公开(公告)号：US20200021720A1

公开(公告)日：2020-01-16

申请号：US16471114

申请日：2017-12-20

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Takehiko TANAKA ,  Zhenyu CHEN ,  Nan GUO ,  Bojie ZHAO ,  Zhewen MEI

IPC: H04N5/225 ,  H04N5/247

Abstract: An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.

公开(公告)号：US20190387147A1

公开(公告)日：2019-12-19

申请号：US16553112

申请日：2019-08-27

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Takehiko TANAKA ,  Zhen HUANG ,  Nan GUO

IPC: H04N5/225 ,  H01L27/146 ,  H05K3/28

Abstract: A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.

公开(公告)号：US20190263040A1

公开(公告)日：2019-08-29

申请号：US16307926

申请日：2017-06-06

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Takehiko TANAKA ,  Zhen HUANG

IPC: B29C45/78 ,  H04N5/225 ,  H05K3/28 ,  B29C45/64 ,  B29C45/26

Abstract: A molded circuit board (10) of a camera module (100), manufacturing equipment (200) and a manufacturing method for the molded circuit board. The manufacturing equipment (200) comprises a forming mold (210), which comprises a first mold (211) and a second mold (212) that can be opened or closed, where the first mold (211) and the second mold (212) form a forming cavity (213) when closed. Also, a light window forming block (214) and a base forming guide groove (215) located at the periphery of the light window forming block (214) are provided within the forming cavity (213). When a circuit board is mounted in the forming cavity (213), once a molding material (13) filled into the base forming guide groove (215) is solidified into form by undergoing a transition process from a liquid state to a solid state, a molded base (12) is formed at the position corresponding to the base forming guide groove (215), a through hole of the molded base (12) is formed at the position corresponding to the light window forming block (214), where the molded base (12) is integrally formed on the circuit board so as to form the molded circuit board (10) of the camera module (100). The through hole is used for providing the camera module (100) with an optical path. The molded base (12) can serve as a frame for the camera module (100).

公开(公告)号：US20190148429A1

公开(公告)日：2019-05-16

申请号：US16082533

申请日：2017-03-09

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Takehiko TANAKA ,  Zhongyu LUAN ,  Zhenyu CHEN ,  Zhen HUANG

IPC: H01L27/146 ,  H05K1/02 ,  H04N5/225 ,  H05K1/11

Abstract: A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

公开(公告)号：US20190041727A1

公开(公告)日：2019-02-07

申请号：US16157082

申请日：2018-10-10

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Takehiko TANAKA ,  Nan GUO ,  Zhenyu CHEN ,  Heng JIANG ,  Zhongyu LUAN ,  Fengsheng XI ,  Feifan CHEN ,  Liang DING

IPC: G03B17/12 ,  H04N5/225 ,  G03B17/02

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

公开(公告)号：US20180294308A1

公开(公告)日：2018-10-11

申请号：US15947181

申请日：2018-04-06

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Takehiko TANAKA ,  Zhenyu CHEN ,  Heng JIANG ,  Nan GUO

IPC: H01L27/146 ,  H01L23/06 ,  H01L21/02 ,  H04N5/225

CPC classification number: H01L27/14683 ,  H01L21/02 ,  H01L23/06 ,  H01L27/14618 ,  H04N5/2257

Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.

公开(公告)号：US20180176430A1

公开(公告)日：2018-06-21

申请号：US15512065

申请日：2016-11-18

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Zhenyu CHEN ,  Nan GUO ,  Takehiko TANAKA

IPC: H04N5/225 ,  G03B13/36

CPC classification number: H04N5/2258 ,  G02B5/208 ,  G02B7/006 ,  G02B7/02 ,  G02B7/021 ,  G02B7/08 ,  G02B7/09 ,  G03B13/36 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14645 ,  H01L2224/48091 ,  H02K41/0354 ,  H02N2/026 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/247 ,  H05K1/0274 ,  H05K1/181 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/10083 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2018 ,  H05K2203/1316 ,  H01L2924/00014

Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

公开(公告)号：US20180035022A1

公开(公告)日：2018-02-01

申请号：US15461402

申请日：2017-03-16

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Zhenyu CHEN ,  Nan GUO ,  Takehiko TANAKA ,  Bojie ZHAO ,  Zilong DENG

IPC: H04N5/225 ,  G02B7/10 ,  B29C70/72 ,  H05K1/02 ,  B29C70/88 ,  G02B13/00 ,  H05K1/18

CPC classification number: H04N5/2257 ,  B29C33/44 ,  B29C43/18 ,  B29C43/36 ,  B29C43/52 ,  B29C45/0025 ,  B29C45/14336 ,  B29C45/14467 ,  B29C45/14655 ,  B29C45/14819 ,  B29C45/40 ,  B29C70/72 ,  B29C70/88 ,  B29D11/00807 ,  B29K2101/12 ,  B29K2995/0003 ,  B29K2995/0018 ,  B29L2031/3425 ,  B29L2031/3437 ,  B29L2031/764 ,  G02B7/022 ,  G02B7/10 ,  G02B13/0085 ,  H04N5/2253 ,  H04N5/2254 ,  H05K1/0274 ,  H05K1/181 ,  H05K1/185 ,  H05K3/284 ,  H05K2201/10121 ,  H05K2203/0195 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.

公开(公告)号：US20170244877A1

公开(公告)日：2017-08-24

申请号：US15460213

申请日：2017-03-15

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Zhenyu CHEN ,  Takehiko TANAKA ,  Nan GUO ,  Zhen HUANG ,  Duanliang CHENG ,  Liang DING ,  Feifan CHEN ,  Heng JIANG

IPC: H04N5/225 ,  H05K1/02 ,  H05K1/18 ,  G02B3/00 ,  G02B7/00

CPC classification number: H04N5/2258 ,  G02B3/0075 ,  G02B7/006 ,  H04N5/2254 ,  H04N5/2257 ,  H05K3/284 ,  H05K2201/10121 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.