Abstract:
Disclosed are representative embodiments of methods, apparatus, and systems for test scheduling and test access in a test compression environment. Clusters of test patterns for testing a plurality of cores in a circuit are formed based on test information that includes compressed test data, corresponding tester channel requirements and correlated cores. The formation of test pattern clusters is followed by tester channel allocation. A best-fit scheme or a balanced-fit scheme may be employed to generate channel allocation information. A test access circuit for dynamic channel allocation can be designed based on the channel allocation information.
Abstract:
A circuit and method is described for automatically testing multiple LDO regulator circuits on an integrated circuit chip independent of an ATE. Each LDO regulator is tested for voltage at a specified current output capability, wherein the output driver transistor is formed by at least two pass transistors, which are each tested for voltage output at a particular current capability. The test results are delivered back to the ATE and for a failed test, the gate voltage of the pass device can be observed through an analog multiplexer to enable debug.
Abstract:
Embodiments of the present invention provide an RF probe for coupling out a probe signal from a transmission line of a circuit. The RF probe includes at least two probe pins having first ends for contacting the circuit and second ends. Furthermore, the RF probe includes a provider for providing a variable impedance at the second ends of the probe pins. The RF probe is configured to provide the probe signal based on a signal propagating along at least one of the probe pins.
Abstract:
A method is provided for dynamically determining measurement uncertainty (MU) of a measurement device for measuring a signal output by a device under test (DUT). The method includes storing characterized test data in a nonvolatile memory in the measurement device, the characterized test data being specific to the measurement device for a plurality of sources of uncertainty; receiving a parameter value of the DUT; measuring the signal output by the DUT and received by the measurement device; and calculating the measurement uncertainty of the measurement device for measuring the received signal using the stored characterized test data and the received parameter value of the DUT.
Abstract:
A method of error correction in automated test equipment (ATE) is presented. The method comprises calibrating the ATE using a calibration board, wherein the calibration board comprises a reference voltage. The calibrating comprises: (a) measuring the reference voltage using a reference channel and each of a plurality of channels in the ATE; (b) recording a series of differential voltage measurement values obtained from the measuring in a calibration module; and (c) calculating a respective correction factor for each of the plurality of channels utilizing the series of differential voltage measurement values. The method further comprises obtaining a measured voltage value for a DUT connected to a first channel in the ATE, wherein the first channel is one of the plurality of channels. Finally, the method comprises correcting the measured voltage value using a respective correction factor for said first channel.
Abstract:
Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
Abstract:
In an embodiment, a memory interface includes integrated circuitry to verify the integrity of the memory interface. The circuitry propagates a test pattern through different paths of the memory interface, and checks the result against a reference value to determine whether the components of the paths are operating within an acceptable tolerance. The memory interface can also communicate with ATE to initiate such tests and return the results to the ATE.
Abstract:
A system for positioning a load including a support column, a drive rail unit coupled to the support column, the drive rail unit moveable relative to the support column, a vertical carriage moveable along the support column, wherein the vertical carriage supports the load, an engagement member which engages the drive rail and which moves along the drive rail, and a motor which applies force to the engagement member, causing the engagement member to move along the drive rail. The motor is coupled to the vertical carriage so that, as the motor applies force to the engagement member, the vertical carriage moves relative to the drive rail unit, the vertical carriage is also moveable with the drive rail unit so that the vertical carriage and the drive rail unit move relative to the support column. A method of positioning a load is also provided.
Abstract:
Provided is a test apparatus that tests a device under test, comprising a test unit that sends and receives signals to and from the device under test; a control apparatus that controls the test unit; and a relay apparatus that relays between the control apparatus and the test unit. The relay apparatus includes a first communicating section that receives a command from the control apparatus to the relay apparatus and transmits the command to the test unit; a second communicating section that receives a return command that is transmitted back to the relay apparatus by the test unit that received the command; and an executing section that executes a process designated by the return command, in response to the second communicating section receiving the return command.
Abstract:
The performance, thermal and power management system is configured to perform DVFS calibration, temperature compensation adjustment, aging calibration, and DC offset calibration in an IC. The initial voltage supplied to the IC maybe set to an initial value which takes chip-to-chip process variations into account and then dynamically adjusted according to temperature variations, DC offset and/or aging effects. Therefore, the performance, thermal and power management system may achieve optimized thermal and power performance of the IC.