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公开(公告)号：US20140180100A1
公开(公告)日：2014-06-26
申请号：US14191582
申请日：2014-02-27
CPC分类号： A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B2017/320069 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078
摘要： Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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公开(公告)号：US20140180093A1
公开(公告)日：2014-06-26
申请号：US14191553
申请日：2014-02-27
IPC分类号： A61B8/08
CPC分类号： G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
摘要： Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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公开(公告)号：US11137486B2
公开(公告)日：2021-10-05
申请号：US15517211
申请日：2015-10-07
摘要： Programmable ultrasound probes and methods of operation are described. The ultrasound probe may include memory storing parameter data and may also include a parameter loader which loads the parameter data into programmable circuitry of the ultrasound probe. In some instances, the ultrasound probe may include circuitry grouped into modules which may be repeatable and which may be coupled together to allow data to be exchanged between the modules.
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公开(公告)号：US20210167791A1
公开(公告)日：2021-06-03
申请号：US17109946
申请日：2020-12-02
发明人： Sewook Hwang , Nevada J. Sanchez
IPC分类号： H03M1/12
摘要： Aspects of the technology described herein relate to an ultrasound device having a first analog-to-digital converter (ADC) configured to operate with a first ADC clock signal having a first timing delay and a second ADC configured to operate with a second ADC clock signal having a second timing delay. The first timing delay and the second timing delay may be different. The ultrasound device may further include delay control circuitry configured to control direct digital synthesis (DDS) circuitry to implement a first delay in ultrasound data from the first ADC and a second delay in ultrasound data from the second ADC. The first delay may correct for the first timing delay and the second delay may correct for the second timing delay.
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公开(公告)号：US10782269B2
公开(公告)日：2020-09-22
申请号：US16109703
申请日：2018-08-22
摘要： Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号：US10707201B2
公开(公告)日：2020-07-07
申请号：US16197438
申请日：2018-11-21
IPC分类号： B81B3/00 , B81B7/00 , H01L21/56 , H01L21/8238 , H01L23/522 , H01L23/528 , H01L27/06 , B06B1/02 , H01L27/092 , B81C1/00 , H01L21/3213 , H01L21/768 , A61B8/00
摘要： Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
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公开(公告)号：US10672974B2
公开(公告)日：2020-06-02
申请号：US16158999
申请日：2018-10-12
发明人： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Jaime Scott Zahorian
摘要： Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号：US10371804B2
公开(公告)日：2019-08-06
申请号：US16252382
申请日：2019-01-18
摘要： Ultrasound signal processing circuitry and related apparatus and methods are described. Signal samples received from an ultrasound transducer array in an ultrasound transducer based imaging system may be processed, or conditioned, by application of one or more weighting functions. In some embodiments, one or more weighting functions may be applied to the signal samples in the time domain. In other embodiments, the signal samples may be converted to the frequency domain and one or more weighting functions may be applied in the frequency domain. In further embodiments, one or more weighting functions may be applied in the time domain and one or more weighting functions may be applied in the frequency domain. The weighting functions may be channel dependent and/or channel independent. The processed data can be provided to an image formation processor.
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公开(公告)号：US10247708B2
公开(公告)日：2019-04-02
申请号：US15178025
申请日：2016-06-09
摘要： Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号：US10175347B2
公开(公告)日：2019-01-08
申请号：US14957051
申请日：2015-12-02
摘要： Methods and apparatus are described for implementing a coding scheme on ultrasound signals received by a plurality of ultrasonic transducers. The coding, and subsequent decoding, may allow for multiple ultrasonic transducers to be operated in a receive mode simultaneously while still differentiating the contribution of the individual ultrasonic transducers. Improved signal characteristics may result, including improved signal-to-noise ratio (SNR).
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