公开(公告)号：US20050183263A1

公开(公告)日：2005-08-25

申请号：US11109739

申请日：2005-04-20

申请人： Osamu Okuda ,  Yoshihiro Yoshida ,  Akira Kabeshita ,  Satoshi Shida ,  Naoyuki Kitamura

发明人： Osamu Okuda ,  Yoshihiro Yoshida ,  Akira Kabeshita ,  Satoshi Shida ,  Naoyuki Kitamura

IPC分类号： H05K13/04 ,  B23P19/00

CPC分类号： H05K13/0409 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

公开(公告)号：US20050125998A1

公开(公告)日：2005-06-16

申请号：US10503497

申请日：2003-02-06

申请人： Naoto Mimura ,  Izumi Miura ,  Hirofumi Obara ,  Hiroshi Uchiyama ,  Kobuyuki Kakita ,  Kazunori Kanai ,  Osamu Okuda ,  Akira Kabeshita

发明人： Naoto Mimura ,  Izumi Miura ,  Hirofumi Obara ,  Hiroshi Uchiyama ,  Kobuyuki Kakita ,  Kazunori Kanai ,  Osamu Okuda ,  Akira Kabeshita

IPC分类号： H05K13/04 ,  H05K13/08 ,  H05K3/30

CPC分类号： H05K13/0413 ,  H05K13/0853 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5137 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.

摘要翻译： 提供了一种用于安装电子部件的装置和方法，其缩短了安装所需的周期时间，并且使部件安装机器布置在小的区域中。 提供了一种控制器，使得对第二部件馈送器执行用于第二电子部件的退避控制，以便如果第一电子部件或部件保持器干扰第二部件馈送器的第二电子部件，则避免干扰，因为 的安装头的运动。 可以减少上下移动部件保持器所需的时间，并且消除了在移动安装头时无法沿着绕行移动的需要。 可以缩短周期时间，最终可以降低成本。

公开(公告)号：US06345728B1

公开(公告)日：2002-02-12

申请号：US09559279

申请日：2000-04-27

申请人： Satoshi Kawaguchi ,  Akira Kabeshita ,  Masato Tanino ,  Takao Kashiwazaki ,  Shuichi Kubota ,  Koji Okawa ,  Tadashi Endo

发明人： Satoshi Kawaguchi ,  Akira Kabeshita ,  Masato Tanino ,  Takao Kashiwazaki ,  Shuichi Kubota ,  Koji Okawa ,  Tadashi Endo

IPC分类号： B23Q700

CPC分类号： H05K13/043

摘要： A rotary device has thereinside a driving device as a driving source for rotating a rotary block and opening and closing a shutter, and also includes a rod for transmitting a driving force to the rotary block and the shutter, a lever and a shaft for directly transmitting the driving force to the shutter, a spring for delaying a timing to open the shutter after the rotary block rises, a spring receiver for receiving the spring, and a joint for connecting the rod with the rotary block.

摘要翻译： 旋转装置具有驱动装置作为用于旋转旋转块的旋转驱动源和打开和关闭活门的驱动装置，还包括用于将驱动力传递到旋转块和活门的杆，用于直接传递的杆和杆 向闸门的驱动力，用于在旋转块升高之后延迟打开闸门的定时的弹簧，用于接收弹簧的弹簧座，以及用于将杆与旋转块连接的接头。

公开(公告)号：US06343415B1

公开(公告)日：2002-02-05

申请号：US09331689

申请日：1999-06-23

申请人： Osamu Okuda ,  Akira Kabeshita ,  Satoshi Shida ,  Makoto Sueki

发明人： Osamu Okuda ,  Akira Kabeshita ,  Satoshi Shida ,  Makoto Sueki

IPC分类号： H05K330

CPC分类号： H05K13/08 ,  H05K13/0413 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261

摘要： A voice coil motor is attached to a shaft, that is installed in a component holding head, to drive the shaft in an axial direction. Also, a detecting device is arranged to detect movement of the shaft. The supply of power to the voice coil motor is controlled on the basis of a detection result of the detecting device, whereby movement of the shaft in the axial direction is controlled. The movement of the shaft in the axial direction is accordingly correctly known.

摘要翻译： 音圈电机安装在轴上，该轴安装在部件保持头中，以沿轴向驱动轴。 此外，检测装置被布置成检测轴的运动。 基于检测装置的检测结果来控制对音圈马达的供电，从而控制轴在轴向的移动。 因此，轴沿轴向的运动是正确的。

公开(公告)号：US06340132B1

公开(公告)日：2002-01-22

申请号：US09452524

申请日：1999-12-01

申请人： Koji Okawa ,  Takao Kashiwazaki ,  Shuichi Kubota ,  Tadashi Endo ,  Masato Tanino ,  Akira Kabeshita

发明人： Koji Okawa ,  Takao Kashiwazaki ,  Shuichi Kubota ,  Tadashi Endo ,  Masato Tanino ,  Akira Kabeshita

IPC分类号： B65H2300

CPC分类号： B65H23/02 ,  B65H16/02 ,  B65H2301/415185 ,  B65H2701/1942 ,  H05K13/02

摘要： In an electronic component feeding device which comprises a component carrier tape wound around a reel, on which electronic components are accommodated in cavities formed on a support tape whose surface is covered by a removable top tape, a reel guide is pivotally mounted, which has a U-shaped cross section that resembles a hook, an open end of the hooked part being formed at a fixed angle &thgr;, and which holds the reel when engaged with an outer peripheral edge of the reel.

