at least one first circuit of a structure test element group (TEG) realized in a scribe line providing separation between first and second integrated circuits. At least one pad is shared by a second circuit inside at least one of the first and second integrated circuits and the first circuit. Switching circuitry is coupled to the at least one pad and to the first and second circuits.

公开(公告)号：US10598578B2

公开(公告)日：2020-03-24

申请号：US15650380

申请日：2017-07-14

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Bruno Murari ,  Federico Giovanni Ziglioli

IPC: G01N3/08 ,  H01L23/31 ,  G01L1/00 ,  G01N3/06 ,  G01L5/103

Abstract: A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured.

公开(公告)号：US10527512B2

公开(公告)日：2020-01-07

申请号：US15783894

申请日：2017-10-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani ,  Bruno Murari ,  Marco Ferrera ,  Domenico Giusti ,  Daniele Caltabiano

IPC: G01L9/00 ,  G01L9/06 ,  G01L15/00

Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.

公开(公告)号：US10453833B2

公开(公告)日：2019-10-22

申请号：US15839501

申请日：2017-12-12

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01L23/498 ,  H01L25/065 ,  H01L21/56 ,  H05K1/18 ,  H01L27/02 ,  H01L21/768 ,  H01L23/31 ,  H01L23/48 ,  H01L23/66 ,  H01L23/00 ,  H01L21/683 ,  H01L25/10 ,  H01L21/66

Abstract: An electronic system supports superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in printed circuit boards coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.

公开(公告)号：US20190292045A1

公开(公告)日：2019-09-26

申请号：US16442199

申请日：2019-06-14

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Alessandro Motta

IPC: B81C1/00 ,  G01L9/00 ,  B81B3/00 ,  B81B7/00

Abstract: A method for making an integrated micro-electromechanical device includes forming a first body of semiconductor material having a first face and a second face opposite the first face. The first body includes a buried cavity forming a diaphragm delimited between the buried cavity and the first face. The diaphragm is monolithic with the first body. The method further includes forming at least one first magnetic via extending between the second face and the buried cavity of the first body, forming a first magnetic region extending over the first face of the first body, and forming a first coil extending over the second face of the first body and being magnetically coupled to the first magnetic via.

公开(公告)号：US10364143B2

公开(公告)日：2019-07-30

申请号：US14856707

申请日：2015-09-17

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani ,  Alessandro Motta

IPC: B81C1/00 ,  B81B7/00 ,  B81B3/00 ,  G01L9/00

Abstract: An integrated micro-electromechanical device includes a first body of semiconductor material having a first face and a second face opposite the first surface, with the first body including a buried cavity forming a diaphragm delimited between the buried cavity and the first face. The diaphragm is monolithic with the first body. At least one first magnetic via extends between the second face and the buried cavity of the first body. A first magnetic region extends over the first face of the first body. A first coil extends over the second face of the first body and is magnetically coupled to the first magnetic via.

公开(公告)号：US20190218092A1

公开(公告)日：2019-07-18

申请号：US16361739

申请日：2019-03-22

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: B81B3/00 ,  G01C19/5776

CPC classification number: B81B3/0021 ,  G01C19/5776 ,  H02K35/02

Abstract: A magnetic energy harvesting and scavenging circuit includes a first substrate having first and second surfaces and at least one energy harvesting and scavenging coil formed adjacent the first surface. An electromechanical systems device includes a moveable mass extending over the first surface and is displaced relative to the first substrate in three dimensions responsive to an external force applied to the moveable mass. The movable mass includes a magnet support layer and a number of permanent magnet segments attached to the magnet support layer. The permanent magnet segments are magnetically coupled to the at least one energy harvesting and scavenging coil. Energy harvesting and scavenging circuitry is electrically coupled to the at least one energy harvesting and scavenging coil and generates electrical energy due to magnetic flux variation through the at least one energy harvesting and scavenging coil responsive to movement of the moveable mass.

公开(公告)号：US10250301B2

公开(公告)日：2019-04-02

申请号：US15375761

申请日：2016-12-12

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H04B5/00 ,  H02J50/12 ,  H02J50/40 ,  H02J7/02 ,  H02J50/70 ,  H01L23/538 ,  H01L23/64 ,  H01L23/66 ,  H01L25/065 ,  H01Q1/22 ,  H01Q7/00 ,  H01F38/14 ,  H01Q1/27 ,  H01Q1/52 ,  H02J50/10 ,  A61B5/00 ,  H02J17/00

Abstract: Disclosed herein is an article including a garment, with a network formed on the garment. The network includes a main node with a main wired antenna, and at least one intermediate node with an intermediate wired antenna to be magnetically coupled to a respective device for that intermediate node. An electrical line electrically couples the main node to the at least one intermediate node. At least one electronic device is magnetically coupled to the intermediate wired antenna. A power supply unit is magnetically coupled to the main node via the main wired antenna thereof.