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61.发明申请公开(公告)号：US20180124960A1
公开(公告)日：2018-05-03
申请号：US15336279
申请日：2016-10-27
发明人： Joseph Vincent , Michael Kuchar , Dean C. Hruzek , Vijayabaskar Soundarrajan , Pandu Maddherla , Adam J. Wyatt , Robert M. McAndrew
CPC分类号： H05K13/021 , H01L21/67126 , H01L21/67201 , H05K7/1401 , H05K7/20209
摘要： An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.
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公开(公告)号：US20180095508A1
公开(公告)日：2018-04-05
申请号：US15285794
申请日：2016-10-05
发明人： George YI
CPC分类号： G06F1/20 , G06F1/183 , G11B33/128 , G11B33/142 , H05K7/14 , H05K7/20 , H05K7/20009 , H05K7/20127 , H05K7/20136 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209
摘要： In an electronics system, an adjustable airflow guide assembly and methods of deploying it facilitate dissipating heat. The assembly includes an extendable plate having a first coupling capable of rotatably attaching the extendable plate to a chassis, a link, including a second coupling, capable of translatably attaching the link to the chassis, and a third coupling capable of rotatably attaching the link to the extendable plate. The extendable plate presents a guide to deflect airflow and is capable of being swung into multiple different fixed positions to divert airflow within the electronics system toward portions of the chassis configured with electronic components that produce heat, such as board solid state drives (BSSDs).
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公开(公告)号：US20180089048A1
公开(公告)日：2018-03-29
申请号：US15655309
申请日：2017-07-20
发明人： Xiaobing ZOU , Yingxian HAN , Longlong XIE , Chia-Hsing CHEN , Jianbin NI
CPC分类号： G06F11/3058 , G06F1/20 , G06F1/206 , G06F11/3089 , H05K7/20209 , H05K7/20836
摘要： A hardware monitoring system and a method therefor are disclosed. The hardware monitoring method includes: sensing a first temperature value of a first temperature area by a first temperature sensor and sensing a second temperature value of a second temperature area by a second temperature sensor; reading and compensating for the second temperature value by a complex programmable logic device (CPLD); and reading the first temperature value and the compensated second temperature value and controlling heat dissipation of the computer system based on the first temperature value and the compensated second temperature value, by a hardware monitor. In this method, temperature values of different areas are sensed with multiple temperature sensors and are read and modified by the CPLD, thereby allowing temperature compensation for the temperature sensors and addressing the problem of inability to individually compensate for temperature values of different areas.
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公开(公告)号：US20180059747A1
公开(公告)日：2018-03-01
申请号：US15685719
申请日：2017-08-24
发明人： Erick Pfeifer , Kyle Gaede
CPC分类号： G06F1/206 , G01K7/425 , G06F1/3206 , G06F1/325 , G06F2200/201 , H05K7/20209 , H05K7/20836 , Y02D10/16
摘要： Embodiments of the present disclosure include a microcontroller configured to cool an electronic device. The microcontroller is configured to receive a power consumption value of the electronic device, determine, based on the power consumption value and a stored previous power consumption value, a change value representing an amount that power consumption of the electronic device changed from a previous power consumption of the electronic device, determine an output cooling control value based at least in part on the change value, and control an output for cooling the electronic device using the output cooling control value.
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公开(公告)号：US20180011522A1
公开(公告)日：2018-01-11
申请号：US15621333
申请日：2017-06-13
申请人： FUJITSU LIMITED
CPC分类号： G06F1/206 , G06F1/20 , H05K7/20209 , H05K7/20727 , H05K7/20736 , H05K7/20754 , H05K7/20809 , H05K7/20836
摘要： An electronic device is disclosed. The electronic device includes a chassis and at least one plugin unit mounted in the chassis. The plugin unit includes a substrate, a heat receiving member, a radiator, and a heat transfer member. The substrate mounts a first electronic component and a second electronic component having a higher heat release value than the first electronic component. The heat receiving member receives heat by contacting the second electronic component. The radiator is shaped as a duct. The heat transfer member transfers the heat from the heat receiving member to the radiator. The chassis includes a fan that generates air-current inside the radiator and on one or more component mounting surfaces of the substrate.
