Radiation source for lithography process

    公开(公告)号:US10928741B2

    公开(公告)日:2021-02-23

    申请号:US16876442

    申请日:2020-05-18

    Abstract: A method for a lithography exposure process is provided. The method includes irradiating a target droplet with a laser beam to create an extreme ultraviolet (EUV) light. The method further includes reflecting the EUV light with a collector. The method also includes discharging a cleaning gas over the collector through a gas distributor positioned next to the collector. A portion of the cleaning gas is converted to free radicals before the cleaning gas leaves the gas distributor, and the free radicals are discharged over the collector along with the cleaning gas.

    Communication control method
    75.
    发明授权

    公开(公告)号:US10725384B2

    公开(公告)日:2020-07-28

    申请号:US16102865

    申请日:2018-08-14

    Abstract: A method includes operation below. A first task is performed by a control circuit according to a first request from a processor. A second request, for triggering a second task to be performed by the control circuit, is received by an interface circuit. A first data rate, for transmitting first data generated in the first task, is calculated by the interface circuit. A second data rate, for transmitting second data to be generated in the second task, is estimated by the interface circuit. The second task other than the first task is performed by the control circuit. The first data and the second data are transmitted from the control circuit to the processor in a condition that a sum of the first data rate and the second data rate complies with a bandwidth of a data switch coupled between the control circuit and the processor.

    Radiation source for lithography process

    公开(公告)号:US10656539B2

    公开(公告)日:2020-05-19

    申请号:US16117545

    申请日:2018-08-30

    Abstract: A method for a lithography exposure process is provided. The method includes irradiating a target droplet with a laser beam to create an extreme ultraviolet (EUV) light. The method further includes reflecting the EUV light with a collector. The method also includes discharging a cleaning gas over the collector through a gas distributor positioned next to the collector. A portion of the cleaning gas is converted to free radicals before the cleaning gas leaves the gas distributor, and the free radicals are discharged over the collector along with the cleaning gas.

    Overlay Marks for Reducing Effect of Bottom Layer Asymmetry

    公开(公告)号:US20200089132A1

    公开(公告)日:2020-03-19

    申请号:US16295510

    申请日:2019-03-07

    Abstract: Methods of fabricating and using an overlay mark are provided. In some embodiments, the overlay mark includes an upper layer and a lower layer disposed below the upper layer. The lower layer includes a first plurality of compound gratings extending in a first direction and disposed in a first region of the overlay mark, each of the first plurality of compound gratings including one first element and at least two second elements disposed on one side of the first element, and a second plurality of compound gratings extending the first direction and disposed in a second region of the overlay mark, each of the second plurality of compound gratings including one third element and at least two fourth elements on one side of the third element. The first plurality of compound gratings is a mirror image of the second plurality of compound gratings.

    Extreme ultraviolet radiation source and droplet catcher thereof

    公开(公告)号:US10512147B1

    公开(公告)日:2019-12-17

    申请号:US16240951

    申请日:2019-01-07

    Abstract: An extreme ultraviolet radiation source is provided, including a droplet generator and a droplet catcher. The droplet generator is configured to output a plurality of target droplets along a target droplet path that is parallel to a horizontal direction. The droplet catcher includes an open end substantially aligned with the target droplet path, and an enclosed end that is opposite to the open end. The droplet catcher also includes a pipe wall disposed between the open end the enclosed end. The pipe wall includes a first pipe wall portion having an inner top surface parallel to the horizontal direction and an inner bottom surface inclined relative to the inner top surface. In addition, the droplet catcher includes at least one gutter formed on the inner bottom surface and having a long axis extending along the horizontal direction.

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