INTERCONNECTIONS FOR MULTI-LAYER TRANSMITTER COIL ARRANGEMENTS IN WIRELESS CHARGING MATS

    公开(公告)号:US20180090972A1

    公开(公告)日:2018-03-29

    申请号:US15700001

    申请日:2017-09-08

    Applicant: Apple Inc.

    CPC classification number: H02J7/025 H02J7/0042 H02J50/10 H05K9/0007

    Abstract: Embodiments describe a wireless charging device including: a housing having a charging surface, the housing including first and second walls defining an interior cavity; a transmitter coil arrangement disposed within the interior cavity; a plurality of cowlings for confining the plurality of planar transmitter coils in their respective positions; an interconnection structure positioned within the interior cavity between the transmitter coil arrangement and the second wall, the interconnection structure including a plurality of packaged electrical components mounted onto the interconnection structure; and a plurality of standoffs coupled to the interconnection structure and configured to electrically couple the transmitter coil arrangement to the plurality of packaged electrical components.

    Plastic Electronic Device Structures With Embedded Components
    77.
    发明申请
    Plastic Electronic Device Structures With Embedded Components 有权
    具有嵌入式组件的塑料电子器件结构

    公开(公告)号:US20150313003A1

    公开(公告)日:2015-10-29

    申请号:US14263749

    申请日:2014-04-28

    Applicant: Apple Inc.

    Inventor: Darshan R. Kasar

    Abstract: Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure.

    Abstract translation: 诸如电气部件和电线以及柔性印刷电路上的迹线的电路可以嵌入注射成型的塑料结构内。 电气元件可以包括集成电路,连接器和系统级封装电路模块。 系统级封装电路模块可以包括安装在基板上并被塑料覆盖的部件。 连接器可以包括用于与电子设备或电池上的相应连接器配合的连接器。 注射成型的塑料结构可以形成外壳。 壳体可以形成电子设备的一部分,接收电子设备的外部壳体或其他结构。 近场通信天线可以嵌入在塑料外壳内。 信号线和塑料纤维可以交织以形成嵌入在塑料外壳或其它注模塑料结构中的网状物。

Patent Agency Ranking