摘要翻译： 在电子部件供给装置中，包括卷绕在卷轴上的分量载带，电子部件容纳在其表面被可移除的顶部带子覆盖的支撑带上形成的空腔中，枢转地安装有卷轴引导件，其具有 类似于钩的U形横截面，钩形部分的开口端以固定角度θ形成，并且当与卷轴的外周边缘接合时保持卷轴。

公开(公告)号：US06240628B1

公开(公告)日：2001-06-05

申请号：US09161334

申请日：1998-09-25

申请人： Yoshihiro Yoshida ,  Osamu Okuda ,  Akira Kabeshita ,  Naoyuki Kitamura

发明人： Yoshihiro Yoshida ,  Osamu Okuda ,  Akira Kabeshita ,  Naoyuki Kitamura

IPC分类号： B23P1900

CPC分类号： H05K13/0409 ,  Y10T29/4913 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A mounting head is provided with a pair of first levers which are pivotally connected so that the first levers can swing in an open and close direction and forced in the close direction by a compression spring so as to grip a shaft, a release pin for opening the first levers by engaging release grooves at an open/close end of the first levers, a second lever for driving the release pin toward the open/close end of the first levers by a driving means, and a spring for forcing the second lever in a direction opposite to the driving direction of the release pin. During an operation of the mounting head, the first levers are opened by driving the release pin with the second lever, only after the shaft is activated, and at the end of the operation releasing the drive of the release pin by the second lever, allowing the first levers to close and support the shaft in a gripping manner.

摘要翻译： 安装头设置有一对第一杠杆，它们被枢转地连接，使得第一杠杆能够沿开启和关闭的方向摆动并且通过压缩弹簧在紧密方向上被迫使其夹紧轴，用于打开的释放销 所述第一杠杆通过在所述第一杠杆的打开/关闭端处接合释放槽，通过驱动装置将所述释放销朝向所述第一杠杆的打开/关闭端驱动的第二杆，以及用于迫使所述第二杆的弹簧 与释放销的驱动方向相反的方向。 在安装头的操作期间，只有在轴被启动之后，通过用第二杆驱动释放销来打开第一杠杆，并且在操作结束时通过第二杠杆释放释放销的驱动，允许 第一个杠杆以夹紧的方式关闭和支撑轴。

公开(公告)号：US5462626A

公开(公告)日：1995-10-31

申请号：US98813

申请日：1993-07-29

申请人： Shinji Kanayama ,  Akira Kabeshita ,  Kenichi Nishino ,  Satoshi Ohnakada ,  Takahiko Murata ,  Kazuhiro Kimura ,  Kazuto Nishida

发明人： Shinji Kanayama ,  Akira Kabeshita ,  Kenichi Nishino ,  Satoshi Ohnakada ,  Takahiko Murata ,  Kazuhiro Kimura ,  Kazuto Nishida

IPC分类号： H05K3/34 ,  H05K3/36 ,  H05K13/04 ,  B32B31/00

CPC分类号： H05K3/363 ,  H05K13/0465 ,  H05K2201/0394 ,  H05K2201/064 ,  H05K2201/10681 ,  H05K2203/0195 ,  H05K2203/107 ,  H05K3/3421 ,  H05K3/3494

摘要： A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead. A bonding tool which is used in the method includes a wall having an external lead retaining surface for being set on the flat outer tab and pressing one of the external leads, to bring the one of the external leads into touch with the corresponding one of the electrodes. A laser beam passage is provided in the bonding tool through which a laser beam is irradiated to an external lead bonding part, and a gas passage is also provided, through which cooling gas is jetted on to the external lead bonding part to cool the bonding part of the external lead and the electrode.

摘要翻译： 一种用于外部引线的接合方法，包括以下步骤：将IC部件的外部引线与电路基板的电极对准，将焊接工具的外部引线保持面设置在通过涂覆多个外部端部 使用树脂的注册的IC部件的外部引线，并且使外部引线与相应的电极接触。 灯光束照射登记在一个电极上的一个外部引线，从而将它们接合，并且将冷却气体喷射到外部引线的接合部分上，以冷却外部引线和电极的接合部分。 在照射步骤期间，登记在一个相应的电极上的外部引线中的一个可以被压在电极上，以将电极的接合部分和外部引线接合。 在该方法中使用的接合工具包括具有外部引线保持表面的壁，用于设置在平坦的外部突片上并按压外部引线之一，以使外部引线中的一个与相应的一个引线保持接触 电极。 激光束通道设置在接合工具中，激光束通过该激光束照射到外部引线接合部分，并且还设置有气体通道，冷却气体通过该通道喷射到外部引线接合部分以冷却接合部分 的外部引线和电极。

