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公开(公告)号：US20170225196A1
公开(公告)日：2017-08-10
申请号：US15581511
申请日：2017-04-28
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC classification number: B06B1/02 , B06B1/0292 , B81B3/0021 , B81B7/0077 , B81B2203/0127 , B81B2203/0315 , B81B2207/015 , B81C1/00158 , B81C2201/013 , B81C2203/0118 , B81C2203/0735 , B81C2203/0771 , G10K9/12 , G10K11/18
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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72.发明申请ARCHITECTURE OF SINGLE SUBSTRATE ULTRASONIC IMAGING DEVICES, RELATED APPARATUSES, AND METHODS 审中-公开单基底超声成像装置的结构，相关装置和方法公开(公告)号：US20170067988A1
公开(公告)日：2017-03-09
申请号：US15273377
申请日：2016-09-22
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
Abstract translation: 本文描述的技术的方面涉及超声装置电路，其可以形成具有集成的超声换能器的单个衬底超声装置的一部分。 超声波装置电路可以以功率和数据效率的方式促进产生超声波形。
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公开(公告)号：US09499392B2
公开(公告)日：2016-11-22
申请号：US14172383
申请日：2014-02-04
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC classification number: B06B1/0292 , B06B1/02 , B81B3/0021 , B81B2203/0127 , B81B2203/0315 , B81B2207/015 , B81C1/00158 , B81C2201/013 , B81C2203/0118 , B81C2203/0735 , B81C2203/0771 , G10K9/12 , G10K11/18
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
Abstract translation: 描述了CMOS超声波传感器及其制造方法。 所述方法可以包括在第一晶片上形成空腔并将第一晶片接合到第二晶片。 可以处理第二晶片以形成用于空腔的膜。 可以提供对腔的电接入。
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74.发明申请公开(公告)号：US20160207760A1
公开(公告)日：2016-07-21
申请号：US15042931
申请日：2016-02-12
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC classification number: B81C1/00301 , B06B1/02 , B06B1/0292 , B81B7/007 , B81C1/00134 , B81C1/00158 , B81C1/00246 , B81C2201/0195 , B81C2203/0735 , B81C2203/0771 , G01N29/2406 , H01L29/84 , H04R19/005
Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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公开(公告)号：US09268015B2
公开(公告)日：2016-02-23
申请号：US14191548
申请日：2014-02-27
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Nevada J. Sanchez , Gregory L. Charvat , Tyler S. Ralston
IPC: A61B17/32 , A61N7/02 , G01S7/52 , A61B8/00 , A61B8/08 , A61N7/00 , A61B5/01 , A61B8/13 , A61B19/00
CPC classification number: G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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Patent Agency Ranking
公开(公告)号：US09155521B2
公开(公告)日：2015-10-13
申请号：US14191588
申请日：2014-02-27
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Nevada J. Sanchez , Gregory L. Charvat , Tyler S. Ralston
CPC classification number: G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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77.发明申请公开(公告)号：US20150084053A1
公开(公告)日：2015-03-26
申请号：US14561384
申请日：2014-12-05
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: B06B1/02
CPC classification number: B81C1/00301 , B06B1/02 , B06B1/0292 , B81B7/007 , B81C1/00134 , B81C1/00158 , B81C1/00246 , B81C2201/0195 , B81C2203/0735 , B81C2203/0771 , G01N29/2406 , H01L29/84 , H04R19/005
Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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公开(公告)号：US08852103B2
公开(公告)日：2014-10-07
申请号：US13654337
申请日：2012-10-17
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Nevada J. Sanchez , Gregory L. Charvat , Tyler S. Ralston
CPC classification number: G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
Abstract translation: 描述了包括超声成像装置的装置和方法，其可以在透射超声成像模式中操作，并且其可以用于检测对象的感兴趣的属性，例如折射率，密度和/或声速。 还描述了适用于执行高强度聚焦超声（HIFU）的设备，以及HIFU和超声成像。
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公开(公告)号：US20140288428A1
公开(公告)日：2014-09-25
申请号：US14208281
申请日：2014-03-13
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC classification number: A61B8/4494 , A61B8/14 , A61B8/145 , A61B8/4483 , A61B8/4488 , A61B8/485 , A61B8/54 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00246 , G01S7/52019 , G01S7/52034 , G01S7/52047 , G01S7/5208 , G01S15/02 , G01S15/8915 , G01S15/8977 , H04R1/00 , Y10T29/41
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
Abstract translation: 为了实现单芯片超声成像解决方案，可以在接收信号路径中采用片上信号处理以减少数据带宽，并且可以使用高速串行数据模块来将数据作为数字的片外移动数据 数据流。 片上接收信号的数字化允许在芯片上执行高级数字信号处理，从而允许整个超声波成像系统完全集成在单个半导体衬底上。 同样公开了各种新颖的波形产生技术，换能器配置和偏置方法等。 HIFU方法可以额外地或替代地用作本文公开的“片上超声”解决方案的组件。
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公开(公告)号：US20140180100A1
公开(公告)日：2014-06-26
申请号：US14191582
申请日：2014-02-27
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Nevada J. Sanchez , Gregory L. Charvat , Tyler S. Ralston
CPC classification number: A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B2017/320069 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078
Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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