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公开(公告)号：US20170347501A1
公开(公告)日：2017-11-30
申请号：US15166366
申请日：2016-05-27
CPC分类号： H05K7/20945 , G05B19/05 , H05K7/20209 , H05K7/20909
摘要： In accordance with presently disclosed embodiments, a system and method for controlling the temperature of medium-voltage power electronics assemblies (i.e., medium-voltage drives) is provided. The disclosed system generally includes a medium-voltage drive having one or more cabinets with power electronics devices disposed therein, one or more fans for circulating air through the cabinet to cool the devices, and one or more space heaters disposed in the cabinet. The drive also features temperature sensors used to measure various temperatures of the drive, a controller communicatively coupled to the sensors, and one or more variable frequency drives (VFD) for the fans. The controller may receive measurements regarding the ambient and power device temperatures and apply controls to vary the space heater power and fan speed in response to environmental changes.
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公开(公告)号：US20170310363A1
公开(公告)日：2017-10-26
申请号：US15643235
申请日：2017-07-06
发明人： Changyi Liu , Xudong Fei , Xidong Yao
CPC分类号： H04B3/54 , G06F1/18 , G06F1/203 , G06F1/206 , H04L12/40039 , H05K7/1492 , H05K7/20209
摘要： A communications device is disclosed, the device includes a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.
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公开(公告)号：US20170172016A1
公开(公告)日：2017-06-15
申请号：US15373756
申请日：2016-12-09
发明人： Joon KANG
CPC分类号： H05K7/20972 , G09F9/33 , G09F9/35 , H05K5/0017 , H05K5/0213 , H05K7/20145 , H05K7/202 , H05K7/20209
摘要： An outdoor display apparatus more particularly, to an outdoor display apparatus having a cooling structure. An outdoor display apparatus comprising: a case provided with an inlet and an outlet; a display module disposed inside of the case and provided with a display panel on which an image is displayed; and a heat exchanger configured to perform a heat-exchange by receiving heat from the display module; wherein the heat exchanger comprises a first cooling flow path configured to circulate air around the display module in a first direction; and a second cooling flow path configured to allow air to be introduced from the outside, to perform a heat-exchange with the air in the first cooling flow path, and to be discharged in a second direction.
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公开(公告)号：US20170164515A1
公开(公告)日：2017-06-08
申请号：US15263351
申请日：2016-09-12
发明人： John Lofy , David Marquette
CPC分类号： H05K7/20209 , H02J7/025 , H02J50/10 , H05K7/20136 , H05K7/20145 , H05K7/20845
摘要： In some embodiments, a cooling system for an induction charger includes a thermal conditioning module in fluid communication with an induction charging assembly, which includes a dock and an induction charging module. The dock can be configured to receive a portable electronic device, such as a cell phone, that is configured to accept inductive charging from the induction charging module. The thermal conditioning module can include a fan or other fluid encouraging assembly, ducting, and a thermoelectric device (e.g., a Peltier device). A fluid, such as air, can flow from the fan and across and/or through the thermoelectric device, thereby conditioning the fluid. The conditioned fluid can be provided to the dock to at least partially offset the heat generated by the inductive charging and/or the portable electronic device.
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公开(公告)号：US20170164513A1
公开(公告)日：2017-06-08
申请号：US15268153
申请日：2016-09-16
发明人： John D. Lofy , David Marquette
CPC分类号： H05K7/20209 , H02J7/025 , H02J50/10 , H05K7/20145
摘要： In some embodiments, a cooling system for an inductive charger includes a thermal conditioning assembly in fluid communication with an inductive charging assembly. The inductive charging assembly can include a dock and an inductive charging module. The dock can be configured to receive a portable electronic device, such as a cell phone, that is configured to accept inductive charging from the inductive charging module. The thermal conditioning assembly can include a fluid transfer device and a thermal conditioning module, such as a thermoelectric device. In various embodiments, heat (e.g., heat produced during inductive charging) can be transferred from the inductive charging assembly to the thermal conditioning module and/or to a fluid flow produced by the fluid transfer device, thereby cooling the inductive charging assembly and/or the portable electronic device.
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