公开(公告)号：US5084959A

公开(公告)日：1992-02-04

申请号：US582613

申请日：1990-09-14

申请人： Tateo Ando ,  Akira Kabeshita

发明人： Tateo Ando ,  Akira Kabeshita

IPC分类号： H01L21/68 ,  H05K13/04

CPC分类号： H05K13/0413 ,  H01L21/681 ,  Y10T29/49131 ,  Y10T29/49155 ,  Y10T29/53087 ,  Y10T29/53178

摘要： A chip mounting apparatus includes an X-Y robot having a chip mounting head and a substrate position recognizing camera both positioned in an upper arm of the robot apparatus. The chip mounting head is for holding a chip to be mounted. A substrate holding member is for holding a chip mounting substrate and is disposed below the robot. A chip position recognizing camera is also disposed below the robot. The positional relationship between the chip mounting head and the substrate position recognizing camera is equivalent to the positional relationship between a chip mounting position of the chip mounting substrate and the chip position recognizing camera.

摘要翻译： 芯片安装装置包括具有芯片安装头和位于机器人装置的上臂中的基板位置识别照相机的X-Y机器人。 芯片安装头用于保持要安装的芯片。 基板保持构件用于保持芯片安装基板并且设置在机器人下方。 芯片位置识别摄像机也设置在机器人下方。 芯片安装头与基板位置识别相机之间的位置关系等同于芯片安装基板的芯片安装位置与芯片位置识别相机之间的位置关系。

公开(公告)号：US5080036A

公开(公告)日：1992-01-14

申请号：US498452

申请日：1990-03-20

申请人： Akira Kabeshita ,  Kazuhiro Mori

发明人： Akira Kabeshita ,  Kazuhiro Mori

IPC分类号： B05C13/02 ,  H05K3/12

CPC分类号： H05K3/1241 ,  B05C13/02 ,  H05K2203/0126

摘要： A thick film drawing apparatus includes a substrate holding member (50) for holding a substrate (a), moving coils (60) for holding the substrate holding member (50), a drawing head (20) having a nozzle (30) and a stylus (33) for emitting pastes for drawing on a surface of the substrate (a) moving thereon and pushing the substrate (a) downward, respectively, wherein in the drawing process the drawing head (20) is locked of up/down motions and the substrate holding member (50) is raised/lowered at substantially constant weaker force by the moving coils (60), and thereby a relative-moving response of the up/down directions of the nozzle (30) is improved and a contact force of the stylus (33) on the substrate (a) is kept under a predetermined constant value, therefore a thickness of thick film line (c) is kept uniform and circuit patterns are prevented from being flawed.

摘要翻译： 厚膜拉伸装置包括用于保持基板（a）的基板保持部件（50），用于保持基板保持部件（50）的移动线圈（60），具有喷嘴（30）和 用于发射用于在其上移动的基板（a）的表面上的用于绘制的浆料的触针（33），并且分别向下推动基板（a），其中在拉伸处理中，拉拔头（20）被锁定上下运动， 通过运动线圈（60）以基本恒定的弱力使基板保持部件（50）升降，从而提高喷嘴（30）的上下方向的相对移动响应， 基板（a）上的触针（33）保持在预定的常数值，因此厚膜线（c）的厚度保持均匀，并且防止电路图案的缺陷。

公开(公告)号：US4440355A

公开(公告)日：1984-04-03

申请号：US351466

申请日：1982-02-23

申请人： Kazuhiro Mori ,  Yoshihiko Misawa ,  Eiji Itemadani ,  Akira Kabeshita

发明人： Kazuhiro Mori ,  Yoshihiko Misawa ,  Eiji Itemadani ,  Akira Kabeshita

IPC分类号： H05K13/02 ,  H05K13/00 ,  H05K13/04 ,  B65H75/02

CPC分类号： H05K13/0417 ,  Y10S156/922 ,  Y10S242/918 ,  Y10T156/11 ,  Y10T156/19

摘要： The disclosure is directed to an electronic component supply apparatus for use in an electronic component mounting arrangement, which employs an electronic component carrier tape. The apparatus is arranged to separate a covering tape from a tape base of the carrier tape only at a position directly below a vacuum chuck for picking up the component, while the covering tape is separated from the tape base so as to be wound up at a winding speed lower than an intermittent feeding speed of the carrier tape by a predetermined pitch.

摘要翻译： 本公开涉及一种用于电子部件安装装置的电子部件供应装置，其使用电子部件载带。 该设备被布置成仅将覆盖带与载带的带基分开，仅在真空卡盘的正下方的位置处，用于拾取部件，同时覆盖带与带基部分离，以便在一个 卷绕速度低于载带的间歇进给速度预定间距。