Camera module
    72.
    发明授权

    公开(公告)号:US10389923B2

    公开(公告)日:2019-08-20

    申请号:US15665777

    申请日:2017-08-01

    摘要: A camera module includes a lens assembly, a voice coil motor assembly for receiving and driving the lens assembly, and an image sensor assembly located below the voice coil motor assembly. The voice coil motor assembly comprises a bottom unit that is hollow and a color filter supported by the bottom unit, the color filter, the lens assembly and the image sensor assembly are coaxial, the bottom unit has an upper portion and a lower portion that are integrated together, the upper portion is configured around the lens assembly, and the bottom unit is configured below the lens assembly and supports the color filter. The camera module has simple structure and convenient assembly, can reduce total assembly tolerances of the camera module, achieve an accurate optical axis alignment between the lens and the image sensor, and reduce manufacturing cost to benefit the popularization in industries.

    Thin film piezoelectric element and manufacturing method thereof

    公开(公告)号:US10181557B2

    公开(公告)日:2019-01-15

    申请号:US15156388

    申请日:2016-05-17

    摘要: A manufacturing method of an epitaxial thin film piezoelectric element includes: providing a substrate; forming a bottom electrode layer on the substrate by epitaxial growth process; forming a first piezoelectric layer that has c-axis orientation on the bottom electrode layer by epitaxial growth process; forming a second piezoelectric layer that has c-axis orientation and different phase structure from the first piezoelectric layer on the first piezoelectric layer by epitaxial growth process; and forming a top electrode layer on the second piezoelectric layer. The thin film piezoelectric element has good thermal stability, low temperature coefficient and high piezoelectric constant.

    Thin-film piezoelectric material element, head gimbal assembly and hard disk drive

    公开(公告)号:US09722169B1

    公开(公告)日:2017-08-01

    申请号:US15475457

    申请日:2017-03-31

    摘要: A thin-film piezoelectric material element includes a laminated structure part having a lower electrode film, a piezoelectric material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric material film. The thin-film piezoelectric material element includes a surface layer insulating film disposed on side surfaces of the laminated structure part, a first top surface of the upper electrode film and a second top surface of the lower electrode film, and has a first through hole formed on a first top disposed part and a second through hole formed on a second top disposed part. Further, the surface layer insulating film has an upper electrode pad being in directly contact with a first inside exposed surface and a lower electrode pad being in directly contact with a second inside exposed surface.

    THIN-FILM PIEZOELECTRIC MATERIAL ELEMENT, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE

    公开(公告)号:US20170207383A1

    公开(公告)日:2017-07-20

    申请号:US15475457

    申请日:2017-03-31

    摘要: A thin-film piezoelectric material element includes a laminated structure part having a lower electrode film, a piezoelectric material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric material film. The thin-film piezoelectric material element includes a surface layer insulating film disposed on side surfaces of the laminated structure part, a first top surface of the upper electrode film and a second top surface of the lower electrode film, and has a first through hole formed on a first top disposed part and a second through hole formed on a second top disposed part. Further, the surface layer insulating film has an upper electrode pad being in directly contact with a first inside exposed surface and a lower electrode pad being in directly contact with a second inside exposed surface.