Abstract:
Embodiments describe apparatuses for wireless charging. A wireless charging device for wirelessly charging a plurality of different electronic devices having different wireless power receiving characteristics includes: a housing having a charging surface and one or more walls defining an interior cavity; a first transmitter coil arrangement disposed within the interior cavity and comprising a first plurality of transmitter coils configured to wirelessly charge a first electronic device positioned on the charging surface; and a second transmitter coil arrangement disposed within the interior cavity below the first transmitter coil arrangement, the second transmitter coil arrangement comprising a second plurality of transmitter coils configured to wirelessly charge a second electronic device positioned on the charging surface; where the first transmitter coil arrangement operates at a first frequency, and the second transmitter coil arrangement operates at a second frequency different from the first frequency.
Abstract:
Embodiments describe apparatuses for wireless charging. An interconnection structure for a wireless charging device includes: a first contact configured for coupling with a first component of the wireless charging device; a second contact disposed below the first contact and configured for coupling with a second component of the wireless charging device; and a connector coupling the first contact with the second contact, wherein the first contact, second contact, and the connector form a monolithic structure.
Abstract:
Embodiments describe a wireless charging device including: a housing having a charging surface, the housing including first and second walls defining an interior cavity; a transmitter coil arrangement disposed within the interior cavity; a plurality of cowlings for confining the plurality of planar transmitter coils in their respective positions; an interconnection structure positioned within the interior cavity between the transmitter coil arrangement and the second wall, the interconnection structure including a plurality of packaged electrical components mounted onto the interconnection structure; and a plurality of standoffs coupled to the interconnection structure and configured to electrically couple the transmitter coil arrangement to the plurality of packaged electrical components.
Abstract:
A docking station configured to mate to an electronic device enables methods of interacting with the electronic device by impacting (e.g., knocking) on a table on which the device and/or the docking station are disposed and by means of contactless gestures. The electronic device may remain in a powered off state while the docking station continuously monitors for user input. The docking station may have a processor that is capable of detecting a user's impact and contactless gesture inputs.
Abstract:
A removable case may receive an electronic device. A male connector in the case may mate with a female connector in the device. A battery in the case may supply power to the device through the male connector. The electronic device may have an antenna. The case may have a supplemental antenna that compensates for variations in performance in the antenna when the device is received within the case. The supplemental antenna may be a parasitic antenna resonating element that is formed from metal traces on a flexible printed circuit. The flexible printed circuit, a metal trim structure, and a plastic support structure may form portions of a connector support structure in the case.
Abstract:
A case for a pair of earbuds includes a housing having cavities to receive the pair of earbuds and charging circuitry that is configured to initiate charging of the pair of earbuds when an earbud detector detects that the earbuds are inserted within the cavities.
Abstract:
Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure.