Ferroelectric-based memory cell usable in on-logic chip memory

    公开(公告)号:US10679688B2

    公开(公告)日:2020-06-09

    申请号:US16142954

    申请日:2018-09-26

    Abstract: A memory cell and method for utilizing the memory cell are described. The memory cell includes at least one ferroelectric transistor (FE-transistor) and at least one selection transistor coupled with the FE-transistor. An FE-transistor includes a transistor and a ferroelectric capacitor for storing data. The ferroelectric capacitor includes ferroelectric material(s). In some aspects, the memory cell consists of a FE-transistor and a selection transistor. In some aspects, the transistor of the FE-transistor includes a source, a drain and a gate coupled with the ferroelectric capacitor. In this aspect, the selection transistor includes a selection transistor source, a selection transistor drain and a selection transistor gate. In this aspect, a write port of the memory cell is the selection transistor source or the selection transistor drain. The other of the selection transistor source and drain is coupled to the ferroelectric capacitor.

    VERTICAL OPTICAL VIA AND METHOD OF FABRICATION

    公开(公告)号:US20200158970A1

    公开(公告)日:2020-05-21

    申请号:US16749908

    申请日:2020-01-22

    Abstract: A method for providing a vertical optical via for a semiconductor substrate is described. The semiconductor substrate has a front surface and a back side. A hard mask having an aperture therein is formed on the front surface. Part of the semiconductor substrate exposed by the aperture is removed to form a via hole. The via hole has a width not exceeding one hundred micrometers and a bottom. Cladding layer(s) and core layer(s) are provided in the via hole. The core layer(s) have at least a second index of refraction greater than that of the core layer(s). A portion of the semiconductor substrate including the back side is removed to expose a bottom portion of the core layer(s) and a bottom surface of the semiconductor substrate. The vertical optical via includes the cladding and core layers. The vertical optical via extends from the front surface to the bottom surface.

    FERROELECTRIC-BASED MEMORY CELL USABLE IN ON-LOGIC CHIP MEMORY

    公开(公告)号:US20190318775A1

    公开(公告)日:2019-10-17

    申请号:US16142954

    申请日:2018-09-26

    Abstract: A memory cell and method for utilizing the memory cell are described. The memory cell includes at least one ferroelectric transistor (FE-transistor) and at least one selection transistor coupled with the FE-transistor. An FE-transistor includes a transistor and a ferroelectric capacitor for storing data. The ferroelectric capacitor includes ferroelectric material(s). In some aspects, the memory cell consists of a FE-transistor and a selection transistor. In some aspects, the transistor of the FE-transistor includes a source, a drain and a gate coupled with the ferroelectric capacitor. In this aspect, the selection transistor includes a selection transistor source, a selection transistor drain and a selection transistor gate. In this aspect, a write port of the memory cell is the selection transistor source or the selection transistor drain. The other of the selection transistor source and drain is coupled to the ferroelectric capacitor.

    VERTICAL OPTICAL VIA AND METHOD OF FABRICATION

    公开(公告)号:US20190154933A1

    公开(公告)日:2019-05-23

    申请号:US15965154

    申请日:2018-04-27

    Abstract: A method for providing a vertical optical via for a semiconductor substrate is described. The semiconductor substrate has a front surface and a back side. A hard mask having an aperture therein is formed on the front surface. Part of the semiconductor substrate exposed by the aperture is removed to form a via hole. The via hole has a width not exceeding one hundred micrometers and a bottom. Cladding layer(s) and core layer(s) are provided in the via hole. The core layer(s) have at least a second index of refraction greater than that of the core layer(s). A portion of the semiconductor substrate including the back side is removed to expose a bottom portion of the core layer(s) and a bottom surface of the semiconductor substrate. The vertical optical via includes the cladding and core layers. The vertical optical via extends from the front surface to the bottom surface.

    METHOD AND SYSTEM FOR PERFORMING ANALOG COMPLEX VECTOR-MATRIX MULTIPLICATION

    公开(公告)号:US20190080230A1

    公开(公告)日:2019-03-14

    申请号:US15849106

    申请日:2017-12-20

    Abstract: A hardware device and method for performing a multiply-accumulate operation are described. The device includes inputs lines, weight cells and output lines. The input lines receive input signals, each of which is has a magnitude and a phase and can represent a complex value. The weight cells couple the input lines with the output lines. Each of the weight cells has an electrical admittance corresponding to a weight. The electrical admittance is programmable and capable of being complex valued. The input lines, the weight cells and the output lines form a crossbar array. Each of the output lines provides an output signal. The output signal for an output line is a sum of an input signal for each of the input lines connected to the output line multiplied by the electrical admittance of each of the weight cells connecting the input lines to the output line.

    SELECTORLESS, 3D STACKABLE CROSSPOINT MEMORY
    78.
    发明申请

    公开(公告)号:US20190079701A1

    公开(公告)日:2019-03-14

    申请号:US15845985

    申请日:2017-12-18

    Abstract: A memory device and method for providing the memory device are described. The memory device includes word lines, a first plurality of bit lines, a second plurality of bit lines and selectorless memory cells. Each selectorless memory cell is coupled with a word line, a first bit line of the first plurality of bit lines and a second bit line of the second plurality of bit lines. The selectorless memory cell includes first and second magnetic junctions. The first and second magnetic junctions are each programmable using a spin-orbit interaction torque. The word line is coupled between the first and second magnetic junctions. The first and second bit lines are coupled with the first and second magnetic junctions, respectively. The selectorless memory cell is selected for a write operation based on voltages in the word line, the first bit line and the second bit line.

    VARIABLE PRECISION NEUROMORPHIC ARCHITECTURE
    79.
    发明申请

    公开(公告)号:US20190026627A1

    公开(公告)日:2019-01-24

    申请号:US15891220

    申请日:2018-02-07

    Abstract: A neuromorphic architecture for providing variable precision in a neural network, through programming. Logical pre-synaptic neurons are formed as configurable sets of physical pre-synaptic artificial neurons, logical post-synaptic neurons are formed as configurable sets of physical post-synaptic artificial neurons, and the logical pre-synaptic neurons are connected to the logical post-synaptic neurons by logical synapses each including a set of physical artificial synapses. The precision of the weights of the logical synapses may be varied by varying the number of physical pre-synaptic artificial neurons in each of the logical pre-synaptic neurons, and/or by varying the number of physical post-synaptic artificial neurons in each of the logical post-synaptic neurons.

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